Electrical connection structure and electronic device comprising the same
An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.
1. An electrical connection structure configured to electrically connect an array substrate and a circuit substrate, comprising:
a through hole at least partially formed in the array substrate having a first end and a second end;
a first pad at least partially surrounding the first end of the through hole and electrically connected to a first circuit;
a second pad located at the second end of the through hole and electrically connected to a second circuit; and
a conductive bridge electrically connecting the first pad and the second pad through the through hole, thereby making the first circuit and the second circuit electrically connected to each other, wherein the through hole exposes a portion of a top surface of the circuit substrate, and the conductive bridge has a first portion disposed in the through hole and has a second portion covering a part of a top part of the first pad, and wherein the second portion has a width greater than a width of the through hole, and the width of the second portion is defined as a width at a position that the conductive bridge contacts the top part of the first pad.
2. The electrical connection structure as claimed in claim 1 , wherein the first pad completely surrounds the first end of the through hole to form a closed ring.
3. The electrical connection structure as claimed in claim 1 , wherein the first pad partially surrounds the first end of the through hole to form an unclosed structure.
4. The electrical connection structure as claimed in claim 1 , wherein the first pad and the second pad comprise copper, nickel or gold.
5. The electrical connection structure as claimed in claim 1 , wherein the electrical connection structure electrically connects a first electronic component and a second electronic component.
6. The electrical connection structure as claimed in claim 5 , wherein the first electronic component comprises the array substrate carrying the first circuit, and the first pad is formed on the array substrate.
7. The electrical connection structure as claimed in claim 6 , wherein the second electronic component comprises the circuit substrate carrying the second circuit, and the second pad is formed on the circuit substrate.
8. The electrical connection structure as claimed in claim 5 , further comprising an adhesive layer disposed between the first electronic component and a second electronic component.
9. The electrical connection structure as claimed in claim 8 , wherein the through hole penetrates the adhesive layer.
10. The electrical connection structure as claimed in claim 1 , wherein the conductive bridge comprises gold, copper or solder paste.
11. An electronic device, comprising:
an electrical connection structure configured to electrically connect an array substrate and a circuit substrate, comprising:
a through hole at least partially formed in the array substrate having a first end and a second end;
a first pad at least partially surrounding the first end of the through hole and electrically connected to a first circuit;
a second pad located at the second end of the through hole and electrically connected to a second circuit; and
a conductive bridge electrically connecting the first pad and the second pad through the through hole, thereby making the first circuit and the second circuit electrically connected to each other, wherein the through hole exposes a portion of a top surface of the circuit substrate, and the conductive bridge has a first portion disposed in the through hole and has a second portion covering a part of a top part of the first pad, and wherein the second portion has a width greater than a width of the through hole, and the width of the second portion is defined as a width at a position that the conductive bridge contacts the top part of the first pad.
12. The electronic device as claimed in claim 11 , wherein the second pad is formed on the circuit substrate.
13. The electronic device as claimed in claim 12 , further comprising at least one light-emitting unit, wherein the at least one light-emitting unit is electrically connected to the circuit substrate through the electrical connection structure.
14. The electronic device as claimed in claim 13 , wherein the at least one light-emitting unit comprises an organic light-emitting diode (OLED).
15. The electronic device as claimed in claim 13 , wherein the at least one light-emitting unit comprises a light-emitting diode (LED).