Method for manufacturing a substrate structure with high reflectance
A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.
1. A method for manufacturing a substrate structure with high reflectance, comprising:
providing a base material;
forming a first patterned circuit layer and a second patterned circuit layer on a first surface and a second surface of the base material;
providing a first insulation layer and a metal reflection layer on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer; and
forming a first ink layer on the first insulation layer before the metal reflection layer is formed.
2. The method for manufacturing the substrate structure with high reflectance as claimed in claim 1 , wherein the method of forming the metal reflection layer comprises sputtering, evaporation, electroless plating, electroplating, chemical displacement reaction or silver mirror reaction.
3. The method for manufacturing the substrate structure with high reflectance as claimed in claim 1 , wherein the method of forming the first ink layer comprises screen printing, jet printing, spray coating or film attaching.
4. The method for manufacturing the substrate structure with high reflectance as claimed in claim 1 , further comprising:
forming a second insulation layer on the second patterned circuit layer.
5. The method for manufacturing the substrate structure with high reflectance as claimed in claim 4 , further comprising:
forming a second ink layer on the second insulation layer.
6. The method for manufacturing the substrate structure with high reflectance as claimed in claim 5 , wherein the method of forming the second ink layer comprises screen printing, jet printing, spray coating or film attaching.