Method of forming an etched part and a method of forming a metal plated part
A method of forming an etched part includes forming a substrate including a thermoset resin and etching a surface of the substrate. The thermoset resin includes a vat photopolymerization (VPP) thermoset resin and at least one of an etchable phase and etchable particles disposed within the VPP thermoset resin. The etching removes the etchable phase from the VPP thermoset resin at the surface of the substrate such that a plurality of micro-mechanical bonding sites are formed on an etched surface of the substrate.
1. A method of forming an etched part, the method comprising:
forming a substrate comprising a thermoset resin, the thermoset resin comprising a vat photopolymerization (VPP) thermoset resin and at least one of an etchable phase and etchable particles disposed within the VPP thermoset resin; and
etching a surface of the substrate,
wherein the etching removes the etchable phase from the VPP thermoset resin at the surface of the substrate such that a plurality of micro-mechanical bonding sites is formed on an etched surface of the substrate.
2. The method according to claim 1 , wherein the forming the substrate includes forming, layer-by-layer, an additively manufactured part.
3. The method according to claim 2 further comprising curing each layer of thermoset resin after depositing each layer of thermoset resin.
4. The method according to claim 2 , wherein the forming the substrate comprises one of stereolithography additive manufacturing, digital light processing additive manufacturing, and continuous liquid interface production additive manufacturing.
5. The method according to claim 1 , wherein the VPP thermoset resin comprises at least one monomer, at least one oligomer, and at least one photo initiator.
6. The method according to claim 5 , wherein the at least one monomer is selected from the group consisting of a (meth)acrylate monomer and a vinyl ether.
7. The method according to claim 6 , wherein the (meth)acrylate monomer comprises at least one of a monofunctional monomer, a difunctional monomer, and a multifunctional monomer, and wherein the vinyl ether comprises at least one of diethylene glycol divinyl ether (DEGDE), cyclohexane dimethanol divinyl ether (CHDMDE), and triethylene glycol divinyl ether (TEGDE).
8. The method according to claim 5 , wherein the at least one oligomer comprises at least one acrylated oligomer selected from the group consisting of polyurethane (meth)acrylate, polyether (meth)acrylate, polyester (meth)acrylate, epoxy (meth)acrylate, phenolic (meth)acrylate, amino (meth)acrylate, and silicone (meth) acrylate.
9. The method according to claim 1 , wherein the etchable phase comprises a resin phase selected from the group consisting of polybutadiene (meth)acrylate, polyisoprene (meth)acrylate, polychloroprene (meth)acrylate, unsaturated polyester (meth)acrylate, and alkyd (meth)acrylate.
10. The method according to claim 1 , wherein the thermoset resin comprises both an etchable phase and etchable particles disposed within the VPP thermoset resin.
11. The method according to claim 1 , wherein the etchable particles comprise at least one of metal particles, metal oxide particles, and metal carbonate particles.
12. The method according to claim 11 , wherein the metal particles comprise at least one of iron and aluminum, the metal oxide particles comprise at least one of alumina, magnesium oxide, and zinc oxide, and the metal carbonate particles comprise at least one of calcium carbonate, barium carbonate, and magnesium carbonate.
13. The method according to claim 1 , wherein the etching comprises using an etchant, and wherein the etchant comprises at least one of oxidizing acid solutions and chromic acid etchants.
14. The method according to claim 1 further comprising bonding a metal layer to the etched surface of the substrate.
15. A method of forming a metal plated part comprising:
forming a substrate via vat photopolymerization (VPP), wherein the substrate comprises a thermoset resin with an etchable phase disposed therein;
etching a surface of the substrate to remove at least a portion of the etchable phase proximate the surface of the substrate and to form a plurality of micro-mechanical locking sites at the surface of the substrate; and
forming a metal layer on the etched surface of the substrate, such that the metal layer is bonded to the etched surface of the substrate at the plurality of micro-mechanical locking sites.
16. The method according to claim 15 , wherein forming the metal layer comprises at least one of electroplating, electroless plating, physical vapor deposition (PVD), vacuum metallization, and spray metal coating.
17. The method according to claim 15 , wherein the metal layer is selected from the group consisting of of a chromium layer, a chromium alloy layer, a nickel layer, a nickel alloy layer, a copper layer, a copper alloy layer, an aluminum layer, an aluminum alloy layer, and combinations thereof.
18. The method according to claim 15 , wherein at least a portion of the metal layer is encapsulated within the etched surface of the substrate.
19. The method according to claim 15 , wherein the thermoset resin comprises a mixture of monomers, oligomers, and photoinitiators.
20. The method according to claim 15 , wherein the etchable phase comprises at least one of organic particles, organic resins, inorganic particles, and copolymers of the thermoset resin.