Coil electronic component
A coil electronic component includes a support substrate, a coil pattern disposed on the support substrate, an encapsulant encapsulating at least portions of the support substrate and the coil pattern, and external electrodes disposed externally on the encapsulant and connected to the coil pattern. The coil pattern includes a seed layer having a thickness of 1.5 μm or less and a plating layer disposed on the seed layer.
1. A coil electronic component, comprising:
a support substrate;
a coil pattern disposed on the support substrate;
an encapsulant encapsulating at least portions of the support substrate and the coil pattern; and
external electrodes disposed externally on the encapsulant and connected to the coil pattern,
wherein the coil pattern includes a seed layer having a thickness of 1.5 μm or less and a plating layer disposed on the seed layer,
the plating layer includes a first plating layer, having a single-layer structure, disposed on the seed layer, a second plating layer covering the first plating layer, and a third plating layer disposed on an upper surface of the second plating layer, and
a thickness of the first plating layer is larger than the sum of a thickness of the second plating layer and a thickness of the third plating layer, where the thickness of the second plating layer is measured from the upper surface of the second plating layer and an upper surface of the first plating layer.
2. The coil electronic component of claim 1 , wherein the seed layer has a thickness of 0.5 μm or greater and 1.5 μm or less.
3. The coil electronic component of claim 1 , wherein the coil pattern forms a plurality of turns, and turns adjacent to each other are spaced apart from each other by a pitch of 35 μm or less.
4. The coil electronic component of claim 1 , wherein the support substrate has a thickness of 20 μm or greater to 40 μm or less.
5. The coil electronic component of claim 1 , wherein the first plating layer is a pattern plating layer and has a same width as a width of the seed layer.
6. The coil electronic component of claim 1 , wherein the second plating layer covers an upper surface and side surfaces of the first plating layer, and covers side surfaces of the seed layer.
7. The coil electronic component of claim 6 , wherein the second plating layer is an isotropic plating layer.
8. The coil electronic component of claim 1 , wherein the third plating layer is an anisotropic plating layer.
9. The coil electronic component of claim 1 , wherein the encapsulant has a thickness of 0.65 mm or less.
10. The coil electronic component of claim 1 , wherein the seed layer is a Cu layer.
11. A coil electronic component comprising:
a support substrate;
a coil pattern forming a plurality of turns disposed on the support substrate;
an encapsulant extending between adjacent turns of the coil pattern and encapsulating at least portions of the support substrate and the coil pattern; and
external electrodes disposed externally on the encapsulant and connected to the coil pattern,
wherein the coil pattern has a coil pitch distance between an outer side surface of adjacent turns that is 35 μm or less,
the coil pattern has a seed layer and a plating layer disposed on the seed layer,
the plating layer includes a first plating layer, having a single-layer structure, disposed on the seed layer, a second plating layer covering the first plating layer, and a third plating layer disposed on an upper surface of the second plating layer, and
a thickness of the first plating layer is larger than the sum of a thickness of the second plating layer and a thickness of the third plating layer, where the thickness of the second plating layer is measured from the upper surface of the second plating layer and an upper surface of the first plating layer.
12. The coil electronic component of claim 11 , wherein a coil pitch distance between an outer side surface of adjacent turns of the seed layer is 35 μm or less.
13. The coil electronic component of claim 12 , wherein the seed layer has a thickness of 1.5 μm or less.
14. The coil electronic component of claim 11 , wherein the encapsulant includes a cover portion extending from an uppermost surface of the coil pattern to an upper surface of the encapsulant, and a thickness of the cover portion, in a thickness direction orthogonal to a surface of the support substrate having the coil pattern thereon, is smaller than a thickness of the coil pattern in the thickness direction.
15. The coil electronic component of claim 11 , wherein the coil pattern includes first and second coil patterns disposed on opposing surfaces of the support substrate and connected in series by a via extending through the support substrate, and
each of the first and second coil patterns includes the seed layer contacting a respective one of the opposing surfaces of the support substrate and having a thickness of 1.5 μm or less, and the plating layer disposed on the seed layer and having a thickness greater than the seed layer.
16. The coil electronic component of claim 15 , wherein each of the first and second coil patterns includes a plurality of turns, and turns of the first coil pattern overlap with a space between turns of the second coil pattern along a thickness direction orthogonal to the opposing surfaces of the support substrate.
17. The coil electronic component of claim 15 , wherein the encapsulant includes an upper cover portion extending from an uppermost surface of the first coil pattern to an upper surface of the encapsulant, and a lower cover portion extending from an lowermost surface of the second coil pattern to a lower surface of the encapsulant, and
thicknesses of the upper and lower cover portions, in a thickness direction orthogonal to the opposing surfaces of the support substrate, is smaller than thicknesses of the first and second coil patterns in the thickness direction.
18. The coil electronic component of claim 11 , wherein the seed layer has a thickness of 0.5 μm or greater and 1.5 μm or less.