Fin end plug structures for advanced integrated circuit structure fabrication
Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first isolation structure over a first end of a fin. A gate structure is over the fin and is spaced apart from the first isolation structure along the direction. A second isolation structure is over a second end of the fin, the second end opposite the first end. The second isolation structure is spaced apart from the gate structure. The first isolation structure and the second isolation structure both comprise a first dielectric material laterally surrounding a recessed second dielectric material distinct from the first dielectric material. The recessed second dielectric material laterally surrounds at least a portion of a third dielectric material different from the first and second dielectric materials.
1. An integrated circuit structure, comprising:
a nanowire along a direction;
a first isolation structure over a first end of the nanowire, wherein the first isolation structure has a top surface above the top of the nanowire;
a gate structure comprising a gate electrode completely surrounding a channel region of the nanowire, wherein the gate structure is spaced apart from the first isolation structure along the direction; and
a second isolation structure over a second end of the nanowire, the second end opposite the first end, the second isolation structure spaced apart from the gate structure along the direction, wherein the second isolation structure has a top surface above the top of the nanowire, and wherein the first isolation structure and the second isolation structure each comprise a first dielectric material laterally surrounding a second dielectric material distinct from the first dielectric material, the second dielectric material having an upper surface, and wherein the wherein the first isolation structure and the second isolation structure both further comprise a third dielectric material laterally surrounded by an upper portion of the first dielectric material, the third dielectric material on the upper surface of the second dielectric material, and the third dielectric material distinct from the first dielectric material and from the second dielectric material.
2. The integrated circuit structure of claim 1 , wherein the third dielectric material has an approximately vertical central seam.
3. The integrated circuit structure of claim 1 , wherein the third dielectric material does not have a seam.
4. The integrated circuit structure of claim 1 , wherein the first and second isolation structures induce a compressive stress on the nanowire.
5. The integrated circuit structure of claim 4 , wherein the gate electrode is a P-type gate electrode.
6. An integrated circuit structure, comprising:
a nanowire along a direction;
a first isolation structure over a first end of the nanowire, wherein the first isolation structure has a top surface above the top of the nanowire;
a gate structure comprising a gate electrode completely surrounding a channel region of the nanowire, wherein the gate structure is spaced apart from the first isolation structure along the direction; and
a second isolation structure over a second end of the nanowire, the second end opposite the first end, the second isolation structure spaced apart from the gate structure along the direction, wherein the second isolation structure has a top surface above the top of the nanowire, and wherein the first isolation structure and the second isolation structure each comprise a first dielectric material laterally surrounding a second dielectric material having a composition different than the first dielectric material, the second dielectric material having an upper surface, and wherein the wherein the first isolation structure and the second isolation structure both further comprise a third dielectric material laterally surrounded by an upper portion of the first dielectric material, the third dielectric material on the upper surface of the second dielectric material, and the third dielectric material having a composition different than the first dielectric material and the second dielectric material.
7. The integrated circuit structure of claim 6 , wherein the third dielectric material has an approximately vertical central seam.
8. The integrated circuit structure of claim 6 , wherein the third dielectric material does not have a seam.
9. The integrated circuit structure of claim 6 , wherein the first and second isolation structures induce a compressive stress on the nanowire.
10. The integrated circuit structure of claim 9 , wherein the gate electrode is a P-type gate electrode.
11. A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a nanowire along a direction;
a first isolation structure over a first end of the nanowire, wherein the first isolation structure has a top surface above the top of the nanowire;
a gate structure comprising a gate electrode completely surrounding a channel region of the nanowire, wherein the gate structure is spaced apart from the first isolation structure along the direction; and
a second isolation structure over a second end of the nanowire, the second end opposite the first end, the second isolation structure spaced apart from the gate structure along the direction, wherein the second isolation structure has a top surface above the top of the nanowire, and wherein the first isolation structure and the second isolation structure each comprise a first dielectric material laterally surrounding a second dielectric material distinct from the first dielectric material, the second dielectric material having an upper surface, and wherein the wherein the first isolation structure and the second isolation structure both further comprise a third dielectric material laterally surrounded by an upper portion of the first dielectric material, the third dielectric material on the upper surface of the second dielectric material, and the third dielectric material distinct from the first dielectric material and from the second dielectric material.
12. The computing device of claim 11 , further comprising:
a memory coupled to the board.
13. The computing device of claim 11 , further comprising:
a communication chip coupled to the board.
14. The computing device of claim 11 , further comprising:
a camera coupled to the board.
15. The computing device of claim 11 , wherein the component is a packaged integrated circuit die.
16. A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a nanowire along a direction;
a first isolation structure over a first end of the nanowire, wherein the first isolation structure has a top surface above the top of the nanowire;
a gate structure comprising a gate electrode completely surrounding a channel region of the nanowire, wherein the gate structure is spaced apart from the first isolation structure along the direction; and
a second isolation structure over a second end of the nanowire, the second end opposite the first end, the second isolation structure spaced apart from the gate structure along the direction, wherein the second isolation structure has a top surface above the top of the nanowire, and wherein the first isolation structure and the second isolation structure each comprise a first dielectric material laterally surrounding a second dielectric material having a composition different than the first dielectric material, the second dielectric material having an upper surface, and wherein the wherein the first isolation structure and the second isolation structure both further comprise a third dielectric material laterally surrounded by an upper portion of the first dielectric material, the third dielectric material on the upper surface of the second dielectric material, and the third dielectric material having a composition different than the first dielectric material and the second dielectric material.
17. The computing device of claim 16 , further comprising:
a memory coupled to the board.
18. The computing device of claim 16 , further comprising:
a communication chip coupled to the board.
19. The computing device of claim 16 , further comprising:
a camera coupled to the board.
20. The computing device of claim 16 , wherein the component is a packaged integrated circuit die.