IP Library › Granted Patent US 11,944,965
Granted Patent B2
US 11,944,965 · App. 16/880,247 · Granted Apr 2, 2024

Microfluidic device

Inventors: Giuseppe Fiorentino (Etterbeek, BE); Simone Severi (Leuven, BE); Aurelie Humbert (Schaarbeek, BE)
Assignee: Imec vzw
B01L3/502715B01L3/502707B29C65/02B81C1/00119B01L2200/10B01L2300/0838B01L2300/0887B81C2201/013B81C2203/03B81C2203/031B81C2203/036
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Quick Facts
Patent No.
US 11,944,965
App. No.
16/880,247
Granted
Apr 2, 2024
Kind
B2
Abstract

A microfluidic device, a diagnostic device including the microfluidic device and a method for making the microfluidic device are provided. The microfluidic device includes: (i) a transparent substrate comprising a cavity, the cavity opening up to a top of the transparent substrate; (ii) a transparent layer covering the cavity, and (iii) a semiconductor substrate over the transparent layer and the transparent substrate, wherein the semiconductor substrate comprises a through hole overlaying the cavity and exposing the transparent layer.

Claims (14)

1. A method for making a microfluidic device, the method comprising:

(a) providing a transparent substrate comprising a cavity, the cavity opening up to a top of the transparent substrate;

(b) providing a semiconductor substrate;

(c) forming, over the transparent substrate, a transparent layer covering the cavity;

(d) after step (c), bonding the transparent substrate to the semiconductor substrate by anodic bonding in such a way that the transparent layer is present between the semiconductor substrate and the transparent substrate; and

(e) etching a through hole through the semiconductor substrate to expose the transparent layer covering the cavity.

2. The method according to claim 1 , wherein step c comprises patterning the transparent layer.

3. The method according to claim 1 , wherein step (c) comprises transferring the transparent layer from an auxiliary substrate to the transparent substrate.

4. The method according to claim 1 , wherein the semiconductor substrate comprises a microfluidic channel and wherein step d comprises bonding the semiconductor substrate to the transparent layer in such a way that the microfluidic channel is fluidically coupled to the cavity.

5. The method according to claim 1 , wherein the semiconductor substrate comprises silicon.

6. The method according to claim 1 , wherein the transparent substrate comprises glass.

7. The method according to claim 1 , wherein the transparent layer comprises a polymer, a silicon nitride or a silicon oxide.

8. The method according to claim 1 , wherein the microfluidic device comprises a microfluidic channel fluidically coupled to the cavity.

9. The method according to claim 8 , wherein the microfluidic channel is a capillary microfluidic channel.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2020
From: FIORENTINO, GIUSEPPE; SEVERI, SIMONE; HUMBERT, AURELIE
To: IMEC VZW
Reel/Frame 052854/0599 →
Priority Claims (1)
EP 19183221 · Jun 28, 2019 · regional
Continuity (1)
Related Publication 20200406255A1 · Dec 31, 2020