IP Library › Granted Patent US 11,875,857
Granted Patent B2
US 11,875,857 · App. 17/576,985 · Granted Jan 16, 2024

Method for programming memory

Inventors: Hong Nie (Shanghai, CN); Jingwei Chen (Shanghai, CN)
Assignee: CHINA FLASH CO., LTD.
G11C16/14G11C16/0408H10B41/30G11C16/0483G11C16/10H01L29/7881
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Quick Facts
Patent No.
US 11,875,857
App. No.
17/576,985
Granted
Jan 16, 2024
Kind
B2
Abstract

A method for programming a memory. The method includes providing a memory structure with a floating gate, and grounding a source of the memory structure; applying voltages to a drain and a bulk, forming an electric field, generating electron-hole pairs, and generating primary electrons, wherein the voltage applied to the bulk is lower than the voltage applied to the drain; making holes accelerate downward under the action of the electric field and collide with the bulk in the memory structure within a predetermined time to generate secondary electrons; applying voltages to a gate and the bulk respectively, where the voltage applied to the bulk is lower than the voltage applied to the gate, to enable the secondary electrons to generate tertiary electrons under the action of an electric field in a vertical direction, and the tertiary electrons are injected into the floating gate to complete a programming operation.

Claims (12)

1. A method for programming a memory, comprising at least:

1) providing a memory structure with a floating gate, and grounding a source of the memory structure;

2) forming an electric field between a drain and a bulk of the memory structure by applying voltages to the drain and the bulk, generating electron-hole pairs, and generating primary electrons, wherein the voltage applied to the bulk is lower than the voltage applied to the drain;

3) making holes accelerate downward under the action of the electric field and collide with the bulk in the memory structure within a predetermined time to generate secondary electrons; and

4) forming a vertical electric field between a gate and the bulk of the memory structure by applying voltages to the gate and the bulk, wherein the voltage applied to the bulk is lower than the voltage applied to the gate, to enable the secondary electrons to further collide with the electron-hole pairs under the action of the vertical electric field to generate tertiary electrons, and the secondary electrons and the tertiary electrons are superimposed and injected into the floating gate of the memory structure to complete a programming operation.

2. The method for programming a memory as in claim 1 , wherein the memory structure comprises an ETOX structure, a 1.5T structure, a 2T structure, or an EEPROM structure.

3. The method for programming a memory as in claim 1 , wherein in step 2), the difference between the voltage applied to the drain and the voltage applied to the bulk is not less than 4 V.

4. The method for programming a memory as in claim 1 , wherein in step 3), the predetermined time is between 10 ns and 100 ns.

5. The method for programming a memory as in claim 1 , wherein in step 4), the difference between the voltage applied to the gate and the voltage applied to the bulk is not less than 7 V.

6. The method for programming a memory as in claim 1 , wherein before step 1), the method further comprises a step of pre-erasing the memory structure to remove residual charges in the floating gate.

7. The method for programming a memory as in claim 6 , wherein a method of the pre-erasing comprises: applying voltages to the gate and the bulk of the memory structure respectively, wherein the voltage applied to the bulk is higher than the voltage applied to the gate.

8. The method for programming a memory as in claim 7 , wherein the difference between the voltage applied to the gate and the voltage applied to the bulk is not less than 10 V.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 16, 2022
From: NIE, HONG; CHEN, JINGWEI
To: CHINA FLASH CO., LTD.
Reel/Frame 058751/0189 →
Priority Claims (1)
CN 202010954474.5 · Sep 11, 2020 · national
Continuity (2)
Continuation In Part 17458186 · Aug 26, 2021
Related Publication 20220139463A1 · May 5, 2022