IP Library Granted Patent US 11,935,974
Granted Patent B2
US 11,935,974 · App. 17/293,403 · Granted Mar 19, 2024

Semiconductor material, infrared light receiving element and method for producing semiconductor material

Inventors: Haruhiko Udono (Hitachi, JP); Toshiaki Asahi (Tokyo, JP)
Assignees: IBARAKI UNIVERSITY; JX METALS CORPORATION
H01L31/032C30B29/52H01L31/18
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Quick Facts
Patent No.
US 11,935,974
App. No.
17/293,403
Granted
Mar 19, 2024
Kind
B2
Abstract

Provided is a semiconductor material having improved oxidation resistance. The semiconductor material has a single crystal represented by the following composition formula: Mg 2 Sn·Zn a   Composition formula: in which, a is a Zn content of from 0.05 to 1 at % relative to Mg 2 Sn.

Claims (16)

1. A semiconductor material, the semiconductor material having a single crystal represented by the following composition formula:

Mg 2 Sn·Zn a   Composition formula:

in which, a is a Zn content of from 0.05 to 1 at % relative to Mg 2 Sn.

2. The semiconductor material according to claim 1 , wherein a is from 0.1 to 0.5 at % in the formula.

3. An infrared light receiving element comprising the semiconductor material according to claim 1 .

4. A method for producing the semiconductor material according to claim 1 , comprising doping with Zn in a raw material preparation step and/or a synthesis step.

5. The method for producing the semiconductor material according to claim 4 , wherein the method carries out either:

a direct melting method for filling a reaction vessel with a raw material obtained in the raw material preparation step, heating the raw material at a temperature more than or equal to a melting point of a product to cause synthesis, and then cooling it after the synthesis to obtain the product; or

an inert gas atmosphere pressure melting method for heating and melting the raw material in a pressurized reaction vessel filled with the raw material to cause synthesis, and then cooling it after the synthesis to obtain a product.

6. The method for producing the semiconductor material according to claim 4 , wherein the method carries out a solid-liquid melting method for filling the reaction vessel with the raw material obtained in the raw material preparation step, heating the raw material at a temperature less than or equal to a melting point of Mg 2 Sn to cause solid-liquid synthesis, and cooling it after the synthesis to obtain a product, and then optionally sintering the product.

7. The method for producing the semiconductor material according to claim 1 , wherein the semiconductor material is produced by a direct melting method having the following steps (1) to (5):

(1) a raw material preparation step of preparing a particulate raw material comprising Mg, Sn and Zn;

(2) a raw material filling step of filling a reaction vessel with the raw material prepared in the step (1);

(3) a synthesis step of heating the entire reaction vessel to cause a melting chemical reaction;

(4) a step of cooling a melt produced in the step (3) to deposit a Mg 2 Sn·Zn a single crystal; and

(5) a step of removing the Mg 2 Sn·Zna single crystal deposited in the step (4) from the reaction vessel.

Assignments (2)
CHANGE OF NAME Recorded Dec 20, 2023
From: JX NIPPON MINING & METALS CORPORATION
To: JX METALS CORPORATION
Reel/Frame 066253/0657 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2021
From: UDONO, HARUHIKO; ASAHI, TOSHIAKI
To: IBARAKI UNIVERSITY; JX NIPPON MINING & METALS CORPORATION
Reel/Frame 056233/0450 →
Priority Claims (1)
JP 2018-213281 · Nov 13, 2018 · national
Continuity (1)
Related Publication 20220013675A1 · Jan 13, 2022