Printed circuit board

1. A printed circuit board, comprising:

a plurality of insulating layers;

a plurality of circuit layers disposed on at least one of an interior and an exterior of the plurality of insulating layers;

a reinforcing layer disposed on one surface of the plurality of insulating layers, and having a first opening having a first width and a second opening having a second width, different from the first width; and

first passivation layers respectively disposed on one surface and the other surface of the plurality of insulating layers,

wherein the reinforcing layer is disposed on one of the first passivation layers,

wherein the first and second openings are devoid of any circuit layer, and

wherein an inner wall of the reinforcing layer, provided by the first and second openings, has a step portion.

2. The printed circuit board of claim 1 , wherein at least one of the plurality of insulating layers comprises an insulating resin and a reinforcing material,

wherein the reinforcing layer does not include the reinforcing material.

3. The printed circuit board of claim 1 , wherein the first and second openings include at least some regions thereof which overlap in a stacking direction of the plurality of insulating layers.

4. The printed circuit board of claim 3 , wherein the first width is greater than the second width.

5. The printed circuit board of claim 1 , wherein the one of the first passivation layers comprises a third opening having a third width,

wherein the third width is different from the first and second widths.

6. The printed circuit board of claim 5 , wherein at least a portion of the third opening overlaps the first and second openings in a stacking direction of the plurality of insulating layers,

wherein the third width is smaller than the second width.

7. The printed circuit board of claim 6 , further comprising:

a second passivation layer disposed on the reinforcing layer.

8. The printed circuit board of claim 7 , further comprising:

a metal layer disposed on the reinforcing layer.

9. The printed circuit board of claim 8 , wherein the second passivation layer comprises a fourth opening having a fourth width,

wherein at least a portion of the fourth opening overlaps each of the first to third openings in the stacking direction,

wherein the fourth width is greater than the first to third widths.

10. The printed circuit board of claim 1 , wherein the plurality of circuit layers comprise:

a first circuit layer embedded from the other surface of the plurality of insulating layers; and

a second circuit layer protruding from one surface of the plurality of insulating layers.

11. The printed circuit board of claim 10 , further comprising:

a first electrical connection metal disposed in the first and second openings, and in contact with the second circuit layer;

an electronic component disposed on the other surface of the plurality of insulating layers; and

a second electrical connection metal connecting the electronic component and the second circuit layer.

12. A printed circuit board, comprising:

a plurality of insulating layers;

a plurality of circuit layers disposed on at least one of an interior and an exterior of the plurality of insulating layers;

a first reinforcing layer disposed on one surface of the plurality of insulating layers in a stacking direction of the plurality of insulating layers;

a second reinforcing layer disposed on a surface of the first reinforcing layer, opposite to another surface of the first reinforcing layer closer to the plurality of insulating layers than the surface of the first reinforcing layer in the stacking direction;

a first opening having a first width passing through at least a portion of the first and second reinforcing layers, respectively;

a second opening having a second width, different from the first width, and passing through at least a portion of the first reinforcing layer; and

first passivation layers respectively disposed on one surface and the other surface of the plurality of insulating layers,

wherein the first reinforcing layer is disposed on one of the first passivation layers,

wherein the first and second openings are devoid of any circuit layer.

13. The printed circuit board of claim 12 , wherein at least a portion of the plurality of circuit layers protrude from one surface of the plurality of insulating layers, and

at least the other portion of the plurality of circuit layers are embedded from the other surface of the plurality of insulating layers.

14. The printed circuit board of claim 12 , wherein the first width is greater than the second width,

wherein the first and second openings are connected in the first reinforcing layer.

15. The printed circuit board of claim 12 , wherein an inner wall of the first opening and an inner wall of the second opening have a step portion.

16. The printed circuit board of claim 12 , further comprising:

an electrical connection metal disposed in the first and second openings to be in contact with a portion of the plurality of circuit layers.

17. The printed circuit board of claim 16 , wherein the portion of the plurality of circuit layers protrudes from one of the plurality of insulating layers toward the electrical connection metal.