Electrostatic chuck device
An electrostatic chuck device includes: an electrostatic chuck part having a sample placing surface on which a sample is placed and having a first electrode for electrostatic attraction; a cooling base part placed on a side opposite to the sample placing surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and an adhesive layer that bonds the electrostatic chuck part and the cooling base part together, in which the electrostatic chuck part has a recess and protrusion on the adhesive layer side, and a sheet resistance value of the first electrode is higher than 1.0Ω/□ and lower than 1.0×10 10 Ω/□.
1. An electrostatic chuck device comprising:
an electrostatic chuck part having a sample placing surface on which a sample is placed and having a first electrode for electrostatic attraction;
a cooling base part placed on a side opposite to the sample placing surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and
an adhesive layer that bonds the electrostatic chuck part and the cooling base part together,
wherein the electrostatic chuck part has a recess on the adhesive layer side,
the cooling base part has a protrusion on the adhesion layer side,
a sheet resistance value of the first electrode is higher than 1.0Ω/□ and lower than 1.0×10 10 Ω/□, and
the adhesion layer is provided along the recess and protrusion.
2. The electrostatic chuck device according to claim 1 , wherein the cooling base part is connected to a high-frequency power source through a matching box which includes a capacitor and a coil.
3. The electrostatic chuck device according to claim 1 , wherein the first electrode is connected to a direct-current power source through a high-frequency cutoff filter.
4. The electrostatic chuck device according to claim 1 , wherein the electrostatic chuck part has a structure installation surface on which an annular structure surrounding a periphery of the sample placing surface is installed, in a recessed portion which is located around the sample placing surface and is recessed from the sample placing surface.
5. The electrostatic chuck device according to claim 4 , wherein a third electrode for electrostatic attraction is provided between the structure installation surface and the cooling base part.
6. The electrostatic chuck device according to claim 5 , wherein a sheet resistance value of the third electrode is higher than 1.0Ω/□ and lower than 1.0×10 10 Ω/□.
7. The electrostatic chuck device according to claim 4 , wherein a fourth electrode is provided between the structure installation surface and the cooling base part, and
the fourth electrode is connected to a high-frequency power source through a matching box which includes a capacitor and a coil, or is grounded through a variable conductor.
8. The electrostatic chuck device according to claim 7 , wherein the fourth electrode is provided in an interior of the electrostatic chuck part or between the electrostatic chuck part and the cooling base part.
9. The electrostatic chuck device according to claim 7 , wherein the fourth electrode straddles the sample placing surface and the structure installation surface in a direction parallel to the sample placing surface.
10. The electrostatic chuck device according to claim 7 , wherein a plurality of the fourth electrodes are provided.