Method for manufacturing light-emitting device

1. A method for manufacturing a light-emitting device provided with, on a substrate, a light-emitting element including a first electrode, a second electrode, and a quantum dot layer interposed between the first electrode and the second electrode, the method comprising:

forming the quantum dot layer,

the forming the quantum dot layer including

performing first application that involves applying a first solution containing a plurality of first quantum dots each including a first core and a first shell with which the first core is coated, a first ligand to coordinate with each of the plurality of first quantum dots, and a first solvent on a position overlapping with the substrate,

performing first light irradiation, subsequent to the performing first application, that involves irradiating with light using a first photomask, from above the substrate, the position where the first solution is applied, and forming a first exposure region exposed by the first light irradiation in which the first ligand melts and the first solvent vaporizes, and a first non-exposure region at a position different from a position exposed by the first light irradiation,

performing first cooling, subsequent to the performing first light irradiation, that involves lowering a temperature of the first quantum dot to a temperature equal to or lower than a melting point of the first ligand and solidifying the first ligand, and

performing first removal, subsequent to the performing first cooling, that involves washing an upper layer relative to the substrate with the first solvent to remove the first solution in the first non-exposure region.

2. The method for manufacturing the light-emitting device according to claim 1 ,

wherein the forming the quantum dot layer further includes

performing second application, subsequent to the performing first removal, that involves applying a second solution containing a plurality of second quantum dots each including a second core and a second shell with which the second core is coated, a second ligand to coordinate with each of the plurality of second quantum dots, and a second solvent on a position overlapping with the substrate,

performing second light irradiation, subsequent to the performing second application, that involves irradiating with light using a second photomask, from above the substrate, the position where the second solution is applied, and forming a second exposure region exposed by the second light irradiation in which the second ligand melts and the second solvent vaporizes, and a second non-exposure region at a position different from a position exposed by the second light irradiation,

performing second cooling, subsequent to the performing second light irradiation, that involves lowering a temperature of the second quantum dot to a temperature equal to or lower than a melting point of the second ligand and solidifying the second ligand, and

performing second removal, subsequent to the performing second cooling, that involves washing an upper layer relative to the substrate with the second solvent to remove the second solution in the second non-exposure region.

3. The method for manufacturing the light-emitting device according to claim 2 ,

wherein the forming the quantum dot layer further includes

performing third application, subsequent to the performing second removal, that involves applying a third solution containing a plurality of third quantum dots each including a third core and a third shell with which the third core is coated, a third ligand to coordinate with each of the plurality of third quantum dots, and a third solvent on a position overlapping with the substrate,

performing third light irradiation, subsequent to the performing third application, that involves irradiating with light using a third photomask, from above the substrate, the position where the third solution is applied, and forming a third exposure region exposed by the third light irradiation in which the third ligand melts and the third solvent vaporizes, and a third non-exposure region at a position different from a position exposed by the third light irradiation,

performing third cooling, subsequent to the performing third light irradiation, that involves lowering a temperature of the third quantum dot to a temperature equal to or lower than a melting point of the third ligand and solidifying the third ligand, and

performing third removal, subsequent to the performing third cooling, that involves washing an upper layer relative to the substrate with the third solvent to remove the third solution in the third non-exposure region.

4. The method for manufacturing the light-emitting device according to claim 3 ,

wherein the first exposure region, the second exposure region, and the third exposure region respectively correspond to a plurality of light-emitting elements having mutually different luminescent colors.

5. The method for manufacturing the light-emitting device according to claim 3 ,

wherein each of the first exposure region, the second exposure region, and the third exposure region corresponds to any of a red light-emitting element, a green light-emitting element, and a blue light-emitting element.

6. The method for manufacturing the light-emitting device according to claim 5 ,

wherein diameters of the first core, the second core, and the third core are different from each other.

7. The method for manufacturing the light-emitting device according to claim 6 ,

wherein, among the cores including the first core, the second core, and the third core, the diameter of the core at a position that overlaps with the exposure region corresponding to the green light-emitting element is smaller than the diameter of the core at a position that overlaps with the exposure region corresponding to the red light-emitting element and is greater than the diameter of the core at a position that overlaps with the exposure region corresponding to the blue light-emitting element.

8. The method for manufacturing the light-emitting device according to claim 5 ,

wherein irradiation energies of light irradiation in the performing first light irradiation, the performing second light irradiation, and the performing third light irradiation differ from each other.

9. The method for manufacturing the light-emitting device according to claim 8 ,

wherein the irradiation energy of light irradiation onto the exposure region corresponding to the green light-emitting element is greater than the irradiation energy of light irradiation onto the exposure region corresponding to the red light-emitting element and is smaller than the irradiation energy of light irradiation onto the exposure region corresponding to the blue light-emitting element.

10. The method for manufacturing the light-emitting device according to claim 3 ,

herein the first quantum dot, the second quantum dot, and the third quantum dot absorb emitted light and generate heat in the performing first light irradiation, the performing second light irradiation, and the performing third light irradiation, respectively.

11. The method for manufacturing the light-emitting device according to claim 3 ,

wherein the forming the quantum dot layer further includes

individually forming electrodes each including a reflective metal thin film on a surface of the electrode at positions that respectively overlap with the first exposure region, the second exposure region, and the third exposure region, prior to the performing first application.

12. The method for manufacturing the light-emitting device according to claim 3 ,

wherein the forming the quantum dot layer further includes,

individually forming electrodes each including an oxide semiconductor film on a surface of the electrode at positions that respectively overlap with the first exposure region, the second exposure region, and the third exposure region, prior to the performing first application.

13. The method for manufacturing the light-emitting device according to claim 12 ,

wherein the oxide semiconductor film absorbs emitted light and generates heat in each of the performing first light irradiation, the performing second light irradiation, and the performing third light irradiation.

14. The method for manufacturing the light-emitting device according to claim 1 ,

wherein a melting point of the ligand is lower than or equal to a boiling point of the solvent, and the solvent vaporizes after the ligand melts in any of the performing light irradiation in the forming the quantum dot layer.

15. The method for manufacturing the light-emitting device according to claim 1 ,

wherein the melting point of the ligand is higher than the boiling point of the solvent, and the ligand melts after the solvent vaporizes in any of the performing light irradiation in the forming the quantum dot layer.