Semiconductor device
A semiconductor device according to one or more embodiments may include: on a semiconductor substrate, a high voltage circuit region; a transistor element region; an isolation region that elementally isolates the transistor element region from the high voltage circuit region; and a capacitively coupled field plate including plural lines of conductors, wherein the capacitively coupled field plate is provided to extend circumferentially along an outer circumferential portion of the high voltage circuit region and across the transistor element region, in a plan view of the semiconductor device, and one or more dividing sections divides at least one of the plural lines of conductors in the capacitively coupled field plate to make the at least one line discontinuous.
1. A semiconductor device comprising: on a semiconductor substrate, a high voltage circuit region; a transistor element region; an isolation region that elementally isolates the transistor element region from the high voltage circuit region; and a capacitively coupled field plate including plural lines of conductors, wherein
the capacitively coupled field plate is provided to extend circumferentially along an outer circumferential portion of the high voltage circuit region and across the transistor element region, in a plan view of the semiconductor device, and
one or more dividing sections divides at least one of the plural lines of conductors in the capacitively coupled field plate to make the at least one of the plural lines discontinuous.
2. The semiconductor device according to claim 1 , wherein
in the plan view of the semiconductor device, the one or more dividing sections is provided on a side of the high voltage circuit region with respect to the isolation region.
3. The semiconductor device according to claim 1 , wherein
in the plan view of the semiconductor device, the one or more dividing sections is provided on a side of the transistor element region with respect to the isolation region.
4. The semiconductor device according to claim 1 , wherein
the capacitively coupled field plate includes:
at least one of the plural lines of conductors including a first dividing section of the one or more diving sections that is disposed on a side of the high voltage circuit region with respect to the isolation region in the plan view of the semiconductor device; and
at least one of the plural lines of conductors including a second dividing section of the one or more dividing sections that is disposed on a side of the transistor element region with respect to the isolation region in the plan view of the semiconductor device.
5. The semiconductor device according to claim 1 , wherein
the one or more dividing sections is arranged to overlap with the isolation region in the plan view of the semiconductor device.
6. The semiconductor device according to claim 1 , further comprising
a shield electrode provided on the one or more dividing sections.
7. The semiconductor device according to claim 1 , wherein
the capacitively coupled field plate includes the one or more dividing sections that divides all of the plural lines of conductors.
8. The semiconductor device according to claim 1 , wherein
a RESURF region is located around the high voltage circuit region in the plan view of the semiconductor device.
9. The semiconductor device according to claim 8 , wherein
in the plan view of the semiconductor device, the RESURF region is not located in an area between the high voltage circuit region and the transistor element region.
10. The semiconductor device according to claim 1 , wherein
in the plan view of the semiconductor device, a width of each of the one or more dividing sections is not greater than a width of the isolation region.
11. The semiconductor device according to claim 1 , further comprising
a low voltage circuit region.
12. The semiconductor device according to claim 1 , wherein
the semiconductor substrate has a first conductivity type,
the high voltage circuit region is located in a first semiconductor region of a second conductivity type on the semiconductor substrate,
the transistor element region includes: on the semiconductor substrate, a high voltage side main electrode on a second semiconductor region of the second conductivity type that is separated from the first semiconductor region; a low voltage side main electrode; and a control electrode provided between the high voltage side main electrode and the low voltage side main electrode,
the isolation region is a semiconductor region of the first conductivity type,
the capacitively coupled field plate includes: a first conductor group overlapping with a part of an outer edge of the high voltage circuit region in the plan view of the semiconductor device and including plural lines of conductors being separated from each other and capacitively coupled to each other; and a second conductor group arranged between the control electrode and the high voltage side main electrode of the transistor element region and including plural lines of conductors being separated from each other and capacitively coupled to each other,
one end of the first conductor group is electrically connected to the first semiconductor region, and the other end of the first conductor group is electrically connected to a third semiconductor region of the first conductive type, which is electrically connected to the semiconductor substrate,
one end of the second conductor group is electrically connected to the high voltage side main electrode, and the other end of the second conductor group is electrically connected to the control electrode or the low voltage side main electrode, and
the one or more dividing sections divides one or more of the plural lines of conductors of the first conductor group and one or more of the plural lines of conductors of the second conductor group that are adjacent to the one or more of the plural lines of conductors of the first conductor group.