Imaging device and imaging system
An imaging device comprises pixels. The pixel includes first semiconductor regions of a first conductivity type provided in a surface part of a semiconductor substrate and a second semiconductor region of a second conductivity type provided in the surface part of the semiconductor substrate between the first semiconductor regions. The pixel includes: a light-receiving unit in which photodiodes each configured between the second semiconductor region and one of the first semiconductor regions; quenching circuits, each connected to a corresponding one of the first semiconductor regions; and a counter unit connected to each of connection nodes between the first semiconductor regions and the quenching circuits and counts a pulse generated in response to a photon being incident on the light-receiving unit. The second semiconductor region is provided across a deeper part of the semiconductor substrate than the first semiconductor regions.
1. An imaging device comprising:
a plurality of pixels arranged in a plurality of rows and a plurality of columns,
wherein each of the plurality of pixels includes:
a light-receiving unit having a plurality of first semiconductor regions of a first conductivity type provided in a surface part of a semiconductor substrate and a second semiconductor region of a second conductivity type provided in the surface part of the semiconductor substrate between the plurality of first semiconductor regions, a plurality of photodiodes each configured between the second semiconductor region and one of the plurality of first semiconductor regions;
a plurality of quenching circuits, each connected to a corresponding one of the plurality of first semiconductor regions; and
a counter unit connected to each of connection nodes between the plurality of first semiconductor regions and the plurality of quenching circuits, the counter unit counting a pulse generated in response to a photon being incident on the light-receiving unit,
wherein the second semiconductor region is provided across a deeper part of the semiconductor substrate than the plurality of first semiconductor regions.
2. The imaging device according to claim 1 , further comprising:
a plurality of third semiconductor regions of the first conductivity type and having a lower impurity concentration than the plurality of first semiconductor regions, the plurality of third semiconductor regions being provided in the surface part of the semiconductor substrate at positions between the second semiconductor region and the plurality of first semiconductor regions.
3. The imaging device according to claim 2 , wherein the plurality of third semiconductor regions are provided across a deeper part of the semiconductor substrate than the plurality of first semiconductor regions.
4. The imaging device according to claim 1 , further comprising:
a first separating part constituted by a fourth semiconductor region of the second conductivity type provided between the light-receiving units of adjacent ones of the pixels.
5. The imaging device according to claim 1 , further comprising:
a second separating part constituted by a fifth semiconductor region of the second conductivity type having a lower impurity concentration than the second semiconductor region, the second separating part being provided from the second semiconductor region to a second surface part that is on a side of the semiconductor substrate opposite from the surface part.
6. The imaging device according to claim 1 , wherein each of the plurality of pixels further includes one microlens provided on the second surface part that is on the side of the semiconductor substrate opposite from the surface part.
7. The imaging device according to claim 1 , wherein each of the plurality of pixels includes two of the first semiconductor regions arranged adjacent in a first direction, with a center of the light-receiving unit located between the first semiconductor regions when viewed in a plan view.
8. The imaging device according to claim 1 , wherein the plurality of pixels include:
a first pixel including two of the first semiconductor regions arranged adjacent in a first direction, with a center of the light-receiving unit located between the first semiconductor regions when viewed in a plan view; and
a second pixel including two of the first semiconductor regions arranged adjacent in a second direction intersecting with the first direction, with the center located between the first semiconductor regions.
9. The imaging device according to claim 7 , wherein each of the plurality of pixels further includes the first semiconductor regions disposed at the center.
10. The imaging device according to claim 1 , having:
a first driving mode in which a first driving voltage is supplied to the second semiconductor region and a second driving voltage is supplied to each of the plurality of first semiconductor regions via the quenching circuits; and
a second driving mode in which the first driving voltage is supplied to the second semiconductor region and a third driving voltage is supplied only to one first semiconductor region among the plurality of first semiconductor regions.
11. The imaging device according to claim 10 , wherein a potential difference between the third driving voltage and the first driving voltage is greater than a potential difference between the second driving voltage and the first driving voltage.
12. The imaging device according to claim 10 , further comprising:
a focus detection signal generating unit that, in the first driving mode, generates a signal for focus detection on the basis of a count value counted by a counter circuit connected to some of the first semiconductor regions among the plurality of first semiconductor regions and a count value counted by a counter circuit connected to other first semiconductor regions among the plurality of first semiconductor regions.
13. The imaging device according to claim 10 , further comprising:
an image processing unit that, in the second driving mode, generates a signal for image capturing on the basis of a count value counted by a counter circuit connected to the one first semiconductor region.
14. The imaging device according to claim 1 , further comprising:
an image processing unit that generates a signal for image capturing on the basis of a total value of count values counted by counter circuits connected to the plurality of first semiconductor regions.
15. An imaging device in which a plurality of pixels are disposed, wherein each of the plurality of pixels includes:
a microlens;
a first semiconductor region of a first conductivity type having a light-receiving surface on which light is incident via the microlens; and
a plurality of second semiconductor regions of the first conductivity type provided on a surface of the first semiconductor region opposite from the light-receiving surface, the plurality of second semiconductor regions being separated by a semiconductor region of a second conductivity type,
wherein the semiconductor region of the second conductivity type in at least some pixels of the plurality of pixels has a part extending to a predetermined depth of the first semiconductor region, and
wherein the at least some pixels are pixels a wavelength of light mainly detected by which is shorter than for other pixels.
16. An imaging device in which a plurality of pixels are disposed, wherein the plurality of pixels include a plurality of types of pixels having different spectral properties; and
of the plurality of pixels, a potential difference supplied to a first type of pixel is smaller than a potential difference supplied to a second type of pixel a wavelength of light mainly detected by which is shorter than that of the first type of pixel.
17. The imaging device according to claim 16 , wherein the second type of pixel is a pixel a wavelength of light mainly detected by which is shorter than that of the first type of pixel.
18. An imaging device in which a plurality of pixels are disposed, wherein each of the plurality of pixels includes:
a microlens;
a first semiconductor region of a first conductivity type having a light-receiving surface on which light is incident via the microlens; and
a plurality of second semiconductor regions of the first conductivity type provided on a surface of the first semiconductor region opposite from the light-receiving surface, the plurality of second semiconductor regions being separated by a semiconductor region of a second conductivity type,
wherein of the plurality of pixels, an interval of the plurality of second semiconductor regions in a first type of pixel is narrower than an interval of the plurality of second semiconductor regions in a second type of pixel a wavelength of light mainly detected by which is shorter than that of the first type of pixel.
19. An imaging system comprising:
an imaging device; and
a signal processing unit that processes a signal output from the imaging device,
wherein the imaging device comprises:
a plurality of pixels arranged in a plurality of rows and a plurality of columns,
wherein each of the plurality of pixels includes:
a light-receiving unit having a plurality of first semiconductor regions of a first conductivity type provided in a surface part of a semiconductor substrate and a second semiconductor region of a second conductivity type provided in the surface part of the semiconductor substrate between the plurality of first semiconductor regions, a plurality of photodiodes each configured between the second semiconductor region and one of the plurality of first semiconductor regions;
a plurality of quenching circuits, each connected to a corresponding one of the plurality of first semiconductor regions; and
a counter unit connected to each of connection nodes between the plurality of first semiconductor regions and the plurality of quenching circuits, the counter unit counting a pulse generated in response to a photon being incident on the light-receiving unit,
wherein the second semiconductor region is provided across a deeper part of the semiconductor substrate than the plurality of first semiconductor regions.