Electronic device with connected component carrier and fluid cooling member

1. An electronic device, comprising:

a component carrier comprising a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;

an electronic component on and/or in the stack; and

a cooling member with a fluid cooling unit at least partially therein;

wherein the component carrier and the cooling member are connected by a connection structure,

wherein the cooling member comprises a further component carrier which comprises a further stack comprising at least one further electrically conductive layer structure and/or at least one further electrically insulating layer structure.

2. The electronic device according to claim 1 , wherein the fluid cooling unit comprises a hollow space for accommodating cooling fluid, being at least partially filled with cooling fluid, the hollow space delimited by an at least partially thermally conductive wall at least part of which having an inner surface profile configured for increasing a thermal exchange area between cooling fluid and the at least partially thermally conductive wall.

3. The electronic device according to claim 1 , wherein the connection structure comprises at least one of the group consisting of a solder structure, a sinter structure, and an electrically conductive glue.

4. The electronic device according to claim 1 , wherein the fluid cooling unit is at least partially delimited by a cavity in the further stack.

5. The electronic device according to claim 1 , wherein the connection structure and at least one of the at least one further electrically conductive layer structure partially delimit a cooling fluid accommodating cavity of the cooling unit, wherein said connection structure and said at least one of the at least one further electrically conductive layer structure abut to at least one of the at least one further electrically insulating layer structure with a stepped interface.

6. The electronic device according to claim 1 , wherein the cooling member comprises a metal body with at least one integrally formed fluid guiding structure.

7. The electronic device according to claim 1 , comprising at least one of the following features:

wherein the connection structure is connected to at least one of the at least one electrically conductive layer structure of the component carrier;

wherein the connection structure is electrically decoupled from the electronic component by at least one of the at least one electrically insulating layer structure of the component carrier;

wherein the connection structure partially delimits a cooling fluid accommodating cavity of the fluid cooling unit, wherein the connection structure has a slanted surface portion which partially delimits the cooling fluid accommodating cavity;

wherein at least one of said at least one electrically insulating layer structure has a thermal conductivity of at least 1.4 W/mK is a thermal prepreg and/or comprises ceramic material such as aluminum oxide;

wherein a fluid guiding structure of the cooling member is fully circumferentially delimited by electrically conductive material.

8. The electronic device according to claim 1 , further comprising:

at least one fluid interface member configured for being connected to a fluid conduit in the component carrier and/or in the cooling member for supplying cooling fluid to the fluid cooling unit and/or for draining cooling fluid from the fluid cooling unit.

9. The electronic device according to claim 8 , comprising at least one of the following features:

wherein the at least one fluid interface member is configured for establishing a screw connection with an external tubing;

wherein the at least one fluid interface member is formed at an exterior surface of the component carrier and/or is formed at an exterior surface of the cooling member;

wherein the at least one fluid interface member is formed at a main surface and/or is formed at a sidewall of the electronic device.

10. The electronic device according to claim 1 , comprising at least one of the following features:

wherein one electrically insulating layer structure of the at least one electrically insulating layer structure being located closest to the connection structure has a higher value of the thermal conductivity than all other of the at least one electrically insulating layer structure;

wherein the fluid cooling unit is integrated within the cooling member, or is formed in the cooling member and closed by the component carrier;

wherein the cooling member comprises at least one fluid guiding structure configured to at least partially thermally conductive wall create swirl.

11. The electronic device according to claim 1 , wherein the connection structure comprises thermal interface material which contributes to a heat removal from the electronic component to the cooling unit.

12. The electronic device according to claim 11 , wherein the thermal interface material is thermally conductive and electronically non-conductive.

13. The electronic device according to claim 1 , wherein the connection structure is an annular structure.

14. The electronic device according to claim 1 , wherein the connection structure comprises metal and forms a metallic connection structure.

15. A method of manufacturing an electronic device, the method comprising:

mounting an electronic component on and/or in a stack of a component carrier, the stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;

forming at least part of a fluid cooling unit in a cooling member; and

connecting the component carrier and the cooling member by a connection structure,

wherein the cooling member comprises a further component carrier which comprises a further stack comprising at least one further electrically conductive layer structure and/or at least one further electrically insulating layer structure.

16. The method according to claim 15 , wherein the method comprises connecting the component carrier and the cooling member by a metallic connection structure.

17. The method according to claim 15 , wherein the method comprises connecting the component carrier and the cooling member by a connection structure which contributes to a heat removal from the electronic component to the fluid cooling unit.

18. The method according to claim 15 , wherein the method comprises forming the fluid cooling unit:

as a cavity in a further component carrier which comprises a further stack comprising at least one further electrically conductive layer structure and/or at least one further electrically insulating layer structure; and

by embedding a poorly adhesive structure in the further stack and circumferentially cutting out a piece of the stack which is delimited at a bottom side by the poorly adhesive structure.

19. The method according to claim 15 , wherein the method comprises forming the fluid cooling unit:

as at least one fluid guiding structure integrally formed in a metal body; and

by removing metal material of the metal body after connection with the component carrier to thereby establish a fluid communication from an exterior of the electronic device through the component carrier up to the at least one fluid guiding structure.

20. An electronic device, comprising:

a component carrier comprising a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;

an electronic component on and/or in the stack; and

a cooling member with a fluid cooling unit at least partially therein;

wherein the component carrier and the cooling member are connected by a connection structure,

wherein the fluid cooling unit is formed in the cooling member and closed by the component carrier.