Power conversion device and manufacturing method of power conversion device
A negative-side bus bar 41 includes a capacitor connection portion and first and second negative terminal portions 271 exposed from a resin portion 44 and connected to a DC negative-side terminals 103 of first and second power semiconductor modules 30 . A partition portion 252 b of a case 252 is provided with a protruding portion 281 that protrudes toward a mold bus bar 40 further than an upper surface 257 of the first and second power semiconductor modules 30 and is thermally coupled to the mold bus bar 40 . The projecting portion 281 is disposed between a root portion 275 of an exposed portion where the first negative electrode terminal portion 271 is exposed from the resin portion 44 and a second root portion 275 of an exposed portion where the second negative electrode terminal portion 271 is exposed from the resin portion 44 . In this manner, a spatial distance and a creepage distance between the exposed portion from the resin portion of the mold bus bar and the power semiconductor module are made large and the temperature rise of a capacitor is suppressed.
1. A power conversion device comprising:
a capacitor;
a first power semiconductor module and a second power semiconductor module each having an input terminal or an output terminal protruding from one surface;
a case including a capacitor housing portion that houses the capacitor, a semiconductor module housing portion that houses the first power semiconductor module and the second power semiconductor module, and a partition portion provided between the first power semiconductor module and the second power semiconductor module; and
a connection member in which a resin portion and a connection conductor are integrally provided and which is disposed on the one surface of the first power semiconductor module and the second power semiconductor module, wherein
the connection conductor includes a capacitor connection portion connected to the capacitor, a first terminal portion exposed from the resin portion and connected to the terminal of the first power semiconductor module, and a second terminal portion connected to the terminal of the second power semiconductor module,
the partition portion of the case is provided with a protruding portion that protrudes toward the connection member further than the one surface of the first power semiconductor module and the second power semiconductor module and is thermally coupled to the connection member, and
the protruding portion is thermally coupled to the connection member and disposed between a first root portion of an exposed portion where the first terminal portion is exposed from the resin portion and a second root portion of an exposed portion where the second terminal portion is exposed from the resin portion.
2. The power conversion device according to claim 1 , wherein a space is provided between the one surface of the first power semiconductor module and the second power semiconductor module and the connection member.
3. The power conversion device according to claim 2 , further comprising
a metal member provided on the one surface of the first power semiconductor module and the second power semiconductor module, wherein
the space is provided between the metal member and the connection member.
4. The power conversion device according to claim 1 , wherein
the connection conductor includes a DC positive-side connection conductor and a DC negative-side connection conductor, and
the protruding portion overlaps with a part of the DC positive-side connection conductor or a part of the DC negative-side connection conductor in plan view from above the protruding portion.
5. The power conversion device according to claim 1 , wherein
the connection conductor includes an AC output-side connection conductor, and
the protruding portion overlaps with a part of the AC output-side connection conductor in plan view from above the protruding portion.
6. The power conversion device according to claim 5 , further comprising
a relay AC connection conductor connected to the AC output-side connection conductor, wherein
the relay AC connection conductor is thermally coupled to the case.
7. A manufacturing method of a power conversion device, the manufacturing method comprising:
housing a capacitor in a capacitor housing portion of a case, and housing, on both sides of a partition portion of the case, a first power semiconductor module and a second power semiconductor module each having an input terminal or an output terminal protruding from one surface in a semiconductor module housing portion of the case provided with the partition portion; and
disposing, on the one surface of the first power semiconductor module and the second power semiconductor module, a connection member in which a resin portion and a connection conductor are integrally provided, and the connection conductor has a capacitor connection portion connected to the capacitor and has a first terminal portion exposed from the resin portion and connected to the terminal of the first power semiconductor module and a second terminal portion connected to the terminal of the second power semiconductor module, wherein
the partition portion is provided with a protruding portion that protrudes toward the connection member further than the one surface of the first power semiconductor module and the second power semiconductor module and is thermally coupled to the connection member, and
the disposing the connection member on the one surface of the first power semiconductor module and the second power semiconductor module includes disposing the protruding portion between a first root portion of an exposed portion where the first terminal portion is exposed from the resin portion and a second root portion of an exposed portion where the second terminal portion is exposed from the resin portion, and thermally coupling the protruding portion to the connection member.