IP Library › Granted Patent US 11,931,990
Granted Patent B2
US 11,931,990 · App. 17/078,272 · Granted Mar 19, 2024

Composition for sound insulating sheet member, sound insulating sheet member, and sound insulating structure body

Inventors: Haruki Koshitouge (Tokyo, JP); Daichi Okuno (Tokyo, JP)
Assignee: Mitsubishi Chemical Corporation
B32B25/08B32B3/30E04B1/8409E04B1/86B32B2250/02B32B2307/102B32B2307/3065B32B2319/00E04B2001/8419E04B2001/8428
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Quick Facts
Patent No.
US 11,931,990
App. No.
17/078,272
Granted
Mar 19, 2024
Kind
B2
Abstract

Provided is a composition for a sound insulating sheet member, a sound insulating sheet member, and a sound insulating structure body with excellent sound insulating performance. A sound insulating structure body including: a plurality of convex-shaped rubber-elastic resonant portions; and a sheet-like support that supports the resonant portions, wherein the resonant portions have a storage modulus G′ obtained from a composite curve of dynamic viscoelasticity according to ISO 6721-4 of 100 MPa or less at 25° C. and 10 kHz, and the areal density of the support is 1.0 kg/m 2 or less.

Claims (14)

1. A sound insulating structure body comprising: a plurality of convex-shaped rubber-elastic resonant portions; and a sheet-like support that supports the resonant portions, wherein

the resonant portions have a storage modulus G obtained from a composite curve of dynamic viscoelasticity according to ISO 6721-4 of 100 MPa or less at 25° C. and 10 kHz, and

the areal density of the support is 1.0 kg/m 2 or less.

2. The sound insulating structure body according to claim 1 , comprising a sound insulating sheet member including the resonant portions and a rubber-elastic sheet portion on which the resonant portions are provided, wherein

the sound insulating sheet member is layered on the support.

3. The sound insulating structure body according to claim 2 , wherein the sound insulating sheet member is integrally molded.

4. The sound insulating structure body according to claim 1 , wherein the resonant portions have a storage modulus G obtained from a composite curve of dynamic viscoelasticity according to ISO 6721-4 of 1 MPa or more at 25° C. and 10 kHz.

5. The sound insulating structure body according to claim 1 , wherein the resonant portions have a peak temperature of tan 6 obtained by dynamic viscoelasticity measurement according to ISO 6721-4 of 20° C. or less at 1 Hz.

6. The sound insulating structure body according to claim 1 , wherein the resonant portions have a tensile elongation at break at a tensile speed of 5 mm/min of 30% or more in accordance with ISO 527.

7. The sound insulating structure body according to claim 1 wherein the resonant portions have a storage modulus G′ obtained from a composite curve of dynamic viscoelasticity according to ISO 6721-4 of 80 MPa or less at 25° C. and 5 kHz.

8. The sound insulating structure body according to claim 1 , wherein the resonant portions include a photo-curable resin.

9. The sound insulating structure body according to claim 1 , wherein the specific gravity of the plurality of resonant portions is uniform.

10. The sound insulating structure body according to claim 1 , wherein the height of the sound insulating sheet member is from 50 μm to 10 mm.

11. The sound insulating structure body according to claim 1 , wherein the resonant portions have a configuration of a single structure body.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 23, 2020
From: KOSHITOUGE, HARUKI; OKUNO, DAICHI
To: MITSUBISHI CHEMICAL CORPORATION
Reel/Frame 054147/0423 →
Priority Claims (2)
JP 2018-087370 · Apr 27, 2018 · national
JP 2018-087374 · Apr 27, 2018 · national
Continuity (2)
Continuation PCTJP2019017777 · Apr 25, 2019
Related Publication 20210039361A1 · Feb 11, 2021
Cited By (1)
US 12,291,007