Circuit board and method for manufacturing circuit board
Provided is a circuit board on which a circuit component is mounted on one side, and a recess is formed at a position corresponding to the circuit component on the other side, and the circuit board includes a first heat conductive member that is provided inside the recess and conducts heat generated by the circuit component.
1. A circuit board on which a circuit component is mounted on one side,
wherein a recess is formed on the other side at a position corresponding to the circuit component, and
the circuit board includes a first heat conductive member that is provided inside the recess and conducts heat generated by the circuit component; and
wherein the circuit component includes a plurality of semiconductor switches, and a number of the recesses is at least the number of the semiconductor switches.
2. The circuit board according to claim 1 , wherein at least a part of the circuit component overlaps the recess in a plan view.
3. The circuit board according to claim 2 , comprising:
a heat dissipation plate provided on the other side,
wherein the first heat conductive member is sealed by the heat dissipation plate and the recess.
4. The circuit board according to claim 2 , wherein the circuit component includes a plurality of semiconductor switches, and
the number of the recesses is at least the number of the semiconductor switches.
5. The circuit board according to claim 2 , wherein the recess is formed by a partitioning wall provided on the other side.
6. The circuit board according to claim 1 , comprising:
a heat dissipation plate provided on the other side,
wherein the first heat conductive member is sealed by the heat dissipation plate and the recess.
7. The circuit board according to claim 6 , wherein the circuit component includes a plurality of semiconductor switches, and the number of the recesses is at least the number of the semiconductor switches.
8. The circuit board according to claim 6 , wherein the recess is formed by a partitioning wall provided on the other side.
9. The circuit board according to claim 1 , wherein the recess is formed by a partitioning wall provided on the other side.
10. The circuit board according to claim 9 , including:
a heat dissipation plate provided on the other side; and
a conductive plate on which a terminal of the circuit component is mounted,
wherein the height of the partitioning wall is set so that a distance between the conductive plate and the heat dissipation plate is a predetermined insulation distance.
11. The circuit board according to claim 10 , wherein a protrusion is formed along the circumferential edge of the other side, and
a second heat conductive member is provided between an inner face of the protrusion and an outer wall face of the partitioning wall.
12. The circuit board according to claim 9 , wherein a protrusion is formed along the circumferential edge of the other side, and
a second heat conductive member is provided between an inner face of the protrusion and an outer wall face of the partitioning wall.
13. A method for manufacturing a circuit board including steps of:
arranging a plurality of conductive plates at a predetermined position of a metal mold, injecting resin into the metal mold to form a holding member having a number of recesses that corresponds to a position of a corresponding number of circuit components to be mounted, while forming the plurality of conductive plates and the holding member in one piece, wherein the circuit component includes a plurality of semiconductor switches, and a number of the recesses is at least the number of the semiconductor switches;
applying a conductive material in a region of the conductive plates on which a terminal of a circuit component is to be mounted;
aligning the terminal of the circuit component with the conductive material and mounting the terminal of the circuit component on the conductive plate,
introducing and heating, in a reflow furnace, the plurality of conductive plates and the holding member formed in one piece in a state where the circuit component is placed, melting the conductive material to solder the terminal of the circuit component to the conductive plate; and
attaching the heat dissipation plate on which a heat conductive member is applied on one side to a surface of the plurality of conductive plates and the holding member formed in one piece, on which the recess is formed.