IP Library Granted Patent US 11,930,258
Granted Patent B2
US 11,930,258 · App. 17/785,013 · Granted Mar 12, 2024

Camera module, spacer component, and method for producing camera module

Inventor: Hirofumi Owaki (Kanagawa, JP)
Assignee: Sony Semiconductor Solutions Corporation
H04N23/52H01R12/716H04N23/54H05K1/0209H05K13/0015H01R2201/18H05K2201/042H05K2201/10121H05K2201/1059
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Quick Facts
Patent No.
US 11,930,258
App. No.
17/785,013
Granted
Mar 12, 2024
Kind
B2
Abstract

A camera module according to an embodiment of the present technology includes a first component-mounting board, a second component-mounting board, and a spacer component. The first component-mounting board includes an imaging device. The second component-mounting board is electrically connected to the first component-mounting board. The spacer component is arranged between the first component-mounting board and the second component-mounting board. The spacer component includes a component body that is made of a first insulating material. The component body including a first primary-surface portion that includes a plurality of first reference surfaces including at least three first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces including at least three second reference surfaces, and a component accommodation portion with or without a bottom, the first primary-surface portion being brought into contact with the first component-mounting board, the second primary-surface portion being brought into contact with the second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion.

Claims (40)

1. A camera module, comprising:

a first component-mounting board that includes an imaging device;

a second component-mounting board that is electrically connected to the first component-mounting board; and

a spacer component that is arranged between the first component-mounting board and the second component-mounting board,

the spacer component including a component body that is made of a first insulating material, the component body including a first primary-surface portion that includes a plurality of first reference surfaces including at least three first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces including at least three second reference surfaces, and a component accommodation portion with or without a bottom, the first primary-surface portion being brought into contact with the first component-mounting board, the second primary-surface portion being brought into contact with the second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion.

2. The camera module according to claim 1 , wherein

the plurality of first reference surfaces and the plurality of second reference surfaces are respectively provided to a peripheral edge of the first primary-surface portion and a peripheral edge of the second primary-surface portion.

3. The camera module according to claim 1 , wherein

the component accommodation portion includes a first component-accommodation portion that is a through-hole,

the first component-mounting board further includes a first connector component that is accommodated in the component accommodation portion, and

the second component-mounting board includes a second connector component that is accommodated in the component accommodation portion and connected to the first connector component.

4. The camera module according to claim 1 , wherein

the component body further includes a plurality of engagement protrusions that controls misalignment between the spacer component and the first component-mounting board.

5. The camera module according to claim 4 , wherein

each of the plurality of engagement protrusions includes

a stem portion that is provided to a corresponding one of two side edges of the first primary-surface portion, the two side edges facing each other, and

a claw portion that is provided to a tip of the stem portion, the claw portion being engaged with a surface of the first component-mounting board that is opposite to a surface of the first component-mounting board that faces the spacer component.

6. The camera module according to claim 5 , wherein

the first component-mounting board includes a concave portion that is provided to a corresponding one of two side edges of the first component-mounting board, the stem portion being inserted into the concave portion.

7. The camera module according to claim 1 , wherein

the component accommodation portion further includes a second component-accommodation portion with a bottom, and

the spacer component further includes a covering layer that is made of a second insulating material that is different from the first insulating material, the covering layer forming an inner surface of the second component-accommodation portion.

8. The camera module according to claim 7 , wherein

the second insulating material is a composite material that includes an electromagnetic absorbent material.

9. The camera module according to claim 8 , wherein

the second component-accommodation portion is provided to a portion that faces the imaging device in a thickness direction of the spacer component.

10. The camera module according to claim 7 , wherein

the second insulating material is more highly thermally conductive than the first insulating material.

11. The camera module according to claim 1 , wherein

the spacer component further includes an interlayer connection portion that is provided within the component body, the interlayer connection portion making an electrical connection between the first component-mounting board and the second component-mounting board.

12. The camera module according to claim 1 , further comprising:

a casing that integrally accommodates therein a multilayer body of the first component-mounting board, the spacer component, and the second component-mounting board.

13. A spacer component, comprising

a component body that is made of an insulating material, the component body including a first primary-surface portion that includes a plurality of first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces, and a component accommodation portion with or without a bottom, the first primary-surface portion being brought into contact with a first component-mounting board, the second primary-surface portion being brought into contact with a second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion.

14. A method for producing a camera module, comprising:

providing a spacer component that is made of an insulating material, the spacer component including a first primary-surface portion that includes a plurality of first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces, and a component accommodation portion without a bottom, the first primary-surface portion being brought into contact with a first component-mounting board that includes an imaging device, the second primary-surface portion being brought into contact with a second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion;

arranging the first component-mounting board in snap-fit connection with the spacer component;

placing the first component-mounting board on the plurality of first reference surfaces to cause a first connector component to be accommodated in the component accommodation portion, the first connector component being mounted on the first component-mounting board;

turning the spacer component upside down; and

placing the second component-mounting board on the plurality of second reference surfaces to connect a second connector component to the first connector component in the component accommodation portion, the second connector component being mounted on the second component-mounting board.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 15, 2022
From: OWAKI, HIROFUMI
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 061106/0834 →
Priority Claims (1)
JP 2019-230753 · Dec 20, 2019 · national
Continuity (1)
Related Publication 20230008374A1 · Jan 12, 2023