Optoelectronic package structure and method of manufacturing the same

1. An optoelectronic package structure, comprising: a carrier comprising a first region and a second region adjacent to the first region; an electronic component disposed under the first region of the carrier; a photonic component disposed over the electronic component; a first power supply path in the carrier, wherein the first power supply path electrically connects the electronic component; a processing unit disposed over the second region, wherein the processing unit covers the second region from a top view perspective; and a second power supply path in the carrier and electrically connects the processing unit; wherein the processing unit is disposed adjacent to a first surface of the carrier, and the electronic component is disposed adjacent to a second surface of the carrier opposite to the first surface.

2. The optoelectronic package structure of claim 1 , further comprising a first conductive element and a second conductive element, wherein the first conductive element electrically connects the processing unit and the carrier, the second conductive element electrically connects the electronic component and the carrier, and a pitch of the first conductive element is greater than a pitch of the second conductive element.

3. The optoelectronic package structure of claim 1 , wherein the photonic component and the carrier are physically separated from each other.

4. The optoelectronic package structure of claim 1 , wherein the first region is a peripheral region and the second region is a central region surrounded by the first region.

5. The optoelectronic package structure of claim 4 , wherein the first power supply path passes through a portion of the central region and electrically connects the electronic component.

6. The optoelectronic package structure of claim 1 , wherein the photonic component at least partially overlaps with the electronic component from a top view perspective.

7. The optoelectronic package structure of claim 1 , wherein the second surface of the carrier is between the first surface of the carrier and a third surface of the carrier opposite to the first surface.

8. An optoelectronic package structure, comprising:

a carrier comprising a first region and a second region;

an electronic component at least partially embedded in the first region of the carrier; and

a photonic component disposed over the electronic component;

wherein the electronic component comprises a first side facing the first region of the carrier and the photonic component; and

wherein a first portion of the first side of the electronic component is covered by the carrier, and a second portion of the first side of the electronic component is exposed from the carrier.

9. The optoelectronic package structure of claim of claim 8 , wherein at least a part of the first side of the electronic component electrically connects the carrier, and at least a part of the second portion of the first side of the electronic component electrically connects the photonic component.

10. The optoelectronic package structure of claim 8 , further comprising a processing unit disposed over the carrier, wherein the processing unit at least partially overlaps with the electronic component from a top view perspective.

11. The optoelectronic package structure of claim 8 , wherein the first region comprises a peripheral region and the second region comprises a central region.

12. An optoelectronic package structure, comprising:

a processing unit;

an electronic component; and

a carrier,

wherein the carrier comprises a first path configured to supply power to the processing unit and a second path configured to electrically communicate the processing unit and the electronic component, and wherein a second path is shorter than the first path; and

wherein the processing unit is disposed adjacent to a first surface of the carrier and the electronic component is disposed adjacent to a second surface of the carrier opposite to the first surface.

13. The optoelectronic package structure of claim 12 , wherein the carrier defines a cavity for accommodating the electronic component.

14. The optoelectronic package structure of claim 13 , wherein the cavity is located at a periphery of the carrier, and wherein a portion of the electronic component is exposed from the cavity and electrically connected with a photonic component.