Prepreg and metallic clad laminate
A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.
1. A prepreg, comprising:
a reinforcing material; and
a thermosetting resin layer formed by immersing the reinforcing material in a thermosetting resin composition; wherein the thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers, based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr, the fillers include a granular dielectric filler and a flaky thermal conductive filler, and the flaky thermal conductive filler is boron nitride;
wherein a weight-average molecular weight of the liquid polybutadiene resin ranges from 1000 g/mol to 10000 g/mol, and an external diameter of the flaky thermal conductive filler ranges from 5 μm to 60 μm;
wherein the granular dielectric filler includes a supportive dielectric filler and a filling dielectric filler, a particle size of the supportive dielectric filler ranges from 30 μm to 50 μm, and a particle size of the filling dielectric filler ranges from 5 μm to 20 μm;
wherein the supportive dielectric filler is a mixture of aluminum oxide and silicon dioxide, wherein, in the supportive dielectric filler, a weight proportion of aluminum oxide to silicone dioxide ranges 5:5 to less than 8:2;
wherein the filling dielectric filler is a mixture of aluminum oxide and silicon dioxide, wherein, in the filling dielectric filler, a weight proportion of aluminum oxide to silicone dioxide ranges 2:8 to less than 5:5.
2. The prepreg according to claim 1 , wherein, based on the total weight of the thermosetting resin composition being 100 phr, an amount of the granular dielectric filler ranges from 30 phr to 50 phr, and an amount of the flaky thermal conductive filler ranges from 5 phr to 25 phr.
3. The prepreg according to claim 1 , wherein, based on a total weight of the granular dielectric filler, the granular dielectric filler contains 30 wt % to 70 wt % of aluminum oxide and 30 wt % to 70 wt % of silicon dioxide.
4. The prepreg according to claim 1 , wherein an external diameter of the flaky thermal conductive filler ranges from 25 pin to 60 pin.
5. The prepreg according to claim 1 , wherein a purity of the granular dielectric filler is higher than 99.2%, and a purity of the flaky thermal conductive filler is higher than 99.0%.
6. The prepreg according to claim 1 , wherein the granular dielectric filler is distributed around a periphery of the flaky thermal conductive filler to enable the flaky thermal conductive filler to be in an upright state.
7. A metallic clad laminate, comprising:
a resin substrate including a reinforcing material and a thermosetting resin layer, the thermosetting resin layer being formed by immersing the reinforcing material in a thermosetting resin composition; wherein the thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers, based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr, the fillers include a granular dielectric filler and a flaky thermal conductive filler, and the flaky thermal conductive filler is boron nitride; and
a metal layer disposed on the resin substrate;
wherein a thermal conductivity of the metallic clad laminate ranges from 1.0 W/mK to 2.0 W/mK;
wherein a weight-average molecular weight of the liquid polybutadiene resin ranges from 1000 g/mol to 10000 g/mol, and an external diameter of the flaky thermal conductive filler ranges from 5 μm to 60 μm;
wherein the granular dielectric filler includes a supportive dielectric filler and a filling dielectric filler, a particle size of the supportive dielectric filler ranges from 30 μm to 50 μm, and a particle size of the filling dielectric filler ranges from 5 μm to 20 μm;
wherein the supportive dielectric filler is a mixture of aluminum oxide and silicon dioxide, wherein, in the supportive dielectric filler, a weight proportion of aluminum oxide to silicone dioxide ranges 5:5 to less than 8:2;
wherein the filling dielectric filler is a mixture of aluminum oxide and silicon dioxide, wherein, in the filling dielectric filler, a weight proportion of aluminum oxide to silicone dioxide ranges 2:8 to less than 5:5.
8. The metallic clad laminate according to claim 7 , wherein a dielectric loss of the metallic clad laminate is lower than or equal to 0.002.
9. The prepreg according to claim 1 , wherein, based on a total weight of the thermosetting resin composition being 100 phr, an amount of the polyphenylene ether resin ranges from 20 phr to 40 phr, an amount of the liquid polybutadiene resin ranges from 40 phr to 70 phr, an amount of the crosslinker ranges from 20 phr to 40 phr, and an amount of the fillers ranges from 50 phr to 70 phr.
10. The prepreg according to claim 1 , wherein a thickness of the thermosetting resin layer ranges from 20 μm to 200 μm.
11. The prepreg according to claim 1 , wherein a weight ratio of the granular dielectric filler to the flaky thermal conductive filler ranges from 1.2 to 10.
12. The metallic clad laminate according to claim 7 , wherein the peeling strength of the metallic clad laminate ranges from 5.0 lb/in to 8.0 lb/in.