Method for removing linear objects, device for removing linear objects, and method for processing electronic/electrical equipment component waste

1. A method for removing linear objects comprising:

arranging a plurality of filters in a vibrating sieve machine such that the filters are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters comprising a plurality of rods extending at distances in the feed direction of the raw material and a beam portion supporting the plurality of rods at one ends of the plurality of the rods, the other ends of the plurality of the rods being free ends;

arranging a guide below a tip of one of the filters located on a most downstream side in the feed direction;

feeding the raw material containing at least linear objects and plate-form objects into the vibrating sieve machine; and

sorting the linear objects and the plate-form objects by vibrating the filters, sieving the linear objects to an under-sieve side of the vibrating sieve machine, and capturing lumpy linear objects with the guide.

2. The method for removing the linear objects according to claim 1 , wherein the step of sorting the linear objects and the plate-form objects comprises capturing the lumpy linear objects with the guide provided below the tip of the one of the filters, the guide comprising a plurality of rods extending at distances in the feed direction and a beam portion supporting the rods, and wherein the lumpy linear objects are captured on the rods of the guide and the plate-form objects are dropped from between the rods of the guide.

3. The method for removing the linear objects according to claim 1 , wherein a distance of the rods of the guide is from 5 to 50 times a distance of the rods of the filters, and a length of the rods of the guide along the feed direction is 100 to 600 mm.

4. The method for removing the linear objects according to claim 1 , comprising pressing the raw material provided on one of the filters and the guide from above by means of a pressing member made of elastic material, the pressing member having one end fixed to a feeding side of the vibrating sieve machine and other end being free at a discharge side of the raw material.

5. The method for removing the linear objects according to claim 1 , wherein the raw material is electronic/electrical equipment component waste, and wherein the plate-form objects contain substrate scrap, and the linear objects contain wire scrap.

6. A method for processing electronic/electrical equipment component waste comprising:

arranging a plurality of filters in a vibrating sieve machine such that the filters are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters comprising a plurality of rods extending at distances in the feed direction of the raw material and a beam portion supporting the plurality of rods at one ends of the plurality of the rods, the other ends of the plurality of the rods being free ends;

arranging a guide below a tip of one of the filters located on a most downstream side in the feed direction;

feeding the raw material containing at least substrate scraps and wire scraps into the vibrating sieve machine; and

sorting the substrate scraps and the wire scraps by vibrating the filters, sieving the wire scraps to an under-sieve side of the vibrating sieve machine, and capturing lumpy wire scraps with the guide.

7. A device for removing linear objects comprising:

a vibrating sieve machine;

a plurality of filters in a vibrating sieve machine such that the filters are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters comprising a plurality of rods extending at distances in the feed direction of the raw material and a beam portion supporting the plurality of rods at one ends of the plurality of the rods, the other ends of the plurality of the rods being free ends;

a vibrator configured to vibrate the filters to sieve the linear objects contained in a raw material to an under-sieve side, the raw material containing at least the linear objects and plate-form objects; and

a guide provided at a discharge port of the vibrating sieve machine and configured to sort lumpy linear objects and the plate-form objects by holding the lumpy linear objects thereon.

8. The device for removing the linear objects according to claim 7 , wherein the guide comprises a plurality of rods extending at distances in the feed direction and a beam portion supporting the rods, and wherein the lumpy linear objects are captured on the rods of the guide and the plate-form objects are dropped from between the rods of the guide.

9. The device for removing the linear objects according to claim 7 , a distance of the rods of the guide is from 5 to 50 times a distance of the rods of the filters, and a length of the rods of the guide along the feed direction is 100 to 600 mm.

10. The device for removing the linear objects according to claim 7 , further comprising a pressing member configured to press the raw material from above of the filters, the pressing member made of elastic material and having one end fixed to a feeding side of the vibrating sieve machine and other end being free at a discharge side of the raw material.

11. The device for removing the linear objects according to claim 7 , wherein the raw material is electronic/electrical equipment component waste, and wherein the plate-form objects contain substrate scrap, and the linear objects contain wire scrap.