Electroconductive coating material and method for producing shielded package using said electroconductive coating material

1. A conductive coating material comprising:

100 parts by weight of an epoxy resin-containing binder component (A);

500 to 2500 parts by weight of metal particles (B);

1 to 150 parts by weight of a curing agent (C);

20 to 800 parts by weight of a solvent (D); and

0.5 to 5 parts by weight of a curing catalyst (E), the curing catalyst (E) being an organic metal compound that is at least one selected from the group consisting of iron-2-ethylhexanoate, iron(III) acetylacetonate, zinc 2-ethylhexanoate, zinc naphthenate, and zinc(II) acetylacetonate.

2. The conductive coating material according to claim 1 , wherein the metal particles (B) are at least one selected from the group consisting of silver powder, silver-coated copper powder, and silver-coated copper alloy powder.

3. The conductive coating material according to claim 1 , wherein the curing agent (C) is an isocyanate curing agent.

4. The conductive coating material according to claim 1 , wherein the conductive coating material is used for a shield package.

5. A method of producing a shield package that includes: a package containing electronic components mounted on a substrate and a sealing material sealing the electronic components; and a shielding layer covering the package, the method comprising:

a package forming step of preparing the package containing electronic components sealed therein, including mounting the electronic components on the substrate, applying the sealing material to the substrate, and curing the sealing material;

a conductive coating material applying step of applying the conductive coating material according to claim 1 to the substrate with the package formed thereon;

a shielding layer forming step of forming the shielding layer, including heating the substrate with the conductive coating material applied thereto to cure the conductive coating material; and

a cutting step of cutting the substrate so that the package is separated into individual pieces.

6. The method of producing a shield package according to claim 5 , further comprising, after the package forming step, a package partitioning step of partitioning the package on the substrate with grooves, the step including forming the grooves by carving the sealing material between the electronic components, wherein in the cutting step, the substrate is cut along the grooves.

7. The method of producing a shield package according to claim 5 , wherein the heating in the shielding layer forming step is performed at a temperature of 120° C. to 150° C.