Rectangular substrate for imprint lithography and making method
A rectangular substrate is prepared by providing a starting rectangular substrate having front and back surfaces and four side surfaces as ground, and pressing a rotary polishing pad perpendicularly against one side surface under a constant pressure, and relatively moving the rotary polishing pad and the substrate parallel to the side surface, for thereby polishing the side surface of the substrate. In the imprint lithography, the rectangular substrate is capable of controlling compression and pattern shape at a high accuracy and thus transferring a complex pattern of fine feature size to a recipient.
1. A rectangular substrate for use in imprint lithography, the substrate having front and back surfaces and four side surfaces, the front surface being engraved with a pattern of protrusions and recessions, and the side surfaces having a flatness of up to 10 μm.
2. The rectangular substrate of claim 1 wherein the angle included between adjoining side surfaces is in a range of 90±0.1°.
3. The rectangular substrate of claim 1 wherein the side surfaces are mirror finished.
4. The rectangular substrate of claim 3 wherein the side surfaces have a surface roughness Ra of 0.01 to 2 nm.
5. The rectangular substrate of claim 1 wherein the back surface is provided with a recess or channel.