Micromechanical sensor device having an ASIC chip integrated into a capping unit and corresponding manufacturing method
A micromechanical sensor device and a corresponding manufacturing method are described. The micromechanical sensor device is fitted with a substrate including a front side and a rear side; a micromechanical sensor chip including a sensor area attached to the front side of the substrate; and a capping unit attached to the front side of the substrate, which is formed at least partially by an ASIC chip. The capping unit surrounds the micromechanical sensor chip in such a way that a cavity closed toward the front side of the substrate is formed between the sensor area of the micromechanical sensor chip and the ASIC chip. A mold package is formed above the capping unit.
1. A micromechanical sensor device, comprising:
a substrate including a front side and a rear side;
a micromechanical sensor chip including a sensor area attached to the front side of the substrate;
a capping unit attached to the front side of the substrate, which is formed at least partially by an ASIC chip, the capping unit surrounding the micromechanical sensor chip in such a way that a cavity closed toward the front side of the substrate is formed between the sensor area of the micromechanical sensor chip and the ASIC chip; and
a mold package formed above the capping unit,
wherein the ASIC chip partially covers the micromechanical sensor chip and includes a recess, which has a u-shaped edge area, which is directly attached to the front side of the substrate, and an open portion of the u-shaped edge area is attached directly to the micromechanical sensor chip.
2. The micromechanical sensor device as recited in claim 1 , wherein the ASIC chip has a trough-like recess, which includes a circumferential ring-shaped edge area, which is attached indirectly or directly to the front side of the substrate.
3. The micromechanical sensor device as recited in claim 1 , wherein the ASIC chip has a planar design and is attached to the front side of the substrate via a ring-shaped spacer unit.
4. The micromechanical sensor device as recited in claim 1 , wherein the ASIC chip partially covers the micromechanical sensor chip and has a planar design and is attached via a u-shaped spacer unit directly to the front side of the substrate, and the ASIC chip is directly attached to the micromechanical sensor chip in an open portion of the u-shaped spacer unit.
5. The micromechanical sensor device as recited in claim 1 , wherein the micromechanical sensor chip is bonded onto the front side of the substrate in a linear and/or punctiform manner.
6. The micromechanical sensor device as recited in claim 1 , wherein the micromechanical sensor chip is a pressure sensor chip.
7. The micromechanical sensor device as recited in claim 1 , wherein the substrate is an line grid array (LGA) substrate.
8. A micromechanical, comprising:
a substrate including a front side and a rear side;
a micromechanical sensor chip including a sensor area attached to the front side of the substrate;
a capping unit attached to the front side of the substrate, which is formed at least partially by an ASIC chip, the capping unit surrounding the micromechanical sensor chip in such a way that a cavity closed toward the front side of the substrate is formed between the sensor area of the micromechanical sensor chip and the ASIC chip; and
a mold package formed above the capping unit,
wherein a through-opening in the substrate forms a media access opening to the cavity toward the rear side of the substrate.
9. The micromechanical sensor device as recited in claim 8 , wherein a microporous diaphragm is attached above the through-opening on the rear side of the substrate.
10. A method for manufacturing a micromechanical sensor device, comprising the following steps:
providing a substrate including a front side and a rear side;
attaching a micromechanical sensor chip including a sensor area to the front side of the substrate;
forming a capping unit attached to the front side of the substrate, which is formed at least partially by an ASIC chip, the capping unit surrounding the micromechanical sensor chip in such a way that a cavity closed toward the front side of the substrate is formed between the sensor area of the micromechanical sensor chip and the ASIC chip; and
forming a mold package above the capping unit,
wherein the ASIC chip partially covers the micromechanical sensor chip and includes a recess, which has a u-shaped edge area, which is directly attached to the front side of the substrate, and an open portion of the u-shaped edge area is attached directly to the micromechanical sensor chip.
11. The method as recited in claim 10 , wherein the ASIC chip includes a trough-like recess, which includes a circumferential ring-shaped edge area, which is attached indirectly or directly to the front side of the substrate.
12. The method as recited in claim 10 , wherein the ASIC chip has a planar design and is attached to the front side of the substrate via a ring-shaped spacer unit.
13. The method as recited in claim 10 , wherein the ASIC chip partially covers the micromechanical sensor chip and has a planar design, and is attached directly to the front side of the substrate via a u-shaped spacer unit, and the ASIC chip is attached directly to the micromechanical sensor chip in an open portion of the u-shaped spacer unit.