Patternable die attach materials and processes for patterning
A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.
1. A die assembly, comprising:
a die;
one or more die pads on a first surface of the die; and
a die attach film on the first surface of the die but not along sides of the die, wherein the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die, the one or more openings exposing sidewalls of the one or more die pads, and wherein the die attach film has an uppermost surface above an uppermost surface of the one or more die pads.
2. The die assembly of claim 1 , further comprising one or more die pads attached to a second surface of the die.
3. The die assembly of claim 1 , wherein the one or more openings include one or more channels that contain an underfill material.
4. The die assembly of claim 1 , wherein the one or more openings include one or more channels that contain an underfill material that is different from the die attach film material.
5. The die assembly of claim 1 , wherein the one or more die pads are through silicon via (TSV) backside die pads.
6. The die assembly of claim 1 , wherein the die assembly is surrounded by mold.
7. A system, comprising:
one or more storage components; and
one or more integrated circuit die including a die assembly that includes:
a die in a die mount space;
one or more die pads attached to a first surface of the die; and
a die attach film on the first surface of the die but not along sides of the die, wherein the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die, the one or more openings exposing sidewalls of the one or more die pads, and wherein the die attach film has an uppermost surface above an uppermost surface of the one or more die pads.
8. The system claim 7 , further comprising one or more die pads attached to a second surface of the die.
9. The system of claim 7 , wherein the one or more openings include one or more channels that contain an underfill material.
10. The system of claim 7 , wherein the one or more openings include one or more channels that contain an underfill material that is different from the die attach film material.
11. The system of claim 7 , wherein the one or more die pads are through silicon via (TSV) backside die pads.
12. The system of claim 7 , wherein the die assembly is surrounded by mold.