Stacking arrays and separator bodies during processing of component carriers on array level

1. A method of processing component carriers, comprising:

providing a plurality of arrays each comprising a plurality of component carriers;

providing a plurality of separator bodies;

forming an alternating stack of the arrays and the separator bodies so that each adjacent pair of stacked arrays is spaced by a respective separator body; and

carrying out at least one process using the stack,

wherein the separator bodies are separator sheets and the separator sheets have a thickness in a range between 30 μm and 100 μm.

2. The method according to claim 1 , wherein the method comprises performing the at least one process while the arrays remain stacked with the separator bodies in between.

3. The method according to claim 2 , further comprising: baking the stack.

4. The method according to claim 3 , wherein the method comprises baking the stack in an oven at a temperature of at least 200° C.

5. The method according to claim 1 , wherein the method comprises handling the stack for transferring the stack between subsequent processes.

6. The method according to claim 1 , wherein the method comprises maintaining the stack between subsequent processes and individually picking each array from the stack for carrying out at least one of said subsequent processes with the respective picked array.

7. The method according to claim 6 , wherein said at least one subsequent process carried out with an individually picked array comprises carrying out a functional test.

8. The method according to claim 6 , wherein said at least one subsequent process carried out with an individually picked array comprises carrying out an inspection.

9. The method according to claim 6 , wherein said at least one subsequent process carried out with an individually picked array comprises marking a defective array or a defective component carrier of the array.

10. The method according to claim 6 , wherein said at least one subsequent process carried out with an individually picked array comprises cleaning the stack.

11. The method according to claim 6 , wherein the method comprises forming again an alternating stack of the arrays and the separator bodies after said at least one subsequent process carried out with individually picked arrays, so that each adjacent pair of stacked arrays is again spaced by a respective separator body.

12. The method according to claim 1 , wherein the method comprises providing the separator bodies and the arrays so that a main surface area of each separator body is equal to a main surface area of each array.

13. The method according to claim 1

wherein the method comprises forming a line/space ratio of the component carriers manufactured based on the arrays smaller than 30 μm.

14. The method according to claim 1 , comprising at least one of the following features:

wherein the method comprises reusing or disposing the separator bodies;

wherein the method comprises carrying out unstacking and re-stacking the stack of the arrays and the separator bodies between subsequent processes.

15. The method according to claim 1 , comprising at least one of the following features:

wherein the component carriers comprise at least one electrically conductive layer structure which comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, titanium, palladium, and tungsten;

wherein the component carriers comprise at least one electrically insulating layer structure which comprises at least one of the group consisting of reinforced or non-reinforced resin, epoxy resin or Bismaleimide-Triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based build-up material, polytetrafluoroethylene, a ceramic, and a metal oxide;

wherein the component carriers are shaped as a plate;

wherein the component carriers are configured as one of the group consisting of a printed circuit board, and a substrate, or a preform thereof;

wherein the component carrier is configured as a laminate-type component carrier.

16. The method according to claim 1 , wherein the separator sheets:

are temperature stable at least up to 300° C.;

have a surface roughness Ra below 3 μm; and

are non-adhesive with respect to foreign particles.

17. The method according to claim 16 , comprising at least one of the following features:

wherein the separator sheets comprise paper;

wherein the separator sheets are sulphur-free;

wherein the separator sheets have a surface roughness Ra below 2 μm;

wherein the separator sheets have a surface roughness Rz below 20 μm;

wherein the separator sheets have a thickness in a range between 50 μm and 80 μm;

wherein the separator sheets comprise at least one material of the group consisting of an electrostatic discharge control material, ultra-high molecular weight polyethylene, polyoxymethylene, silicon, polyethylene terephthalate, and polyetheretherketone;

wherein the separator sheets are configured to protect the arrays against at least one of the group consisting of vibration, mechanical shock, and humidity;

wherein the separator sheets comprise at least one hole for supporting vacuum suction of an adjacent array.

18. The method according to claim 16 , wherein the method comprises automatically handling an alternating stack of said separator sheets and said arrays without touching by a human operator.