Method of manufacturing composite article

1. A method of manufacturing a composite article, comprising:

providing a polishing pad including a rough surface;

providing a semiconductor structure disposed above the polishing pad;

contacting the semiconductor structure with the rough surface of the polishing pad;

rotating the semiconductor structure relative to the polishing pad to generate a semiconductor structure debris peeled off from the semiconductor structure and a polishing pad debris peeled off from the polishing pad;

collecting the polishing pad debris generated during the rotation;

providing a wood material; and

mixing the collected polishing pad debris with the wood material to form the composite article.

2. The method of claim 1 , wherein the semiconductor structure debris includes silicon and is physically separated from the semiconductor structure.

3. The method of claim 1 , wherein the semiconductor structure debris and the polishing pad debris are generated simultaneously during the rotation.

4. The method of claim 1 , wherein a first amount of the polishing pad debris in the composite article is less than a second amount of the wood material in the composite article.

5. The method of claim 4 , wherein a ratio of the first amount to the second amount is about 3:7.

6. The method of claim 1 , wherein the polishing pad debris is physically separated from the polishing pad upon the compression.

7. The method of claim 1 , wherein the polishing pad is rotated upon the rotation of the semiconductor structure.