Microelectronic assemblies having conductive structures with different thicknesses
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a substrate layer having a surface; a first conductive trace having a first thickness on the surface of the substrate layer; and a second conductive trace having a second thickness on the surface of the substrate layer, wherein the second thickness is different from the first thickness. In some embodiments, the first conductive trace and the second conductive trace have rectangular cross-sections.
1. A microelectronic assembly, comprising:
a substrate;
a first rectilinear conductive trace, having a first thickness and a first width, in the substrate; and
a second rectilinear conductive trace, having a second thickness and a second width, in the substrate, wherein:
the first and second rectilinear conductive traces each have straight top, bottom, and side surfaces, wherein the side surfaces are at a 90 degree angle to the top and bottom surfaces;
the bottom surface of the second rectilinear conductive trace is coplanar with the bottom surface of the first rectilinear conductive trace;
the first thickness is greater than the second thickness and the first width is greater than the second width;
the first thickness is between 4 microns (um) and 70 um and the second thickness is between 1 um and 35 um;
the first rectilinear conductive trace is electrically coupled to a power plane; and
the second rectilinear conductive trace is electrically coupled to a data signal or a data transmission line.
2. The microelectronic assembly of claim 1 , wherein the first width is between 5 um and 50 millimeters (mm) and the second width is between 1 um and 75 um.
3. The microelectronic assembly of claim 1 , wherein the first and second rectilinear conductive traces have rectangular cross-sections.
4. The microelectronic assembly of claim 1 , wherein the substrate is a package substrate.
5. A microelectronic assembly, comprising:
a package substrate having a layer;
a first conductive feature having a first thickness and a first width in the layer of the package substrate, wherein the first conductive feature is rectilinear; and
a second conductive feature having a second thickness and a second width in the layer of the package substrate, wherein:
the first and second conductive features each have straight top, bottom, and side surfaces, wherein the side surfaces are at a 90 degree angle to the top and bottom surfaces;
the bottom surface of the second conductive feature is coplanar with the bottom surface of the first conductive feature;
the second conductive feature is rectilinear, wherein the first thickness is greater than the second thickness and the first width is greater than the second width, and wherein the first thickness is between 4 microns (um) and 70 um and the second thickness is between 1 um and 35 um;
the first conductive feature is electrically coupled to a power plane; and
the second conductive feature is electrically coupled to a data signal or a data transmission line.
6. The microelectronic assembly of claim 5 , further comprising:
a die electrically coupled to the package substrate.
7. The microelectronic assembly of claim 5 , wherein the first width is between 5 um and 50 millimeters (mm) and the second width is between 1 um and 75 um.
8. The microelectronic assembly of claim 6 , wherein the die is a central processing unit, a radio frequency chip, a power converter, or a network processor.
9. The microelectronic assembly of claim 6 , wherein the first conductive feature is electrically coupled to the die by conductive pathways in the package substrate.
10. The microelectronic assembly of claim 9 , wherein the second conductive feature is electrically coupled to the die by conductive pathways in the package substrate.
11. A method of manufacturing a microelectronic assembly, comprising:
depositing and patterning a first photoresist layer on a substrate to form one or more openings;
forming a first conductive layer in the one or more openings to form a first conductive trace having a first thickness and a first width, wherein the first conductive trace is rectilinear having a straight top, bottom, and side surfaces, wherein the side surfaces are at a 90 degree angle to the top and bottom surfaces;
electrically coupling the first conductive trace to a power plane;
depositing and patterning a second photoresist layer on the first photoresist layer to cover one or more of the one or more openings;
forming a second conductive layer in the one or more openings not covered by the second photoresist layer to form a second conductive trace having a second thickness and a second width, wherein the second conductive trace is rectilinear having a straight top, bottom, and side surfaces, wherein the side surfaces are at a 90 degree angle to the top and bottom surfaces, wherein the first thickness is greater than the second thickness and the first width is greater than the second width, and wherein the first thickness is between 4 microns (um) and 70 um and the second thickness is between 1 um and 35 um; and
electrically coupling the second conductive trace to a data signal or a data transmission line.
12. The method of claim 11 , wherein the first width is between 5 um and 50 millimeters (mm) and the second width is between 1 um and 75 um.
13. The method of claim 11 , further comprising:
removing the first and second photoresist layers;
forming a dielectric layer on the first and second conductive traces;
laser drilling an opening in the dielectric layer; and
depositing conductive material in the opening to form a via, wherein the via is coupled to an individual first conductive trace.
14. A microelectronic assembly, comprising:
a substrate;
a first rectilinear conductive trace, having a first thickness and a first width, in the substrate; and
a second rectilinear conductive trace, having a second thickness and a second width, in the substrate, wherein:
the first and second rectilinear conductive traces each have straight top, bottom, and side surfaces, wherein the side surfaces are at a 90 degree angle to the top and bottom surfaces;
the bottom surface of the second rectilinear conductive trace is coplanar with the bottom surface of the first rectilinear conductive trace;
the first thickness is greater than the second thickness and the first width is greater than the second width;
wherein the first width is between 5 um and 50 millimeters (mm) and the second width is between 1 um and 75 um;
the first rectilinear conductive trace is electrically coupled to a power plane; and
the second rectilinear conductive trace is electrically coupled to a data signal or a data transmission line.
15. The microelectronic assembly of claim 14 , wherein the first and second rectilinear conductive traces have rectangular cross-sections.
16. The microelectronic assembly of claim 14 , wherein the substrate is a package substrate.
17. A microelectronic assembly, comprising:
a package substrate having a layer;
a first conductive feature having a first thickness and a first width in the layer of the package substrate, wherein the first conductive feature is rectilinear; and
a second conductive feature having a second thickness and a second width in the layer of the package substrate, wherein:
the first and second conductive features each have straight top, bottom, and side surfaces, wherein the side surfaces are at a 90 degree angle to the top and bottom surfaces;
the bottom surface of the second conductive feature is coplanar with the bottom surface of the first conductive feature;
the second conductive feature is rectilinear, wherein the first thickness is greater than the second thickness and the first width is greater than the second width, and wherein the first width is between 5 um and 50 millimeters (mm) and the second width is between 1 um and 75 um;
the first conductive feature is electrically coupled to a power plane; and
the second conductive feature is electrically coupled to a data signal or a data transmission line.
18. The microelectronic assembly of claim 17 , further comprising:
a die electrically coupled to the package substrate.
19. The microelectronic assembly of claim 18 , wherein the die is a central processing unit, a radio frequency chip, a power converter, or a network processor.
20. The microelectronic assembly of claim 18 , wherein the first conductive feature and the second conductive feature are electrically coupled to the die by conductive pathways in the package substrate.