Silicate glass compositions useful for the efficient production of through glass vias
Disclosed herein are glass compositions that present several advantages over glasses and other materials currently used for redistribution layers for RF, interposers, and similar applications. The glasses disclosed herein are low cost, flat glasses that have high throughput for the laser damage and etching process used to create through glass vias (TGV). TGV generated using the silicate glasses and processes described herein have large waist diameters (D w ), which is a desirable feature with respect to producing glass articles such as interposers.
1. A silicate glass article comprising one or more of through glass vias, wherein
(a) the through glass via has a first surface diameter (D S1 ), a second surface diameter (D S2 ), and a waist diameter (D w ), wherein the ratio of D S1 /D w is from 1:1 to 2:1 and the ratio of D S2 /D w is from 1:1 to 2:1, and
(b) the silicate glass comprises:
(1) B 2 O 3 in an amount of at least 5 mol %;
(2) the presence of Al 2 O 3 and RO, wherein Al 2 O 3 is in an amount of less than 10 mol % and RO in a total amount of less than 10 mol %, wherein R is Mg, Ca, Ba, Sr, or any combination thereof, and
(3) P 2 O 5 in an amount of 1 mol % to 10 mol %,
wherein the silicate glass is alkali free and does not include TiO 2 .
2. The article of claim 1 , wherein the amount of B 2 O 3 in the silicate glass is from 5 mol % to 30 mol %.
3. The article of claim 2 , wherein the amount of B 2 O 3 in the silicate glass is from 5 mol % to 20 mol %.
4. The article of claim 1 , wherein
the amount of Al 2 O 3 in the silicate glass is from 1 mol % to 5 mol %.
5. The article of claim 1 , wherein
the total amount of RO in the silicate glass is from 1 mol % to 5 mol %.
6. The article of claim 1 , wherein
the amount of Al 2 O 3 in the silicate glass is from 1 mol % to 5 mol % and
the total amount of RO in the silicate glass is from 1 mol % to 5 mol %.
7. The article of claim 1 , wherein the silicate glass comprises the B 2 O 3 in the amount an amount of at least 5 mol %, and
wherein the silicate glass further comprises:
SiO 2 in an amount of 50 mol % to 75 mol %,
Al 2 O 3 in an amount of 4 mol % to less than 10 mol %,
MgO in an amount of 0 mol % to less than 10 mol %,
CaO in an amount of 0 mol % to less than 10 mol %,
SrO in an amount of 0 mol % to less than 10 mol %,
BaO in an amount of 0 mol % to less than 10 mol %, and
P 2 O 5 in an amount of 1 mol % to 10 mol %.
8. The article of claim 1 , wherein the first surface diameter (D S1 ) is from 10 μm to 100 μm and the second surface diameter (D S2 ) is from 10 μm to 100 μm.
9. The article of claim 1 , wherein the article has a thickness from 50 μm to 500 μm.
10. A method for producing the silicate glass article of claim 1 , the method comprising:
(1) irradiating the silicate glass article with a non-diffracting laser beam to form a laser beam focal line, induced absorption occurring within the laser beam focal line to produce a damage track, wherein the glass article comprises:
(a) B 2 O 3 in an amount of at least 5 mol %; and
(b) the presence of Al 2 O 3 and RO, wherein Al 2 O 3 is in an amount of less than 10 mol % and RO in a total amount of less than 10 mol %, wherein R is Mg, Ca, Ba, Sr, or any combination thereof, and
(c) P 2 O 5 in an amount of 1 mol % to 10 mol %,
wherein the silicate glass is alkali free and does not include TiO 2 , and
(2) etching the irradiated silicate glass article with an etching solution to produce the through glass via, the etching solution comprising an acid.
11. The method of claim 10 , wherein the non-diffracting laser beam is formed with a picosecond laser.
12. The method of claim 10 , wherein the non-diffracting laser beam has a wavelength of greater than 500 nm.
13. The method of claim 10 , wherein the non-diffracting laser beam has a wavelength greater than 500 nm to 1,100 nm and a power from 40 μJ to 120 μJ.
14. The method of claim 10 , wherein the etching solution comprises hydrofluoric acid and water, wherein the hydrofluoric acid has a concentration of from 1 wt % to 50 wt %.
15. The method of claim 10 , wherein the etching solution comprises hydrofluoric acid in combination with hydrochloric acid, sulfuric acid, nitric acid, acetic acid, or any combination thereof.
16. The method of claim 10 , wherein the non-diffracting laser beam is a Bessel beam or a Gauss-Bessel beam.
17. The method of claim 10 , wherein the etching produces an etched byproduct, wherein the etched byproduct has an etched byproduct solubility greater than or equal to 0.5 g/L in the etching solution.
18. The method of claim 17 , wherein the etching solution comprises water, HF at a concentration of 0.1 M to 3.0 M, and HNO 3 at a concentration of 0.1 M to 3.0 M.
19. A silicate glass article produced by the method of claim 10 .