Multiple cooling circuit systems and methods for using them
This disclosure relates generally to thermal management fluid systems. This disclosure relates more particularly to dielectric thermal management fluid systems useful in cooling electronic devices such as lithium-ion batteries, and methods of using such thermal management fluids.
1. A system comprising:
an electric heat source;
a first heat exchanger having a first portion and a second portion;
a first fluid circuit in substantial thermal contact with the electric heat source and configured to circulate a first thermal management fluid between the electric heat source and the first portion of the first heat exchanger, wherein the first fluid circuit is configured such that the first thermal management fluid can absorb heat from the electric heat source and can dissipate heat in the first heat exchanger; and
a second fluid circuit configured to pass a second thermal management fluid over the second portion of the first heat exchanger and absorb heat from the second portion of the first heat exchanger,
wherein
the second thermal management fluid comprises:
an aqueous carrier fluid; and
a dispersion of micelles within the aqueous carrier fluid, wherein each micelle comprises a solid hydrophobic core particle comprising a phase change material having a melting point in the range of 30° C. to 100° C. and one or more emulsifiers forming a micellar shell around the solid hydrophobic core particle.
2. The system of claim 1 , further comprising a second heat exchanger in substantial thermal contact with the second fluid circuit, the second heat exchanger being configured to dissipate heat from the second fluid circuit.
3. The system of claim 1 , wherein the first fluid circuit comprises an expansion chamber configured to receive a vapor from the first thermal management fluid.
4. The system of claim 3 , further comprising a third heat exchanger having a first portion and a second portion, where the first portion of the third heat exchanger is configured to absorb heat from the expansion chamber and the second portion of the third heat exchanger is configured to dissipate heat from the first portion of the third heat exchanger.
5. The system of claim 4 , wherein the second fluid circuit comprises the second portion of the third heat exchanger, wherein the second portion of the third heat exchanger is configured to receive the second thermal management fluid that can absorb heat from the expansion chamber through the second portion of the third heat exchanger and can dissipate heat in the second heat exchanger.
6. The system of claim 4 , further comprising a third fluid circuit configured to circulate a third thermal management fluid between the second portion of the third heat exchanger and a fourth heat exchanger, wherein the third fluid circuit is configured such that the third thermal management fluid can absorb heat from the expansion chamber through the second portion of the third heat exchanger and can dissipate heat in the fourth heat exchanger.
7. The system of claim 1 , wherein the first thermal management fluid comprises:
one or more dielectric fluids present in a total amount in the range of 65 wt/o to 99.9 wt %; and
one or more halocarbons each having a boiling point in the range of 30° C. to 150° C., present in a total amount in the range of 0.1 wt % to 35 wt %,
wherein the one or more halocarbons are homogeneously dispersed in the first thermal management fluid;
wherein the dielectric thermal management fluid has a dielectric constant of at least 1.5 at 25° C.; and
wherein a flash point of the first thermal management fluid is at least 90° C. measured in accordance with ASTM D56.
8. The system of claim 1 , wherein the second thermal management fluid comprises:
an aqueous carrier fluid; and
a dispersion of micelles within the aqueous carrier fluid, wherein each micelle comprises a solid hydrophobic core particle comprising a phase change material having a melting point in the range of 30° C. to 70 ° C. and one or more emulsifiers forming a micellar shell around the solid hydrophobic core particle.
9. A method comprising:
circulating a first thermal management fluid in a first fluid circuit and between an electrical heat source and a first portion of a first heat exchanger;
absorbing thermal energy in the first thermal management fluid from the electrical heat source;
dissipating thermal energy from the first thermal management fluid into the first heat exchanger; and
circulating a second thermal management fluid in a second fluid circuit and over a second portion of the first heat exchanger; and
absorbing heat from the first exchanger into the second thermal management fluid:
wherein the second thermal management fluid comprises:
an aqueous carrier fluid; and
a dispersion of micelles within the aqueous carrier fluid, wherein each micelle comprises a solid hydrophobic core particle comprising a phase change material having a melting point in the range of 30° C. to 100° C. and one or more emulsifiers forming a micellar shell around the solid hydrophobic core particle.
10. The method of claim 9 , further comprising
absorbing thermal energy in the second thermal management fluid from the first heat exchanger; and
dissipating thermal energy from the second thermal management fluid into a second heat exchanger.
11. The method of claim 9 , further comprising:
receiving a vapor from the first thermal management fluid in an expansion chamber of the first fluid circuit.
12. The method of claim 9 , wherein the first thermal management fluid comprises one or more halocarbons and the thermal energy from the heat source is absorbed by vaporizing one or more of the halocarbons of the first thermal management fluid.
13. The method of claim 9 , wherein the first thermal management fluid comprises:
one or more dielectric fluids present in a total amount in the range of 65 wt % to 99.9 wt %; and
one or more halocarbons each having a boiling point in the range of 30° C. to 150° C., present in a total amount in the range of 0.1 wt % to 35 wt %,
wherein the one or more halocarbons are homogeneously dispersed in the first thermal management fluid;
wherein the dielectric thermal management fluid has a dielectric constant of at least 1.5 at 25° C.; and
wherein a flash point of the first thermal management fluid is above the boiling point of the one or more halocarbons.
14. The method of claim 13 , wherein the one or more dielectric fluids is selected from aliphatic dielectric fluids, aliphatic dielectric fluid oxygenations, aromatic dielectric fluids, aromatic dielectric fluid oxygenations, silicones, and any combination thereof.
15. The method of claim 13 , wherein each of the one or more halocarbons is selected from a fluorocarbon, chlorocarbon, and chlorofluorocarbon.
16. The method of claim 9 , wherein the dispersion of micelles have a d50 value in the range of 0.1 to 1.5 μm.
17. The method of claim 9 , wherein the dispersion of micelles have a d10 that is no less than 75% of the d50 and a d90 that is no more than 125% of the d50.