Module and equipment
A module includes a first wiring board, a first integrated circuit component mounted on the first wiring board, a second wiring board overlapping with the first wiring board, a second integrated circuit component mounted on the second wiring board, and a connection member disposed between the first wiring board and the second wiring board and configured to electrically connect the first wiring board and the second wiring board, wherein the second integrated circuit component overlaps with the first wiring board and supplies power to the first integrated circuit component via the connection member.
1. A module comprising:
a first wiring board;
a first integrated circuit component mounted on the first wiring board;
a second wiring board overlapping with the first wiring board;
a second integrated circuit component mounted on the second wiring board; and
a connection member disposed between the first wiring board and the second wiring board and configured to electrically connect the first wiring board and the second wiring board,
wherein the second integrated circuit component overlaps with the first wiring board, and
wherein the second integrated circuit component supplies power to the first integrated circuit component via a wiring path of the connection member, the wiring path being disposed within a space between the first wiring board and the second wiring board.
2. The module according to claim 1 , wherein the second integrated circuit component overlaps with the first integrated circuit component.
3. The module according to claim 1 , wherein the connection member includes a first wire and a second wire, the first wire being configured to supply a power supply potential from the second integrated circuit component to the first integrated circuit component, the second wire being configured to supply a ground potential from the second integrated circuit component to the first integrated circuit component, and
wherein the first wire and the second wire are arranged within a space between the first wiring board and the second wiring board.
4. The module according to claim 3 , wherein a distance between the first wire and the second wire is smaller than a size of the first integrated circuit component.
5. The module according to claim 4 , wherein the distance is less than or equal to 1/10 of the size.
6. The module according to claim 3 , wherein a distance between the first wire and the second wire is smaller than a distance between the first wiring board and the second wiring board.
7. The module according to claim 1 , further comprising a third integrated circuit component mounted on the second wiring board,
wherein the third integrated circuit component is arranged between the first wiring board and the second wiring board, and
wherein a gap is interposed between the second integrated circuit component and the first wiring board.
8. The module according to claim 1 , wherein the second integrated circuit component is disposed between the first wiring board and the second wiring board, and
wherein the first wiring board is disposed between the first integrated circuit component and the second wiring board.
9. The module according to claim 1 , wherein the second wiring board is disposed between the second integrated circuit component and the first wiring board, and
wherein at least one of the first wiring board and the second wiring board is disposed between the first integrated circuit component and the second integrated circuit component.
10. The module according to claim 1 , wherein when the power is supplied, a temperature of the first integrated circuit component is higher than a temperature of the second integrated circuit component.
11. The module according to claim 1 , wherein the first integrated circuit component includes an analog circuit.
12. The module according to claim 1 , wherein the first integrated circuit component is one of an image capturing device and a display device.
13. A module comprising:
a first wiring board;
a first integrated circuit component mounted on the first wiring board;
a second wiring board overlapping with the first wiring board;
a second integrated circuit component mounted on the second wiring board; and
a connection member disposed between the first wiring board and the second wiring board and configured to electrically connect the first wiring board and the second wiring board,
wherein the second integrated circuit component overlaps with the first wiring board,
wherein the second integrated circuit component supplies power to the first integrated circuit component via the connection member,
wherein the connection member and the first wiring board are connected with solder arranged between the first wiring board and the second wiring board, and
wherein the connection member and the second wiring board are connected with solder arranged between the first wiring board and the second wiring board.
14. The module according to claim 13 , further comprising a third integrated circuit component mounted on the second wiring board.
15. The module according to claim 14 , wherein the third integrated circuit component is a storage device.
16. The module according to claim 14 , wherein the second integrated circuit component supplies power to the third integrated circuit component.
17. The module according to claim 13 , wherein a passive component is mounted on the second wiring board, and wherein the passive component is arranged between the first wiring board and the second wiring board.
18. The module according to claim 13 , wherein the connection member includes a portion made of glass epoxy resin.
19. The module according to claim 1 , wherein the connection member includes a portion made of thermosetting resin.
20. A module comprising:
a first wiring board;
a first integrated circuit component mounted on the first wiring board;
a second wiring board overlapping with the first wiring board;
a second integrated circuit component mounted on the second wiring board; and
a connection member disposed between the first wiring board and the second wiring board and configured to electrically connect the first wiring board and the second wiring board,
wherein the second integrated circuit component overlaps with the first wiring board and supplies power to the first integrated circuit component via the connection member,
wherein the connection member includes a conductor portion and an insulator portion configured to support the conductor portion,
wherein the conductor portion includes a first conductive portion, a second conductive portion, and a third conductive portion along a first direction in which the first wiring board and the second wiring board overlap with each other, the third conductive portion being disposed between the first conductive portion and the second conductive portion,
wherein the first conductive portion is connected to the first wiring board via a first conductive member, and the second conductive portion is connected to the first second wiring board via a second conductive member, and
wherein in a second direction perpendicular to the first direction, the first conductive portion is disposed between the first conductive member and the insulator portion, and the second conductive portion is disposed between the second conductive member and the insulator portion.
21. The module according to claim 20 , further comprising:
a separation portion disposed between the first conductive member and the second conductive member in the first direction,
wherein in the second direction, the third conductive portion is disposed between the separation portion and the insulator portion.
22. The module according to claim 21 , wherein each of the first conductive member and the second conductive member is a solder fillet and the separation portion is a solder resist.
23. Equipment comprising:
a module according to claim 1 ;
a third wiring board; and
a connection component configured to electrically connect the module and the third wiring board,
wherein the connection component has flexibility.
24. Equipment comprising:
a module according to claim 1 ; and
a coil.
25. Equipment comprising:
a module according to claim 1 ; and
at least one of:
a semiconductor device manufactured using a 1 to 4 nm process;
a communication apparatus configured to perform communication using terahertz waves; and
an all-solid-state battery.
26. The module according to claim 13 ,
wherein the first integrated circuit component and the first wiring board are connected with a bonding wire, and
wherein the second integrated circuit component and the second wiring board are connected with solder.
27. The module according to claim 13 ,
wherein at least one of the first wiring board and the second wiring board is disposed between the first integrated circuit component and the second integrated circuit component.
28. The module according to claim 1 ,
wherein the second integrated circuit component includes a linear regulator or a direct current (DC)-to-DC converter.
29. Equipment comprising:
a module according to claim 13 ;
a third wiring board; and
a connection component configured to electrically connect the module and the third wiring board,
wherein the connection component has flexibility.
30. Equipment comprising:
a module according to claim 20 ;
a third wiring board; and
a connection component configured to electrically connect the module and the third wiring board,
wherein the connection component has flexibility.