Mechanical architecture for a multi-chip module

1. A multi-chip module comprising:

a Redistribution Layer (RDL) substrate;

a first plurality of Integrated Circuit (IC) dies mounted to a first surface of the RDL substrate;

a second plurality of IC dies mounted to an opposite second surface;

a plurality of sockets mounted upon the second plurality of IC dies;

a cold plate mounted to the first plurality of IC dies; and

a mounting structure comprising:

a plurality of socket frames coupled to the plurality of sockets;

a plurality of holes formed through the RDL substrate;

a plurality of screws extending from the plurality of socket frames through the plurality of holes formed through the RDL substrate and screwed into the cold plate.

2. The multi-chip module of claim 1 , wherein the RDL substrate is formed in a semi-conductor manufacturing process.

3. The multi-chip module of claim 1 , wherein each socket frame of the plurality of socket frames services a single socket.

4. The multi-chip module of claim 1 , wherein each socket frame of the plurality of socket frames services at least two sockets.

5. The multi-chip module of claim 1 , further comprising a plurality of Voltage Regulator Modules (VRMs) mounted into the plurality of sockets.

6. The multi-chip module of claim 1 , wherein the second IC dies comprise embedded capacitor arrays.

7. A method of mounting a multi-chip module to a substrate, comprising:

mounting a plurality of integrated circuit dies onto a first surface of a redistribution layer;

encapsulating the mounted integrated circuit dies;

attaching a floating frames or molded socket, or both onto an integrated circuit on the redistribution layer;

mounting a thermal interface module onto the encapsulated IC dies; and

installing a cold plate directly onto the thermal interface module.

8. The method of claim 7 , further comprising securing the sockets to the substrate with screws.

9. The method of claim 7 , further comprising adding voltage regulator modules onto the substrate.