Semiconductor structure and method of forming the same
The present application relates to semiconductor structure and forming method comprising: forming substrate, wherein plurality of capacitive contacts are provided in the substrate, plurality of electrically conductive contact pads are provided at surface of the substrate to be correspondingly connected to plurality of capacitive contacts on one-to-one basis, and a space is present between every two adjacent electrically conductive contact pads; forming filling layer that is fully filled in the space; forming stacked structure at the filling layer and surface of the electrically conductive contact pads, wherein the stacked structure includes plurality of supporting layers stacked one-on-another along direction perpendicular to the substrate, the filling layer is in contact with the supporting layer disposed at bottom of the stacked structure, and etching selection ratio between the filling layer and the supporting layer in contact therewith is greater than preset value; and etching the stacked structure to form capacitance hole.
1. A method of forming a semiconductor structure, comprising:
forming a substrate, wherein a plurality of capacitive contacts are provided in the substrate, a plurality of electrically conductive contact pads are provided at a surface of the substrate to be correspondingly connected to a plurality of capacitive contacts on a one to one basis, and a space is present between every two adjacent electrically conductive contact pads;
forming a filling layer that is fully filled in the space;
forming a stacked structure at the filling layer and a surface of the electrically conductive contact pads, wherein the stacked structure includes a plurality of supporting layers stacked one on another along a direction perpendicular to the substrate, the filling layer is in contact with the one supporting layer disposed at a bottom of the stacked structure, and an etching selection ratio between the filling layer and the supporting layer in contact therewith is greater than a preset value; and
etching the stacked structure to form a capacitance hole that runs through the stacked structure and exposes the electrically conductive contact pads.
2. The method of forming a semiconductor structure according to claim 1 , wherein the specific step of forming a filling layer that is fully filled in the space includes:
forming a filling layer that is fully filled in the space and covers the surface of the electrically conductive contact pads; and
removing the filling layer that covers the surface of the electrically conductive contact pads to expose the electrically conductive contact pads.
3. The method of forming a semiconductor structure according to claim 1 , wherein the specific step of exposing the electrically conductive contact pads includes:
employing a chemical mechanical grinding process to remove the filling layer that covers the surface of the electrically conductive contact pads, with the electrically conductive contact pads serving as grind halting layers, to expose the electrically conductive contact pads.
4. The method of forming a semiconductor structure according to claim 1 , wherein the specific step of forming a stacked structure at the filling layer and a surface of the electrically conductive contact pads includes:
forming a first supporting layer at the filling layer and the surface of the electrically conductive contact pads, an etching selection ratio between the filling layer and the first supporting layer being greater than a preset value;
forming a sacrificing layer at a surface of the first supporting layer; and
forming a second supporting layer at a surface of the sacrificing layer.
5. The method of forming a semiconductor structure according to claim 4 , wherein material of the first supporting layer is SiN, and material of the filling layer is one of SiNCH and SiCN or a combination of the two.
6. The method of forming a semiconductor structure according to claim 4 , wherein the specific step of forming a capacitance hole that runs through the stacked structure and exposes the electrically conductive contact pads includes:
etching the stacked structure, with the electrically conductive contact pads and the filling layer serving as halting layers, to form the capacitance hole that runs through the stacked structure and exposes the electrically conductive contact pads.
7. The method of forming a semiconductor structure according to claim 1 , wherein the following step is further included after forming a capacitance hole that runs through the stacked structure and exposes the electrically conductive contact pads:
forming a capacitance column in the capacitance hole, wherein the capacitance column includes a lower electrode layer, a dielectric layer and an upper electrode layer stacked along a radial direction of the capacitance hole, and the lower electrode layer is in contact with the electrically conductive contact pads.
8. The method of forming a semiconductor structure according to claim 1 , wherein the preset value is 3.
9. A semiconductor structure, comprising:
a substrate, wherein a plurality of capacitive contacts are provided in the substrate, and a plurality of electrically conductive contact pads are provided at a surface of the substrate to be correspondingly connected to a plurality of capacitive contacts on a one to one basis;
a filling layer, sandwiched between adjacent electrically conductive contact pads;
a stacked structure, wherein the stacked structure includes a plurality of supporting layers stacked one on another along a direction perpendicular to the substrate, the filling layer is in contact with the one supporting layer disposed at a bottom of the stacked structure, and an etching selection ratio between the filling layer and the supporting layer in contact therewith is greater than a preset value; and
a capacitance hole, running through the stacked structure and exposing the electrically conductive contact pads.
10. The semiconductor structure according to claim 9 , wherein the preset value is 3.
11. The semiconductor structure according to claim 9 , wherein the stacked structure includes a first supporting layer disposed at a surface of the filling layer and a second supporting layer disposed above the first supporting layer, and an etching selection ratio between the filling layer and the first supporting layer is greater than a preset value.
12. The semiconductor structure according to claim 11 , wherein material of the first supporting layer is SiN, and material of the filling layer is one of SiNCH and SiCN or a combination of the two.
13. The semiconductor structure according to claim 9 , wherein a top surface of the filling layer is flush with a top surface of the electrically conductive contact pad.
14. The semiconductor structure according to claim 9 , wherein the electrically conductive contact pads are disposed to be staggered relative to the capacitive contacts correspondingly connected thereto.
15. The semiconductor structure according to claim 9 , further comprising a capacitance column disposed in the capacitance hole, wherein the capacitance column includes a lower electrode layer, a dielectric layer and an upper electrode layer stacked along a radial direction of the capacitance hole, and the lower electrode layer is in contact with the electrically conductive contact pads.