Headphones and headphone systems
Some headphone systems include two ear cups, a headband assembly, an interface system and a control system. Each ear cup may include an ear cup enclosure, an ear pad assembly, a speaker system and a hinge assembly. The hinge assembly may be disposed within the ear cup enclosure such that it is not visible from outside the ear cup. The headband assembly may connect with each of the ear cups via the hinge assembly. The interface system may include at least one interface and a plurality of input source buttons disposed on at least one of the ear cups. Each of the input source buttons may be configured for selecting a source of audio data received via the at least one interface. The control system may be configured for controlling the speaker system to reproduce audio data received via the interface and selected by one of the input source buttons.
1. A headphone system, comprising:
two ear cups, each ear cup comprising:
an ear cup enclosure including a first portion of flexible material that encloses a support structure and overmold foam disposed on the support structure;
an ear pad assembly, wherein a second portion of flexible material encloses ear pad foam of the ear pad assembly;
an ear pad assembly;
a hinge assembly;
a rear air volume between a first side of the speaker system and the ear cup enclosure;
a front air volume proximate a second side of the speaker system and proximate the ear pad assembly;
at least one vent disposed between an exterior of the ear cup and either the front air volume or the rear air volume, the at least one vent including an acoustic low-pass filter; and
a speaker system including at least one speaker; and
a headband assembly configured for connecting with each of the ear cups, via the hinge assembly.
2. The headphone system of claim 1 , wherein the at least one vent includes:
a first vent between the exterior of the ear cup and the front air volume; and
a second vent between the exterior of the ear cup and the rear air volume, wherein the first vent and the second vent each include an acoustic low-pass filter.
3. The headphone system of claim 1 , wherein the acoustic low-pass filter comprises at least one expansion chamber.
4. The headphone system of claim 1 , wherein the rear air volume is between 1 and 20 cubic centimeters.
5. The headphone system of claim 1 , wherein the acoustic low-pass filter is configured to attenuate higher-frequency sounds produced by air flowing through the at least one vent.
6. The headphone system of claim 1 , wherein the ear cup enclosure comprises a single piece of flexible material that encloses the ear cup.
7. The headphone system of claim 1 , wherein the ear pad assembly comprises an ear pad support structure proximate the ear pad foam.
8. The headphone system of claim 7 , wherein the ear pad support structure defines an angle between the ear pad assembly and the ear cup enclosure.
9. The headphone system of claim 1 , further comprising at least one of an adhesive layer or a fastener for joining the first portion and the second portion.
10. The headphone system of claim 1 , wherein both the ear pad foam and the overmold foam are compressed when the ear cups are worn.
11. The headphone system of claim 1 , wherein at least a portion of each ear pad assembly is within a corresponding ear cup enclosure when the ear cups are worn.
12. A headphone system, comprising:
two ear cups, each ear cup comprising:
an ear cup enclosure including a first portion of flexible material that encloses a support structure and overmold foam disposed on the support structure;
an ear pad assembly, wherein a second portion of flexible material encloses ear pad foam of the ear pad assembly;
a hinge assembly; and
a speaker system including at least one speaker; and
a headband assembly configured for connecting with each of the ear cups, via the hinge assembly.
13. The headphone system of claim 12 , wherein each ear cup further comprises a rear air volume between a first side of the speaker system and the ear cup enclosure.
14. The headphone system of claim 13 , wherein each ear cup further comprises a front air volume proximate a second side of the speaker system and proximate the ear pad assembly.
15. The headphone system of claim 14 , wherein each ear cup further comprises at least one vent disposed between an exterior of the ear cup and either the front air volume or the rear air volume, the at least one vent including an acoustic low-pass filter.
16. The headphone system of claim 15 , wherein the acoustic low-pass filter comprises at least one expansion chamber.
17. The headphone system of claim 15 , wherein the at least one vent includes a first vent between the exterior of the ear cup and the front air volume.
18. The headphone system of claim 17 , wherein the at least one vent includes a second vent between the exterior of the ear cup and the rear air volume.
19. The headphone system of claim 18 , wherein the first vent and the second vent each include an acoustic low-pass filter.
20. The headphone system of claim 12 , wherein the ear pad assembly comprises an ear pad support structure proximate the ear pad foam.
21. The headphone system of claim 20 , wherein the ear pad support structure defines an angle between the ear pad assembly and the ear cup enclosure.
22. The headphone system of claim 12 , wherein both the ear pad foam and the overmold foam are compressed when the ear cups are worn.
23. The headphone system of claim 12 , wherein at least a portion of each ear pad assembly is within a corresponding ear cup enclosure when the ear cups are worn.
24. The headphone system of claim 12 , wherein the ear cup enclosure comprises a single piece of flexible material that encloses the ear cup.