Semiconductor structure forming method and semiconductor structure
A method of forming a semiconductor structure includes: a substrate is provided, the substrate at least comprising a conducting layer; a bottom supporting layer and a stacking structure being formed on a top surface of the substrate, the stacking structure including a sacrificial layer and a supporting portion that are sequentially stacked and formed; the stacking structure and the bottom supporting layer are partially etched to expose the conducting layer to form a through hole; the supporting portion of a partial width exposed from a sidewall of the through hole is laterally etched to form an air gap; a protective layer filling the air gap is formed; a lower electrode electrically connected with the conducting layer is formed on the sidewall of the through hole and a sidewall of the protective layer; the sacrificial layer is removed.
1. A semiconductor structure, comprising:
a substrate, the substrate at least comprising a conducting layer;
a bottom supporting layer, located at a top surface of the substrate;
a stacking structure, located on a top surface of the bottom supporting layer, the stacking structure comprising a sacrificial layer and a supporting portion that are sequentially stacked and formed;
a through hole, located in the stacking structure and exposing the conducting layer;
a lower electrode, located on a sidewall of the through hole and electrically connected with the conducting layer; and
a protective layer, located between the lower electrode and the supporting portion,
wherein the stacking structure comprises a first stacking structure and a second stacking structure;
the first stacking structure is on the top surface of the bottom supporting layer, and the first stacking structure comprises a first sacrificial layer and a middle supporting portion that are sequentially formed, wherein the middle supporting portion comprises: a first supporting layer, a buffer layer, and a second supporting layer, the first supporting layer and the second supporting layer are on surfaces of two opposing sides of the buffer layer, the first supporting layer is proximal to the substrate, and surfaces, distal from the buffer layer, of the first supporting layer and the second supporting layer are connected with the sacrificial layer;
the second stacking structure is on a top surface of the first stacking structure, and the second stacking structure comprises a second sacrificial layer and a top-layer supporting portion that are sequentially formed; and
the protective layer is between the lower electrode and the middle supporting portion;
wherein materials for the second supporting layer and the first supporting layer comprise silicon carbonitride; a nitrogen content of the second supporting layer is greater than a nitrogen content of the first supporting layer; and a material for the buffer layer comprises silicon nitride.
2. The semiconductor structure of claim 1 , wherein a range of a thickness relationship between the first supporting layer, the buffer layer, and the second supporting layer is
2:1:2<the first supporting layer:the buffer layer:the second supporting layer<10:1:2.
3. The semiconductor structure of claim 2 , wherein
a thickness of the first supporting layer is 4 nm to 20 nm;
a thickness of the buffer layer is 1 nm to 6 nm; and
a thickness of the second supporting layer is 2 nm to 12 nm.
4. A semiconductor structure, comprising:
a substrate, the substrate at least comprising a conducting layer;
a bottom supporting layer, located at a top surface of the substrate;
a stacking structure, located on a top surface of the bottom supporting layer, the stacking structure comprising a sacrificial layer and a supporting portion that are sequentially stacked and formed;
a through hole, located in the stacking structure and exposing the conducting layer;
a lower electrode, located on a sidewall of the through hole and electrically connected with the conducting layer; and
a protective layer, located between the lower electrode and the supporting portion,
wherein the stacking structure comprises a first stacking structure and a second stacking structure;
the first stacking structure is on the top surface of the bottom supporting layer, and the first stacking structure comprises a first sacrificial layer and a middle supporting portion that are sequentially formed, wherein the middle supporting portion comprises: a first supporting layer, a buffer layer, and a second supporting layer, the first supporting layer and the second supporting layer are on surfaces of two opposing sides of the buffer layer, the first supporting layer is proximal to the substrate, and surfaces, distal from the buffer layer, of the first supporting layer and the second supporting layer are connected with the sacrificial layer;
the second stacking structure is on a top surface of the first stacking structure, and the second stacking structure comprises a second sacrificial layer and a top-layer supporting portion that are sequentially formed; and
the protective layer is between the lower electrode and the middle supporting portion; wherein
materials for the second supporting layer and the first supporting layer comprise silicon carbonitride;
a carbon content of the first supporting layer is greater than a carbon content of the second supporting layer; and
a material for the buffer layer comprises silicon nitride.
5. The semiconductor structure of claim 4 , wherein a range of a thickness relationship between the first supporting layer, the buffer layer, and the second supporting layer is
2:1:2<the first supporting layer:the buffer layer:the second supporting layer<10:1:2.
6. The semiconductor structure of claim 5 , wherein
a thickness of the first supporting layer is 4 nm to 20 nm;
a thickness of the buffer layer is 1 nm to 6 nm; and
a thickness of the second supporting layer is 2 nm to 12 nm.