Substrate treating apparatus and substrate treating method

1. An apparatus for treating a substrate, the apparatus comprising:

a first process chamber to apply an organic solvent to a substrate applied with a developer and introduced; and

a second process chamber to treat the substrate applied with the organic solvent and introduced, through a supercritical fluid,

wherein the organic solvent further includes a surfactant, and

wherein the surfactant is a sorbitan ester that has more tails than sorbitan monooleate (Span80) or has a tail having a length longer than a length of a tail of sorbitan monooleate (Span80).

2. The apparatus of claim 1 , wherein a first process fluid, which is pure water, is applied to the substrate before applying the organic solvent in the first process chamber.

3. The apparatus of claim 2 , wherein the organic solvent includes:

a second process solvent applied to the substrate after applying the pure water; and

a third process fluid applied to the substrate after applying the second process solvent.

4. The apparatus of claim 3 , wherein the second process solvent is provided with a non-polar solvent.

5. The apparatus of claim 3 , wherein the second process solvent and the third process fluid are provided with hydrophobic organic solvents.

6. The apparatus of claim 1 , wherein the surfactant has a Hydropilic-Lipophilic Balance in a range of 6 to 9.

7. The apparatus of claim 1 , wherein the sorbitan ester sorbitan trioleate (Span 85).

8. The apparatus of claim 1 , wherein the developer is used to develop a positive photoresist.

9. An apparatus for treating a substrate, the apparatus comprising:

a first process chamber;

a second process chamber;

a transfer robot provided between the first process chamber and the second process chamber to carry the substrate to the first process chamber or the second process chamber; and

a controller,

wherein the first process chamber includes:

a support unit to support and rotate the substrate; and

a nozzle unit including a nozzle to supply at least one of an organic solvent and pure water to the substrate supported by the support unit,

wherein the second process chamber includes:

a chamber to provide a treatment space for performing a supercritical process; and

a fluid supply unit to supply a supercritical fluid to the treatment space of the chamber, and

wherein the controller is configured to:

control the support unit and the nozzle unit with respect to a substrate applied with a developer in the first process chamber to supply the organic solvent to the substrate in a state that the substrate is rotated;

control the transfer robot to transfer the substrate, which is applied with the organic solvent, to the second process chamber; and

perform a control operation to treat the substrate applied with the organic solvent through the supercritical fluid, in the second process chamber,

wherein the organic solvent further includes a surfactant, and

wherein the surfactant is a sorbitan ester that has more tails than sorbitan monooleate (Span80) or has a tail having a length longer than a length of a tail of sorbitan monooleate (Span80).

10. The apparatus of claim 9 , wherein the pure water is applied to the substrate before applying the organic solvent in the first process chamber.

11. The apparatus of claim 10 , wherein the organic solvent includes:

a second process solvent applied to the substrate after applying the pure water; and

a third process fluid applied to the substrate after applying the second process solvent.

12. The apparatus of claim 11 , wherein the second process solvent and the third process fluid are provided with hydrophobic organic solvents.

13. The apparatus of claim 12 , wherein the first and second process solvent and the third process fluid include heptane or petroleum ether.

14. The apparatus of claim 9 , wherein the surfactant has a Hydropilic-Lipophilic Balance in a range of 6 to 9.