IP Library › Granted Patent US 11,937,399
Granted Patent B2
US 11,937,399 · App. 17/839,721 · Granted Mar 19, 2024

Server, liquid cooling device and cold plate assembly

Inventors: Shuai Zhang (Shanghai, CN); Zhao Geng (Shanghai, CN); Fanpu He (Shanghai, CN)
Assignees: SQ TECHNOLOGY(SHANGHAI) CORPORATION; INVENTEC CORPORATION
H05K7/20254H05K7/20727H05K7/20772F28F3/12H05K7/20272
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Quick Facts
Patent No.
US 11,937,399
App. No.
17/839,721
Granted
Mar 19, 2024
Kind
B2
Abstract

A liquid cooling device includes first cold plates, second cold plates, a water divider, a first inlet pipe, a first outlet pipe, first connection pipes, second inlet pipes, second outlet pipes, second connection pipes. The water divider has inner inlet connectors and inner outlet connectors. The first inlet pipe connects one inner inlet connector and one first cold plate. The first outlet pipe connects one inner outlet connector and another one first cold plate. The first connection pipes each connect different two of the other first cold plates. The second inlet pipes respectively connect the other inner inlet connectors and some second cold plates. The second outlet pipes respectively connect the other inner outlet connectors and some second cold plates. The second connection pipes each connect different two second cold plates.

Claims (30)

1. A liquid cooling device, comprising:

a plurality of first cold plates, each having a first fluid inlet and a first fluid outlet;

a plurality of second cold plates, each having a second fluid inlet and a second fluid outlet;

a water divider, having an outer inlet connector, an outer outlet connector, a plurality of inner inlet connectors, and a plurality of inner outlet connectors, wherein the plurality of inner inlet connectors are in fluid communication with the outer inlet connector, and the plurality of inner outlet connectors are in fluid communication with the outer outlet connector;

a first inlet pipe, connecting one of the plurality of inner inlet connectors and the first fluid inlet of one of the plurality of first cold plates;

a first outlet pipe, connecting one of the plurality of inner outlet connectors and the first fluid outlet of another one of the plurality of first cold plates;

a plurality of first connection pipes, each connecting the first fluid inlet and the first fluid outlet of different two of the others of the plurality of first cold plates;

a plurality of second inlet pipes, respectively connecting the others of the plurality of inner inlet connectors and the second fluid inlets of some of the plurality of second cold plates;

a plurality of second outlet pipes, respectively connecting the others of the plurality of inner outlet connectors and the second fluid outlets of some of the plurality of second cold plates; and

a plurality of second connection pipes, each connecting the second fluid inlet and the second fluid outlet of different two of the others of the plurality of second cold plates.

2. The liquid cooling device according to claim 1 , wherein the plurality of first cold plates comprises six first cold plates, and the six first cold plates are arranged along a straight line.

3. The liquid cooling device according to claim 2 , wherein the plurality of second cold plates comprises eight second cold plates, and the eight second cold plates are arranged in an array of 2×4.

4. A server, comprising:

a casing;

a motherboard, disposed on the casing;

a plurality of graphics chips, disposed in the motherboard;

a plurality of bridge chips, disposed on the motherboard and connected to the plurality of graphics chips; and

a liquid cooling device, disposed in the casing, the liquid cooling device comprising:

a plurality of first cold plates, respectively and thermally coupled to the plurality of bridge chips and each having a first fluid inlet and a first fluid outlet;

a plurality of second cold plates, respectively and thermally coupled to the plurality of graphics chips and each having a second fluid inlet and a second fluid outlet;

a water divider, having an outer inlet connector, an outer outlet connector, a plurality of inner inlet connectors, and a plurality of inner outlet connectors, wherein the plurality of inner inlet connectors are in fluid communication with the outer inlet connector, and the plurality of inner outlet connectors are in fluid communication with the outer outlet connector;

a first inlet pipe, connecting one of the plurality of inner inlet connectors and the first fluid inlet of one of the plurality of first cold plates;

a first outlet pipe, connecting one of the plurality of inner outlet connectors and the first fluid outlet of another one of the plurality of first cold plates;

a plurality of first connection pipes, each connecting the first fluid inlet and the first fluid outlet of different two of the others of the plurality of first cold plates;

a plurality of second inlet pipes, respectively connecting the others of the plurality of inner inlet connectors and the second fluid inlets of some of the plurality of second cold plates;

a plurality of second outlet pipes, respectively connecting the others of the plurality of inner outlet connectors and the second fluid outlets of some of the plurality of second cold plates; and

a plurality of second connection pipes, each connecting the second fluid inlet and the second fluid outlet of different two of the others of the plurality of second cold plates.

5. The server according to claim 4 , wherein the plurality of first cold plates comprises six first cold plates, and the six first cold plates are arranged along a straight line.

6. The server according to claim 5 , wherein the plurality of second cold plates comprises eight second cold plates, and the eight second cold plates are arranged in an array of 2×4.

7. The server according to claim 4 , further comprising a fan assembly, wherein the fan assembly is disposed in the casing and is configured to generate an airflow towards the motherboard.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2022
From: ZHANG, SHUAI; GENG, ZHAO; HE, FANPU
To: SQ TECHNOLOGY(SHANGHAI) CORPORATION; INVENTEC CORPORATION
Reel/Frame 060365/0847 →
Priority Claims (1)
CN 202210188950.6 · Feb 28, 2022 · national
Continuity (1)
Related Publication 20230276599A1 · Aug 31, 2023
Cited By (2)
US 12,238,889 US 12,349,312