Distal end frame of endoscope, distal end unit, and endoscope
A distal end frame includes: a first distal end frame member that includes a resin molded product which constitutes a molded interconnect device; a housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened; a second distal end frame member that is composed of the resin molded product constituting the molded interconnect device, and is configured to close the one side of the housing chamber; a signal pattern that is the metal pattern formed in a region including a first joining surface which is a joining surface with the second distal end frame member, on a surface of the first distal end frame member; and a solder material which is configured to join the first distal end frame member and the second distal end frame member.
1. A distal end frame of an endoscope, comprising:
a first distal end frame member that comprises a resin molded product which constitutes a molded interconnect device having a metal pattern formed on a surface of the resin molded product;
a housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened;
a second distal end frame member that is joined to the first distal end frame member and closes the one side of the housing chamber;
one or more first metal patterns that are formed of the metal pattern constituting the molded interconnect device and are formed in a region including a joining portion with the second distal end frame member, on a surface of the first distal end frame member; and
a joining member configured to join the first distal end frame member and the second distal end frame member to each other.
2. The distal end frame of the endoscope according to claim 1 , further comprising:
a cable connection surface that is set on a notch-shaped step which is provided on a proximal end side of the first distal end frame member, wherein
the first metal patterns are extended from the joining portion with the second distal end frame member on the surface of the first distal end frame member, to the cable connection surface.
3. The distal end frame of the endoscope according to claim 1 , wherein
each of the first metal patterns comprises a signal pattern that is connected to a connection land provided in the housing chamber.
4. The distal end frame of the endoscope according to claim 1 , wherein
the second distal end frame member is formed of the resin molded product that constitutes the molded interconnect device, and
the distal end frame of the endoscope further comprises one or more second metal patterns that are each composed of the metal pattern constituting the molded interconnect device, and that are formed in a region including a joining portion with the first distal end frame member, on a surface of the second distal end frame member.
5. The distal end frame of the endoscope according to claim 4 , wherein
the first metal patterns and the second metal patterns comprise a first shield pattern and a second shield pattern which are configured to electromagnetically shield the housing chamber.
6. The distal end frame of the endoscope according to claim 5 , wherein
the joining member is a solder, and joins the first distal end frame member and the second distal end frame member to each other, by connecting at least a part of the first shield pattern and at least a part of the second shield pattern by solder.
7. The distal end frame of the endoscope according to claim 1 , further comprising:
a recessed portion that is formed in either one of the joining portion of the first distal end frame member with the second distal end frame member, and the joining portion of the second distal end frame member with the first distal end frame member; and
a salient portion that is formed on another of the owing portion of the first distal end frame member with the second distal end frame member, and the joining portion of the second distal end frame member with the first distal end frame member, and is fitted into the recessed portion.
8. The distal end frame of the endoscope according to claim 7 , further comprising:
a groove portion configured to absorb an excess of the joining member, in either one of the recessed portion and the salient portion.
9. A distal end unit of an endoscope, comprising:
a distal end frame, and an image pickup unit provided in a housing chamber, wherein
the distal end frame comprises: a first distal end frame member that comprises a resin molded product which constitutes a molded interconnect device having a metal pattern formed on a surface of the resin molded product; the housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened; a second distal end frame member that is joined to the first distal end frame member and closes the one side of the housing chamber; one or more first metal patterns that are formed of the metal pattern constituting the molded interconnect device and are formed in a region including a joining portion with the second distal end frame member, on a surface of the first distal end frame member; and a joining member configured to join the first distal end frame member and the second distal end frame member to each other.
10. An endoscope comprising:
a distal end frame, and an image pickup unit provided in a housing chamber, wherein
the distal end frame comprises: a first distal end frame member that comprises a resin molded product which constitutes a molded interconnect device having a metal pattern formed on a surface of the resin molded product; the housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened; a second distal end frame member that is joined to the first distal end frame member and closes the one side of the housing chamber; one or more first metal patterns that are formed of the metal pattern constituting the molded interconnect device and are formed in a region including a joining portion with the second distal end frame member, on a surface of the first distal end frame member; and a joining member configured to join the first distal end frame member and the second distal end frame member to each other.