IP Library › Granted Patent US 11,915,079
Granted Patent B2
US 11,915,079 · App. 17/783,063 · Granted Feb 27, 2024

Biometric sensor module for card integration

Inventors: Zhimin Mo (Mölndal, SE); Zhecheng Shao (Gothenburg, SE)
Assignee: Fingerprint Cards Anacatum IP AB
G06K19/0718G06K19/07728G06V40/1306G06V40/1329
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Quick Facts
Patent No.
US 11,915,079
App. No.
17/783,063
Granted
Feb 27, 2024
Kind
B2
Abstract

A biometric sensor module for detecting a biometric feature of a user comprises: a biometric sensor comprising an array of sensing elements for acquiring sensing signals indicative of a biometric feature of a user, the array of sensing elements arranged facing towards a front side of the biometric sensor. Further, the biometric sensor module comprises a bottom flexible film attached to a back side, opposite the front side, of the biometric sensor. The bottom flexible film can carry at least one electrically conductive line electrically connectable to the biometric sensor and electrically connectable to an external electrical circuit. The biometric sensor module further comprises a top film attached to the biometric sensor closer to the front side of the biometric sensor than the bottom flexible film. The flexible film includes a bent portion such that the flexible film is bent towards the top film.

Claims (34)

1. A biometric sensor module for detecting a biometric feature of a user, the biometric sensor module comprising:

a biometric sensor comprising an array of sensing elements for acquiring sensing signals indicative of a biometric feature of a user, the array of sensing elements arranged facing towards a front side of the biometric sensor;

a bottom flexible film attached to a back side, opposite the front side, of the biometric sensor, the bottom flexible film carrying at least one electrically conductive line electrically connectable to the biometric sensor and electrically connectable to an external electrical circuit,

a top film attached to the biometric sensor closer to the front side of the biometric sensor than the bottom flexible film,

wherein the bottom flexible film includes a bent portion such that the bottom flexible film is bent towards the top film, and

wherein the biometric sensor is attached to a first side of the bottom flexible film, the bottom flexible film further carrying at least one electrically conductive pad on a second side opposite the first side, the at least one electrically conductive pad being electrically connected with at least one electrically conductive line.

2. The biometric sensor module according to claim 1 , wherein the bottom flexible film is bent along side-walls of the biometric sensor.

3. The biometric sensor module according to claim 1 , wherein the top film is a top flexible film.

4. The biometric sensor module according to claim 1 , wherein the area of the bottom flexible film exceeds the area of the biometric sensor.

5. The biometric sensor module according to claim 1 , wherein the bottom flexible film is bent towards and attached to the top film.

6. The biometric sensor module according to claim 1 , wherein the at least one electrically conductive pad is adapted to provide the electrical connection to the external electrical circuit.

7. The biometric sensor module according to claim 1 , wherein the at least one electrically conductive line is arranged on the same side of the bottom flexible film as the biometric sensor.

8. The biometric sensor module according to claim 1 , wherein at least one electrically conductive line is arranged on a side of the bottom flexible film opposite the biometric sensor.

9. The biometric sensor module according to claim 1 , wherein a thickness of the biometric sensor module is larger where the biometric sensor is located compared to portions of the biometric sensor module neighboring the biometric sensor and the bent portion of the bottom flexible film.

10. The biometric sensor module according to claim 1 , wherein the electrically conductive lines are electrically connectable to the biometric sensor on the back side of the biometric sensor.

11. The biometric sensor module according to claim 1 , wherein the electrically conductive lines are electrically connectable to the biometric sensor from a side facing towards the front side of the biometric sensor through bonding wires.

12. The biometric sensor module according to claim 1 , wherein the top film is arranged to cover at least a portion of the front side of the biometric sensor.

13. The biometric sensor module according to claim 1 , wherein the biometric sensor is sandwiched between the top film and the bottom flexible film.

14. The biometric sensor module according to claim 1 , wherein the top film is arranged to cover at least a portion of the array of sensing elements on the front side of the biometric sensor.

15. The biometric sensor module according to claim 1 , wherein the top film includes an opening where the biometric sensor is located, wherein side walls of the opening in the top film is attached to side walls of the biometric sensor.

16. The biometric sensor module according to claim 1 , wherein the at least one electrically conductive line is arranged in the bent portion of the bottom flexible film, wherein at least one of the electrically conductive lines is adapted to electrically connect the biometric sensor to the external electrical circuit via the bent portion.

17. A device including the biometric sensor module according to claim 1 , the device comprising a bendable main body carrying the external electrical circuit, wherein the biometric sensor module is arranged in an opening of the device.

18. A method for assembling a biometric sensor module, comprising:

providing a biometric sensor comprising an array of sensing elements for acquiring sensing signals indicative of a biometric feature of a user, the array of sensing elements arranged facing towards a front side of the biometric sensor;

attaching the biometric sensor to a top film at the front side;

attaching a bottom flexible film to a back side, opposite the front side, of the biometric sensor, the bottom flexible film carrying at least one electrically conductive line, wherein the biometric sensor is attached to a first side of the bottom flexible film, the bottom flexible film further carrying at least one electrically conductive pad on a second side opposite the first side, the at least one electrically conductive pad being electrically connected with the at least one electrically conductive line;

forming an electrical connection between at least one electrically conductive line and the biometric sensor,

bending the bottom flexible film towards the top film along sides of the biometric sensor, such that the bottom flexible film is attachable to the top film adjacent to bent portions of the bottom flexible film.

19. A method for assembling a biometric sensor module, comprising:

providing a biometric sensor comprising an array of sensing elements for acquiring sensing signals indicative of a biometric feature of a user, the array of sensing elements arranged facing towards a front side of the biometric sensor;

attaching a bottom flexible film to a back side, opposite the front side, of the biometric sensor, the bottom flexible film carrying at least one electrically conductive line, wherein the biometric sensor is attached to a first side of the bottom flexible film, the bottom flexible film further carrying at least one electrically conductive pad on a second side opposite the first side, the at least one electrically conductive pad being electrically connected with the at least one electrically conductive line;

forming an electrical connection between at least one electrically conductive line and the biometric sensor,

attaching the biometric sensor to a top film closer to the front side of the biometric sensor than the bottom flexible film;

bending the bottom flexible film towards the top film along sides of the biometric sensor, such that the bottom flexible film is attachable to the top film adjacent to bent portions of the bottom flexible film.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2022
From: MO, ZHIMIN; SHAO, ZHECHENG
To: FINGERPRINT CARDS ANACATUM IP AB
Reel/Frame 060120/0218 →
Priority Claims (1)
SE 1951439-7 · Dec 12, 2019 · national
Continuity (1)
Related Publication 20230021212A1 · Jan 19, 2023