Semiconductor device package and method of manufacturing the same

1. A semiconductor device package, comprising:

a substrate having a first surface and a second surface opposite to the first surface;

a connection structure disposed on the first surface of the substrate;

a package body disposed on the first surface of the substrate, the package body partially covering the connection structure, wherein a portion of the connection structure is exposed by the package body and configured to provide an external interconnection;

a first electronic component disposed on the second surface of the substrate,

wherein the first electronic component is exposed by the package body.

2. The semiconductor device package of claim 1 , wherein a portion of the second surface of the substrate is exposed by the package body.

3. A semiconductor device package, comprising:

a substrate having a first surface and a second surface opposite to the first surface;

a connection structure disposed on the first surface of the substrate;

a package body disposed on the first surface of the substrate, the package body partially covering the connection structure, wherein a portion of the connection structure is exposed by the package body and configured to provide an external interconnection;

a first electronic component disposed on the second surface of the substrate, wherein the connection structure is closer to an edge of the substrate compared with the first electronic component;

an active component disposed on the first surface of the substrate; and

a passive component disposed on the first surface of the substrate and between the active component and the connection structure from a cross-sectional view.

4. A semiconductor device package, comprising:

a substrate having a first surface and a second surface opposite to the first surface;

a connection structure disposed on the first surface of the substrate;

a package body disposed on the first surface of the substrate, the package body partially covering the connection structure, wherein a portion of the connection structure is exposed by the package body and configured to provide an external interconnection;

a first electronic component disposed on the second surface of the substrate; and

a second electronic component disposed on the package body and electrically connected to the portion of the connection structure.

5. The semiconductor device package of claim 4 , wherein the first electronic component is at least partially disposed under the connection structure.

6. The semiconductor device package of claim 4 , wherein a portion of a top surface of the package body is exposed by the second electronic component.

7. The semiconductor device package of claim 4 , wherein the first electronic component is at least partially disposed under the second electronic component.

8. A semiconductor device package, comprising:

a substrate having a first surface and a second surface opposite to the first surface;

a connection structure disposed on the first surface of the substrate;

a package body disposed on the first surface of the substrate, the package body partially covering the connection structure, wherein a portion of the connection structure is exposed by the package body;

a shielding layer disposed at a first side and a second side of the package body and exposing the portion of the connection structure; and

a first electronic component disposed on the second surface of the substrate,

wherein the first electronic component is exposed by the package body.

9. The semiconductor device package of claim 8 , wherein a portion of the second surface of the substrate is exposed by the package body.

10. The semiconductor device package of claim 8 , wherein the shielding layer is further disposed at a third side of the package body different from the first side and the second side of the package body.

11. The semiconductor device package of claim 8 , wherein the shielding layer further covers a lateral surface of the substrate extending between the first surface and the second surface of the substrate.

12. A semiconductor device package, comprising:

a substrate having a first surface and a second surface opposite to the first surface;

a connection structure disposed on the first surface of the substrate;

a package body disposed on the first surface of the substrate, the package body partially covering the connection structure, wherein a portion of the connection structure is exposed by the package body;

a shielding layer disposed at a first side and a second side of the package body and exposing the portion of the connection structure;

a first electronic component disposed on the second surface of the substrate; and

a second electronic component disposed on the package body and electrically connected to the portion of the connection structure.

13. The semiconductor device package of claim 12 , wherein a portion of a top surface of the package body is exposed by the second electronic component.

14. A semiconductor device package, comprising:

a substrate having a first surface and a second surface opposite to the first surface;

a connection structure disposed on the first surface of the substrate;

a package body disposed on the first surface of the substrate, the package body partially covering the connection structure, wherein a portion of the connection structure is exposed by the package body;

a shielding layer disposed at a first side and a second side of the package body and exposing the portion of the connection structure;

a first electronic component disposed on the second surface of the substrate, wherein the first electronic component is at least partially disposed under the connection structure;

an active component disposed on the first surface of the substrate; and

a passive component disposed on the first surface of the substrate and between the active component and the connection structure from a cross-sectional view.