Electro-optical circuit board for contacting photonic integrated circuits

1. A system, comprising:

an electro-optical circuit board, comprising:

an electrical conductor track extending between first and second sides of the electro-optical circuit board; and

an optical beam path extending between the first and second sides of the electro-optical circuit board; and

an optical testing device, comprising:

a light source; and

a scanning device,

wherein:

the optical testing device is configured to drive the light source and the scanning device so that when the optical testing device drives the light source and the scanning device: i) the light source emits a light beam; and ii) the scanning device varies a location of the light beam on a first side of the electro-optical circuit board;

the electrical conductor track is configured to contact an electrical interface of a photonic integrated circuit adjacent the second side of the electrical conductor track; and

the optical beam path is configured to contact an optical interface of the photonic integrated circuit adjacent the second side of the electrical conductor track.

2. The system of claim 1 , wherein the optical testing device is configured to drive the scanning device to vary the position the light beam with respect to a plurality of optical coupling points on the first side of the electro-optical circuit board.

3. The system of claim 1 , wherein the optical testing device is configured to drive the scanning device to position the light beam within an optical coupling point on the first side of the electro-optical circuit board.

4. The system of claim 3 , wherein the optical testing device is configured to drive the scanning device to position the light beam within the optical coupling point with a search pattern that varies the location of the light beam on the first side of the electro-optical circuit board.

5. The system of claim 1 , wherein the optical beam path has an aperture that is larger than a cross section of the light beam.

6. The system of claim 1 , wherein:

the scanning device comprises at least one member selected from the group consisting of a moveable scanner mirror and a spatial light modulator; and

when the optical testing device drives the light source and the scanning device, the optical testing device moves the at least one member so to vary the location of the light beam on the first side of the electro-optical circuit board.

7. The system of claim 1 , wherein:

the scanning device comprises at least one member selected from the group consisting of a lens in the optical beam path and a deflection element in the optical beam path; and

when the optical testing device drives the light source and the scanning device, the optical testing device moves the at least one member to vary the location of the light beam on the first side of the electro-optical circuit board.

8. The system of claim 7 , wherein:

the electro-optical circuit board comprises a layer structure; and

the at least one member is embedded in the layer structure.

9. The system of claim 7 , wherein:

the electro-optical circuit board comprises a layer structure;

the at least one member is supported by an outer surface of the layer structure; and

the at least one member extends away from the layer structure.

10. The system of claim 1 , wherein:

the electro-optical circuit board comprises a layer structure comprising a metallic layer and an optically transparent layer; and

the optically transparent layer defines a waveguide in the optical beam path.

11. The system of claim 1 , wherein:

the electro-optical circuit board comprises a layer structure comprising a metallic layer and an optically transparent layer;

the electro-optical circuit board further comprises a cutout of the metallic layer; and

the cutout is in the optical beam path.

12. The system of claim 1 , wherein the optical beam path comprises a branching junction.

13. The system of claim 1 , wherein at least one of the following holds:

the optical beam path is configured to provide a vertical optical coupling to the photonic integrated circuit; and

the optical beam path is configured to provide a lateral optical coupling to the photonic integrated circuit.

14. The system of claim 1 , wherein the electro-optical circuit board further comprises an optoelectronic element configured to provide a coupling of electrical conductor track to the optical beam path.

15. The system of claim 1 , wherein the electrical conductor track comprises:

an electrical contact at the first side of the electro-optical circuit board; and

an electrical test tip at a second side of the electro-optical circuit board, the second side being opposite the first side.

16. The system of claim 1 , wherein an average distance between electrical and optical coupling points on the first side of the electro-optical circuit board is greater than an average distance between electrical and optical coupling points on a second side of the electro-optical circuit board, the second side being opposite the first side.

17. The system of claim 1 , wherein at least one member selected from the group consisting of the optical testing device and an electrical testing device is configured to:

optically contact the photonic integrated circuit via a light beam transmitted along the optical beam path; and

electrically contact the photonic integrated circuit via electrical signals transmitted along the electrical conductor track.

18. The system of claim 17 , wherein the at least one member is configured to test, based on the light beam and the electrical signals: an electrical functionality of the photonic integrated circuit; an optical functionality of the photonic integrated circuit; and/or an interaction between the optical and electrical functionalities of the photonic integrated circuit.

19. The system of claim 1 , further comprising the photonic integrated circuit.

20. A method, comprising;

electrically contacting a photonic integrated circuit via an electrical conductor track extending between first and second sides of an electro-optical circuit board; and

optically contacting the photonic integrated circuit via an optical beam path extending between the first and second sides of the electro-optical circuit board,

wherein optically contacting comprises moving a scanning device to:

i) deliver light from the scanning device to different locations on the first side of the electro-optical circuit board; and/or

ii) deliver light from different locations on the first side of the electro-optical circuit board to the scanning device.

21. The method of claim 20 , further comprising driving the scanning device to position an optical aperture for the light beam with respect to a plurality of optical coupling points on the first side of the electro-optical circuit board.

22. The method of claim 20 , further comprising driving the scanning device to position an optical aperture for the light beam within an optical coupling point on the first side of the electro-optical circuit board.

23. The method of claim 20 , further comprising, based on electrically contacting and optically contacting, testing at least one member selected from the group consisting of an electrical functionality of the photonic integrated circuit, an optical functionality of the photonic integrated circuit, and an interaction between the optical and electrical functionalities of the photonic integrated circuit.

24. The method of claim 20 , wherein the scanning device comprises at least one member selected from the group consisting of a moveable scanner mirror and a spatial light modulator.

25. The method of claim 20 , wherein the scanning device comprises further comprises at least one member selected from the group consisting of a lens in the optical beam path and a deflection element in the optical beam path.