IP Library › Granted Patent US 11,870,141
Granted Patent B2
US 11,870,141 · App. 17/545,408 · Granted Jan 9, 2024

Antenna package and image display device including the same

Inventors: Jong Min Kim (Gyeonggi-do, KR); Chang Jun Maeng (Gyeonggi-do, KR); Gi Taek Oh (Gyeonggi-do, KR)
Assignee: DONGWOO FINE-CHEM CO., LTD.
H01Q1/38H01Q1/22
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Quick Facts
Patent No.
US 11,870,141
App. No.
17/545,408
Granted
Jan 9, 2024
Kind
B2
Abstract

An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, and a flexible circuit board electrically connected to the antenna unit. The flexible circuit board includes a core layer having a first surface and a second surface that face each other, a circuit wiring layer disposed on the first surface of the core layer and including a signal wiring electrically connected to the antenna unit, and a ground layer disposed on the second surface of the core layer to cover the circuit wiring layer in a planar view. The ground layer partially includes a mesh structure.

Claims (26)

1. An antenna package comprising:

an antenna device comprising an antenna dielectric layer and an antenna unit disposed on the antenna dielectric layer; and

a flexible circuit board electrically connected to the antenna unit, wherein the flexible circuit board comprises:

a core layer having a first surface and a second surface that face each other;

a circuit wiring layer disposed on the first surface of the core layer, the circuit wiring layer comprising a signal wiring electrically connected to the antenna unit; and

a ground layer disposed on the second surface of the core layer to cover the circuit wiring layer in a planar view, the ground layer partially including a mesh structure,

wherein at least a portion of the mesh structure of the ground layer does not overlap the antenna dielectric layer in the planar view,

wherein the flexible circuit board has a bonding region bonded to the antenna device, a bending region and a body region, and the bending region is located between the bonding region and the body region,

wherein the ground layer includes a first solid portion disposed on a portion of the core layer in the bonding region, a second solid portion disposed on a portion of the core layer in the body region, and a bending portion disposed on a portion of the core layer in the bending region, and the bending portion includes the mesh structure,

wherein the antenna unit comprises a radiator, a transmission line extending from the radiator, a signal pad connected to one end portion of the transmission line and a ground pad disposed around the signal pad, and

the circuit wiring layer of the flexible circuit board further comprises a ground pattern disposed around one end portion of the signal wiring to overlap the ground pad in the planar view.

2. The antenna package of claim 1 , wherein the bending portion includes a mesh pattern formed of the mesh structure and a solid pattern.

3. The antenna package of claim 2 , wherein the solid pattern overlaps the signal wiring in the planar view.

4. The antenna package of claim 1 , further comprising a via structure penetrating the core layer and connecting the ground pattern and the first solid portion of the ground layer to each other.

5. The antenna package of claim 1 , wherein the antenna device comprises a plurality of antenna units; and

the signal wiring of the circuit wiring layer includes a plurality of signal wirings, each of which independently connected to each of the plurality of antenna units.

6. The antenna package of claim 5 , wherein the signal wiring includes a bent portion, and the bent portion is disposed on a portion of the core layer in the bonding region.

7. The antenna package of claim 6 , wherein the plurality of signal wirings extend in a length direction of the flexible circuit board continuously on the bending region and the body region of the core layer.

8. The antenna package of claim 6 , further comprising an antenna driving integrated circuit chip disposed under the antenna device; and

the flexible circuit board is bent under the antenna device by the bending region to be electrically connected to the antenna driving integrated circuit chip by the body region.

9. The antenna package of claim 8 , further comprising an intermediate circuit board on which the antenna driving integrated circuit chip is mounted, wherein the intermediate circuit board is connected to the body region of the flexible circuit board.

10. An image display device, comprising:

a display panel; and

the antenna package according to claim 1 disposed on the display panel.

11. The image display device of claim 10 , further comprising an antenna driving integrated circuit chip disposed under the display panel,

wherein a portion of the flexible circuit board including the mesh structure in the antenna package is bent to be electrically connected to the antenna driving integrated circuit chip.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2021
From: KIM, JONG MIN; MAENG, CHANG JUN; OH, GI TAEK
To: DONGWOO FINE-CHEM CO., LTD.
Reel/Frame 058336/0203 →
Priority Claims (1)
KR 10-2020-0174205 · Dec 14, 2020 · national
Continuity (1)
Related Publication 20220190469A1 · Jun 16, 2022