Dot bonding shoe insole using adhesive resin mixed with hydrophobic nano-silica and manufacturing thereof
A present invention related to a method for manufacturing a dot bonding shoe insole using an adhesive resin containing hydrophobic nano-silica, including: melting adhesive resin made of any one selected from thermoplastic polyurethane (TPU) or ethylene vinyl acetate (EVA) containing hydrophobic nano-silica in the range of 0.2 to 5 phr and applying to the surface of the transfer roller in which the intaglio dot pattern is formed in a mesh shape in the shape of the shoe insole; removing the adhesive resin applied other area than the intaglio dot pattern of the surface of the transfer roller; transferring the adhesive resin applied to the intaglio dot pattern of the surface of the transfer roller to either one of the foam or the fabric; bonding the foam and the fabric by compressing; and cutting a shoe insole shape in a package in which the foam and the fabric are bonded.
1. A dot bonding shoe insole using hydrophobic nano-silica adhesive resin, comprising:
a foam;
a fabric;
a dot pattern adhesive resin layer is sandwiched between the foam and the fabric for bonding the foam and the fabric,
wherein an adhesive resin of the dot pattern adhesive resin layer is selected from any one of thermoplastic polyurethane (TPU), which contains hydrophobic nano-silicas in a range of 0.2 to 5 Parts per Hundred Resin (phr) and ethylene vinyl acetate (EVA), which contains hydrophobic nano-silicas in a range of 0.2 to 5 Parts per Hundred Resin (phr),
wherein the dot pattern adhesive resin layer is in a form of a plurality of dots, and an each of the plurality of dots has a thickness (height) in a range of 10 to 40 μm, a width and a length in a range of 0.05 to 0.3 mm, respectively an interval between the plurality of the dots is in a range of 0.05 to 0.15 mm, and the dot pattern adhesive resin layer is formed in an area in a range of 20 to 60% based on a total surface area of the dot bonding shoe insole.
2. The dot bonding shoe insole of claim 1 , wherein the hydrophobic nano-silica contains any one or more hydrophobic functional groups selected from alkyl, dimethyl, trimethyl, dimethyl siloxane, and methacryl groups on the surface of the nano-silica particles.
3. The dot bonding shoe insole of claim 1 , wherein the hydrophobic forms a nano-silica aggregate of an average of 100˜1200 nm in the dot pattern adhesive resin layer.
4. A dot bonding shoe insole using hydrophobic nano-silica adhesive resin, comprising:
a foam;
a fabric; and
a dot pattern adhesive resin layer is sandwiched between the foam and the fabric for bonding the foam and the fabric,
wherein the dot pattern adhesive resin layer is in a form of a plurality of dots, an each of the plurality of dots has a thickness (height) in a range of 10 to 40 μm, a width and a length in a range of 0.05 to 0.3 mm, respectively, and an interval between the each plurality of the dots is in a range of 0.05 to 0.15 mm.
5. The dot bonding shoe insole of claim 4 , wherein the adhesive resin is the dot pattern adhesive resin layer is formed in an area in a range of 20 to 60% based on the total surface area of the dot bonding shoe insole.
6. The dot bonding shoe insole of claim 4 , wherein the hydrophobic nano-silica contains any one or more hydrophobic functional groups selected from alkyl, dimethyl, trimethyl, dimethyl siloxane, and methacryl groups on the surface of the nano-silica particles.
7. The dot bonding shoe insole of claim 4 , wherein the hydrophobic nano-silicas forms a nano-silica aggregate of an average of 100˜1200 nm in the dot pattern adhesive resin layer.
8. The dot bonding shoe insole of claim 1 , wherein the hydrophobic nano-silica has a primary particle size of 1˜100 nm.
9. The dot bonding shoe insole of claim 4 , wherein the hydrophobic nano-silica has a primary particle size of 1˜100 nm.