Dual-sided socket device with corrugation structures
Techniques and mechanisms for coupling packaged devices with a dual-sided socket device. In an embodiment, two interfaces of the socket device comprise, respectively, first metallization structures and second metallization structures on opposite sides of a socket body structure. The first metallization structures each form a respective corrugation structure to electrically couple with a corresponding conductive contact of a first packaged device. The corrugation structures facilitate such electrical coupling each via a vertical wipe of the corresponding conductive contact. In another embodiment, a pitch of the first metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm. One such metallization structure has a vertical span in a range of between 0.05 mm and 2.0 mm, where a portion of a side of the metallization structure forms a corrugation structure, and has a horizontal span which is at least 5% of the vertical span.
1. A socket device comprising:
a socket body structure comprising a first side, and a second side opposite the first side;
a first plurality of metallization structures which each extend vertically from the first side, wherein a pitch of the first plurality of metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm; and
a second plurality of metallization structures which each extend vertically from the second side, the second plurality of metallization structures each electrically coupled to a respective one of the first plurality of metallization structures;
wherein, for each of the first plurality of metallization structures, a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm, a portion of a side of the metallization structure forms a respective corrugation structure, and a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.
2. The socket device of claim 1 , wherein, for each of the first plurality of metallization structures, the portion of the side of the metallization structure forms an angle with a vertical plane, wherein the angle is in a range of between 20° and 80°.
3. The socket device of claim 1 , wherein, for each of the first plurality of metallization structures, the horizontal span of the portion of the side of the metallization structure is at least 10% of the vertical span of the metallization structure.
4. The socket device of claim 1 , wherein, for each of the second plurality of metallization structures:
a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm;
a portion of a side of the metallization structure forms a respective corrugation structure; and
a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.
5. The socket device of claim 1 , wherein the socket body structure forms first recess structures at the first side, wherein the first plurality of metallization structures each extend in a respective one of the first recess structures.
6. The socket device of claim 5 , wherein the socket body structure forms second recess structures at the second side, wherein the second plurality of metallization structures each extend in a respective one of the second recess structures.
7. The socket device of claim 1 , wherein, for each of the first plurality of metallization structures:
the side of the metallization structure includes a first point, a second point, and a third point;
the second point is between the first point and the third point;
the second point is a point of the respective corrugation structure which is most offset horizontally from a line which extends between the first point and the third point; and
a vertical distance between the second point and a distal end of the metallization structure is at least 5% of the vertical span of the metallization structure.
8. A method comprising:
coupling first conductive contacts of a first packaged device each to a respective one of a first plurality of metallization structures which each extend vertically from a first side of a socket body structure of a socket device, wherein a pitch of the first plurality of metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm; and
coupling second conductive contacts of a second packaged device each to a respective one of a second plurality of metallization structures each extending vertically from a second side of the socket body structure, the second plurality of metallization structures each electrically coupled to a respective one of the first plurality of metallization structures;
wherein, for each of the first plurality of metallization structures, a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm, a portion of a side of the metallization structure forms a respective corrugation structure, and a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.
9. The method of claim 8 , further comprising:
communicating signals, each via a respective one of the first plurality of metallization structures and a respective one of the second plurality of metallization structures, between the first packaged device and the second packaged device.
10. The method of claim 8 , wherein, for each of the first plurality of metallization structures, the portion of the side of the metallization structure forms an angle with a vertical plane, wherein the angle is in a range of between 20° and 80°.
11. The method of claim 8 , wherein, for each of the first plurality of metallization structures, the horizontal span of the portion of the side of the metallization structure is at least 10% of the vertical span of the metallization structure.
12. The method of claim 8 , wherein, for each of the second plurality of metallization structures:
a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm;
a portion of a side of the metallization structure forms a respective corrugation structure; and
a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.
13. The method of claim 8 , wherein the socket body structure forms first recess structures at the first side, wherein the first plurality of metallization structures each extend in a respective one of the first recess structures.
14. The method of claim 13 , wherein the socket body structure forms second recess structures at the second side, wherein the second plurality of metallization structures each extend in a respective one of the second recess structures.
15. The method of claim 8 , wherein, for each of the first plurality of metallization structures:
the side of the metallization structure includes a first point, a second point, and a third point;
the second point is between the first point and the third point;
the second point is a point of the respective corrugation structure which is most offset horizontally from a line which extends between the first point and the third point; and
a vertical distance between the second point and a distal end of the metallization structure is at least 5% of the vertical span of the metallization structure.
16. A system comprising:
a first packaged device;
a second packaged device; and
a socket device comprising:
a socket body structure comprising a first side, and a second side opposite the first side, wherein the first packaged device and the second packaged device are coupled to the socket device via the first side and the second side, respectively;
a first plurality of metallization structures which each extend vertically from the first side, wherein a pitch of the first plurality of metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm; and
a second plurality of metallization structures which each extend vertically from the second side, the second plurality of metallization structures each electrically coupled to a respective one of the first plurality of metallization structures;
wherein, for each of the first plurality of metallization structures, a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm, a portion of a side of the metallization structure forms a respective corrugation structure, and a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.
17. The system of claim 16 , wherein, for each of the first plurality of metallization structures, the portion of the side of the metallization structure forms an angle with a vertical plane, wherein the angle is in a range of between 20° and 80°.
18. The system of claim 16 , wherein, for each of the first plurality of metallization structures, the horizontal span of the portion of the side of the metallization structure is at least 10% of the vertical span of the metallization structure.
19. The system of claim 16 , wherein, for each of the second plurality of metallization structures:
a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm;
a portion of a side of the metallization structure forms a respective corrugation structure; and
a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.
20. The system of claim 16 , wherein, for each of the first plurality of metallization structures:
the side of the metallization structure includes a first point, a second point, and a third point;
the second point is between the first point and the third point;
the second point is a point of the respective corrugation structure which is most offset horizontally from a line which extends between the first point and the third point; and
a vertical distance between the second point and a distal end of the metallization structure is at least 5% of the vertical span of the metallization structure.