Plasma processing apparatus
Provided is a plasma processing apparatus capable of suppressing abnormal discharge. The plasma processing apparatus includes: an upper electrode and a lower electrode which are disposed inside a processing container so as to face each other inside the processing container; and a dielectric shower for gas introduction disposed below the upper electrode, wherein the plasma processing apparatus generates plasma in a space between the upper electrode and the lower electrode. The upper electrode includes: at least one slot configured to introduce VHF waves into the processing container; and a gas flow path provided independently of the at least one slot and in communication with the dielectric shower.
1. A plasma processing apparatus comprising:
an upper electrode and a lower electrode which are disposed inside a processing container so as to face each other inside the processing container; and
a dielectric shower for gas introduction disposed below the upper electrode,
wherein the plasma processing apparatus generates a plasma in a space between the upper electrode and the lower electrode, and
wherein the upper electrode includes:
at least one slot configured to introduce VHF waves into the processing container; and
a gas flow path provided independently of the at least one slot and in communication with the dielectric shower,
wherein the at least one slot includes a plurality of slots and each of the plurality of slots extends in a circumferential direction of the upper electrode, and
wherein the gas flow path is disposed between the slots located adjacent to each other in a radial direction of the upper electrode.
2. The plasma processing apparatus of claim 1 , further comprising:
a gas diffusion plate interposed between the gas flow path and the dielectric shower so as to diffuse a gas in the circumferential direction and the radial direction.
3. The plasma processing apparatus of claim 1 , wherein the gas flow path includes:
a first flow path configured to supply the gas to a central region of the dielectric shower; and
a second flow path configured to supply the gas to a peripheral region of the dielectric shower.
4. The plasma processing apparatus of claim 1 , further comprising: a metal film formed on an upper surface of the dielectric shower.
5. The plasma processing apparatus of claim 1 , wherein
one end of each of the plurality of slots is located radially more outward of the upper electrode than the other end.
6. A plasma processing apparatus comprising:
an upper electrode and a lower electrode which are disposed inside a processing container so as to face each other inside the processing container; and
a dielectric shower for gas introduction disposed below the upper electrode,
wherein the plasma processing apparatus generates a plasma in a space between the upper electrode and the lower electrode, and
wherein the upper electrode includes:
at least one slot configured to introduce VHF waves into the processing container; and
a gas flow path provided independently of the at least one slot and in communication with the dielectric shower,
wherein the at least one slot includes a plurality of slots,
wherein each of the plurality of slots extends in a circumferential direction of the upper electrode,
wherein one end of each of the plurality of slots is located radially more outward of the upper electrode than the other end, and
wherein the gas flow path is disposed between the slots located adjacent to each other in a radial direction of the upper electrode.