Electronic device including antenna member for wireless charging

1. An electronic device comprising:

a first circuit board;

at least one passive element or at least one integrated circuit chip including at least one of a processor, memory, and/or a communication module disposed on the first circuit board;

an antenna member disposed to face one surface of the first circuit board;

an electronic module disposed on the first circuit board and adjacent to the at least one passive element or the at least one integrated circuit chip, the electronic module being disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member; and

a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions,

wherein as the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module is configured to supply power using the induced current generated by the antenna member.

2. The electronic device of claim 1 ,

wherein the electronic module includes:

a second circuit board including the contact protrusions protruding from one surface;

a plurality of solder balls disposed on another surface of the second circuit board; and

at least one electronic component disposed on at least one any one surface of the second circuit board, and

wherein the plurality of solder balls are configured to couple the second circuit board to the first circuit board and form an electrical connection between the first circuit board and the second circuit board.

3. The electronic device of claim 2 , wherein the electronic component includes a wireless charging circuit.

4. The electronic device of claim 2 ,

wherein the electronic module further includes an insulating resin layer applied to at least one surface of the second circuit board, and

wherein a portion of the contact protrusions is exposed to an outside of the insulating resin layer.

5. The electronic device of claim 2 , wherein a distance between the first circuit board and the second circuit board is smaller than a height at which the contact protrusions protrude from the second circuit board.

6. The electronic device of claim 2 , wherein the electronic component is disposed on another surface of the second circuit board and is disposed around an area where the plurality of solder balls are disposed in the electronic component.

7. The electronic device of claim 1 , wherein the contact members contact one of the contact protrusions along a direction in which the first circuit board and the antenna member face each other.

8. The electronic device of claim 1 , wherein the contact members contact one of the contact protrusions along a direction crossing a direction in which the first circuit board and the antenna member face each other.

9. The electronic device of claim 1 , further comprising:

a cover member disposed to face the first circuit board, with the antenna member positioned therebetween,

wherein the antenna member is disposed on an inner surface of the cover member.

10. The electronic device of claim 1 ,

wherein the electronic module includes:

a second circuit board including the contact protrusions protruding from one surface,

at least one passive element or at least one first integrated circuit chip disposed on one surface of the second circuit board,

at least one second integrated circuit chip disposed on another surface of the second circuit board,

a plurality of solder balls disposed around an area where the second integrated circuit chip is disposed, on the other surface of the second circuit board, and

an insulating resin layer applied to two opposite surfaces of the second circuit board, and

wherein at least one of the passive element, the first integrated circuit chip, or the second integrated circuit chip is buried in the insulating resin layer, and a portion of the contact protrusions is exposed to an outside of the insulating resin layer.

11. The electronic device of claim 10 , wherein the plurality of solder balls are configured to couple the second circuit board to the first circuit board and form an electrical connection between the first circuit board and the second circuit board.

12. An electronic device comprising:

a housing;

at least one wearing member extending from the housing and configured to enable the housing to be worn on a user's body;

a battery received in the housing;

a first circuit board disposed between any one surface of the housing and the battery;

at least one passive element or at least one integrated circuit chip including at least one of a processor, a memory, and/or a communication module disposed on the first circuit board;

an antenna member disposed to face one surface of the first circuit board;

an electronic module disposed on the first circuit board and adjacent to the at least one passive element or the at least one integrated circuit chip, the electronic module being disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member; and

a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions,

wherein as the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module is configured to supply power or charge the battery using the induced current generated by the antenna member.

13. The electronic device of claim 12 , further comprising:

a display disposed on one surface of the housing and configured to output a screen to a front surface of the electronic device; and

a rear plate disposed on another surface of the housing,

wherein the antenna member is disposed on the rear plate.

14. The electronic device of claim 12 ,

wherein the electronic module includes:

a second circuit board including the contact protrusions protruding from one surface;

a plurality of solder balls disposed on another surface of the second circuit board; and

at least one electronic component disposed on at least one any one surface of the second circuit board, and

wherein the plurality of solder balls are configured to couple the second circuit board to the first circuit board and form an electrical connection between the first circuit board and the second circuit board.

15. The electronic device of claim 14 ,

wherein the electronic module further includes an insulating resin layer applied to at least one surface of the second circuit board, and

wherein a portion of the contact protrusions is exposed to an outside of the insulating resin layer.

16. The electronic device of claim 14 ,

wherein the electronic module further includes:

at least one passive element or at least one first integrated circuit chip disposed on one surface of the second circuit board; and

at least one second integrated circuit chip disposed on another surface of the second circuit board, and

wherein at least one of the first integrated circuit chip and the second integrated circuit chip includes a wireless charging circuit.

17. The electronic device of claim 14 , wherein a distance between the first circuit board and the second circuit board is smaller than a height at which the contact protrusions protrude from the second circuit board.

18. The electronic device of claim 14 , wherein the electronic component is disposed on another surface of the second circuit board and is disposed around an area where the plurality of solder balls are disposed in the electronic component.

19. The electronic device of claim 12 , wherein the contact members contact one of the contact protrusions along a direction in which the first circuit board and the antenna member face each other.

20. The electronic device of claim 12 , wherein the contact members contact one of the contact protrusions along a direction crossing a direction in which the first circuit board and the antenna member face each other.