Liquid-cooled chip

1. System comprising:

an electronic chip formed on top and inside of a semiconductor substrate comprising, one the side of a first surface, at least one active component and, on the side of a second surface opposite to the first surface, at least one channel for the circulation of a liquid intended to cool the chip; and

a block made of an organic material surrounding the chip on all its lateral surfaces, the block comprising at least one second channel for the circulation of a liquid.

2. System according to claim 1 , wherein each first channel is defined by a recess from the second surface of the substrate.

3. System according to claim 2 , wherein each recess has the shape of a straight groove open on the side of the second surface of the substrate.

4. System according to claim 3 , wherein the bottom of each groove is separated from the first surface of the substrate by a distance (D) in the range from 20 μm to 250 μm, preferably from 20 μm to 40 μm.

5. System according to claim 1 , wherein the first channel has, in top view, a coil shape.

6. System according to claim 2 , wherein each recess has the shape of a disk sector laterally bordered with two radial fins.

7. Electronic device comprising:

a system according to claim 1 ; and

a cover located opposite the second surface of the substrate.

8. Device according to claim 7 , wherein the cover forms a space for distributing the liquid into each channel.

9. Device according to claim 7 , wherein the cover comprises a liquid injection port and a liquid discharge port.

10. Device according to claim 9 , wherein each first channel has a first end located close to the liquid injection port and a second end located close to the liquid discharge port.

11. Device according to claim 9 , wherein the liquid injection port and the liquid discharge port form, with respect to a normal to the upper surface of the cover, an angle in the range from 45° to 70°.

12. Device according to claim 7 , wherein the cover is made of an organic material, preferably epoxy resin.

13. Method of manufacturing a device according to claim 7 , comprising the steps of:

depositing an oxide layer on the second surface of the substrate;

etching the oxide layer;

forming the first circulation channel vertically in line with a portion of the second surface of the substrate which is not coated with the oxide layer; and

bonding the cover opposite the second surface of the substrate.

14. Method according to claim 13 , wherein the first circulation channel is formed by reactive ion etching.