Package structure and method of manufacturing the same

1. A package structure, comprising:

a package substrate;

a first semiconductor package and a second semiconductor package, electrically bonded to the package substrate;

an underfill material, disposed to fill a first space between the first semiconductor package and the package substrate and a second space between the second semiconductor package and the package substrate;

a gap filling structure, disposed over the package substrate and in a first gap laterally between the first semiconductor package and the second semiconductor package, wherein the gap filling structure is in contact with a sidewall of the first semiconductor package and a sidewall of the second semiconductor package face to each other and the underfill material, while without in contact with another sidewall of the first semiconductor package and another sidewall of the second semiconductor package face away from each other; and

a heat dissipation structure, disposed on the package substrate and attached to the first semiconductor package and the second semiconductor package through a thermal conductive layer.

2. The package structure of claim 1 , wherein the gap filling structure is separated from the package substrate by a portion of the underfill material therebetween.

3. The package structure of claim 1 , wherein the underfill material comprises a first underfill layer filling the first space and a second underfill layer filling the second space that are laterally spaced apart from each other, the gap filling structure lands on a top surface of the package substrate and comprises a portion laterally between the first underfill layer and the second underfill layer.

4. The package structure of claim 1 , wherein a top surface of the gap filling structure is lower than top surfaces of the first semiconductor package and the second semiconductor package, and overlaid by the thermal conductive layer, and a second gap is existed between the top surface of the gap filling structure and the thermal conductive layer.

5. The package structure of claim 1 , wherein

the thermal conductive layer comprises a first partition disposed between a top surface of the first semiconductor package and the heat dissipation structure, and a second partition disposed between a top surface of the second semiconductor package and the heat dissipation structure; and

the gap filling structure is further disposed between the first partition and the second partition of the thermal conductive layer.

6. The method of claim 5 , wherein the top surface of the gap filling structure is in contact with sidewalls of the first partition and the second partition of the thermal conductive layer.

7. The package structure of claim 5 , wherein the top surface of the gap filling structure is in contact with the heat dissipation structure and higher than the top surfaces of the first semiconductor package and the second semiconductor package.

8. The package structure of claim 1 , wherein the thermal conductive layer is a continuous film extending over the first semiconductor package, the second semiconductor package, and the gap filling structure.

9. The package structure of claim 1 , wherein

the heat dissipation structure comprises:

a support component disposed on the package substrate and laterally surrounds the first semiconductor package and the second semiconductor package; and

a lid, disposed on the support component and thermal conductive layer.

10. The package structure of claim 9 , wherein the support component is attached to the package substrate through an adhesive material.

11. A package structure, comprising:

a package substrate;

a plurality of semiconductor packages, disposed on the package substrate and laterally spaced apart from each other, at least one of the plurality of semiconductor packages comprises:

a die electrically bonded to an interposer that is disposed between the die and the package substrate; and

an encapsulant, disposed on the interposer to encapsulate the die;

a gap filling structure, disposed to fill a gap between the plurality of semiconductor packages;

an underfill material, disposed to fill spaces between the semiconductor packages and the package substrate and a space between the gap filling structure and the package substrate;

a thermal conductive laver, disposed on top surfaces of the semiconductor packages; and

a heat dissipation structure, disposed on the package substrate and attached to the semiconductor packages through the thermal conductive layer, wherein the heat dissipation structure comprises:

a support component disposed on the package substrate and laterally surrounds the semiconductor packages, wherein a part of the support component is disposed in the gap serving as the gap filling structure, and the part of the support component is attached to the package substrate through a portion of the underfill material therebetween; and

a lid, disposed on the support component and the thermal conductive laver.

12. The package structure of claim 11 , wherein a modulus of the gap filling structure is less than a modulus of the encapsulant or a modulus of the underfill material.

13. The method of claim 11 , wherein the lid is attached to the support component through an adhesive material.

14. The method of claim 11 , wherein the underfill material is a continuous layer.

15. The package structure of claim 11 , wherein a contact area between the gap filling structure and the thermal conductive layer is less than an area of a top surface of the gap filling structure.

16. The package structure of claim 11 , wherein the gap filling structure is separated from sidewalls of the plurality of semiconductor packages.

17. A method of forming a package structure, comprising:

electrically bonding a first semiconductor package and a second semiconductor package to a package substrate;

forming an underfill material to fill a first space between the first semiconductor package and the package substrate and a second space between the second semiconductor package and the package substrate;

disposing a gap filling structure in a first gap between the first semiconductor package and the second semiconductor package, wherein the gap filling structure is in contact with the underfill material;

forming a thermal conductive layer on the first semiconductor package and the second semiconductor package; and

disposing a heat dissipation structure on the package substrate and the first and second semiconductor packages, wherein the heat dissipation structure is attached to the first and second semiconductor packages through the thermal conductive layer, and wherein a top surface of the gap filling structure is lower than top surfaces of the first semiconductor package and the second semiconductor package, and a second gap is existed between the top surface of the gap filling structure and the thermal conductive layer.

18. The method of claim 17 , wherein the underfill material comprises a first underfill layer filling the first space and a second underfill layer filling the second space that are laterally spaced apart from each other, and

the gap filling structure is formed to fill the first gap before forming the thermal conductive layer to be in contact with sidewalls of the first semiconductor package and the second semiconductor package, a sidewall of the first underfill layer and a sidewall of the second underfill layer.

19. The method of claim 17 , wherein

forming the thermal conductive layer comprises forming a first partition on the first semiconductor package and forming a second partition on the second semiconductor package;

disposing the gap filling structure is performed after forming the thermal conductive layer.

20. The method of claim 17 , wherein the top surface of the gap filling structure is overlaid by the thermal conductive layer.