Method of manufacturing semiconductor devices and semiconductor devices
A semiconductor device includes a gate structure disposed over a channel region, and a source/drain region. The gate structure includes a gate dielectric layer over the channel region, a first work function adjustment layer, over the gate dielectric layer, a first shield layer over the first work function adjustment layer, a first barrier layer, and a metal gate electrode layer. The first work function adjustment layer is made up of n-type work function adjustment layer and includes aluminum. The first shield layer is made of at least one selected from the group consisting of metal, metal nitride, metal carbide, silicide, a layer containing one or more of F, Ga, In, Zr, Mn and Sn, and an aluminum containing layer having a lower aluminum concentration than the first work function adjustment layer.
1. A method of manufacturing a semiconductor device, comprising:
forming a gate dielectric layer over a channel region made of a semiconductor material;
forming a first shield layer over the gate dielectric layer;
forming a first work function adjustment layer over the first shield layer;
forming a second shield layer over the first work function adjustment layer;
forming a metal gate electrode layer over the first shield layer, wherein:
the first work function adjustment layer includes aluminum,
an aluminum content of the first work function adjustment layer is 67 atomic % to 86 atomic %, and
at least one of the first shield layer or the second shield layer includes one selected from the group consisting of a metal layer, a metal nitride layer comprising TaTiN, WN, WCN or MoN, a metal carbide layer, a silicide layer, and a layer containing Al and one or more of F, N, Ga, In, Zr, Mn and Sn.
2. The method of claim 1 , wherein at least one of the first shield layer or the second shield layer includes one selected from the group consisting of a Si layer, a Cr layer, a Mo layer and a Co layer, formed by a deposition method.
3. The method of claim 1 , wherein at least one of the first shield layer or the second shield layer includes one selected from the group consisting of a Si carbide layer, a Cr carbide layer, a Mo carbide layer and a Co carbide layer.
4. The method of claim 1 , wherein at least one of the first shield layer or the second shield layer includes one selected from the group consisting of a Ta silicide layer, a Ni silicide layer, a W silicide layer and a Mo silicide layer.
5. The method of claim 1 , wherein:
the first shield layer and the second shield layer include one selected from the group consisting of a metal layer, a metal nitride layer comprising TaTiN, WN, WCN or MoN, a metal carbide layer, and a silicide layer, and
the first shield layer is made of a same material as the second shield layer.
6. The method of claim 1 , wherein the first shield layer is formed by a deposition method.
7. The method of claim 1 , wherein the second shield layer is formed by a deposition method.
8. A method of manufacturing a semiconductor device, comprising:
forming a gate dielectric layer over a channel region made of a semiconductor material;
forming a first shield layer over the gate dielectric layer by a deposition method;
forming a first work function adjustment layer over the first shield layer;
forming a second shield layer over the first work function adjustment layer; and
forming a metal gate electrode layer over the first shield layer,
wherein the first work function adjustment layer includes aluminum, and
an aluminum content of the first work function adjustment layer is 67 atomic % to 86 atomic %.
9. The method of claim 8 , wherein the first shield layer includes one selected from the group consisting of a metal layer, a metal nitride layer comprising TaTiN, WN, WCN or MoN, a metal carbide layer, and a silicide layer.
10. The method of claim 9 , wherein a thickness of the first shield layer is in a range from 0.3 nm to 8 nm.
11. The method of claim 8 , wherein the first shield layer is formed by a deposition method selected from the group consisting of chemical vapor deposition, physical vapor deposition, atomic layer deposition, and plating.
12. The method of claim 8 , wherein the second shield layer is formed by a deposition method.
13. The method of claim 8 , wherein at least one of the first shield layer or the second shield layer includes one selected from the group consisting of a Ta silicide layer, a Ni silicide layer, a W silicide layer and a Mo silicide layer.
14. A method of manufacturing a semiconductor device, comprising:
forming a gate dielectric layer over a channel region made of a semiconductor material;
forming a first shield layer over the gate dielectric layer;
forming a first work function adjustment layer over the first shield layer;
forming a second shield layer over the first work function adjustment layer;
forming a metal gate electrode layer over the first shield layer, wherein:
the first work function adjustment layer includes aluminum,
the first shield layer is made of a different material than the second shield layer, and
a thickness of each of the first shield layer and the second shield layer is in a range from 0.3 nm to 8 nm.
15. The method of claim 14 , wherein each of the first shield layer and the second shield layer includes one selected from the group consisting of a metal layer, a metal nitride layer comprising TaTiN, WN, WCN or MoN, a metal carbide layer, and a silicide layer.
16. The method of claim 14 , wherein the first shield layer is formed by a deposition method.
17. The method of claim 14 , wherein the second shield layer is formed by a deposition method.
18. The method of claim 14 , wherein at least one of the first shield layer or the second shield layer includes one selected from the group consisting of a Ta silicide layer, a Ni silicide layer, a W silicide layer and a Mo silicide layer.
19. The method of claim 16 , wherein the first shield layer is formed by a deposition method selected from the group consisting of chemical vapor deposition, physical vapor deposition, atomic layer deposition, and plating.
20. The method of claim 17 , wherein the second shield layer is formed by a deposition method selected from the group consisting of chemical vapor deposition, physical vapor deposition, atomic layer deposition, and plating.