IP Library › Granted Patent US 11,980,009
Granted Patent B2
US 11,980,009 · App. 17/941,140 · Granted May 7, 2024

Liquid cooling high-density pluggable modules for a network element

Inventors: Behzad Mohajer (Vancouver, CA); Terence Graham (Manotick, CA); Peter Ajersch (Gloucester, CA); Bonnie L. Mack (Carp, CA); Marko Nicolici (Ottawa, CA); Michael Bishop (Ottawa, CA); Kamran Rahmani (Ottawa, CA); Simon J. Shearman (Carleton Place, CA); Daniel Rivaud (Ottawa, CA)
Assignee: Ciena Corporation
H05K7/20272H05K7/20254H05K7/20781G02B6/4261G02B6/4268
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Quick Facts
Patent No.
US 11,980,009
App. No.
17/941,140
Granted
May 7, 2024
Kind
B2
Abstract

A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

Claims (24)

1. A network element comprising:

one or more modules each supporting a plurality of pluggable modules each having a housing;

a first manifold and a second manifold each configured to connect and disconnect, when the housing is inserted into a corresponding module, to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit configured to cool the plurality of pluggable modules; and

a leak mitigation system including a sleeve that surrounds a liquid connection between the conduit and at least one of the first manifold and the second manifold, wherein the leak mitigation system is configured to detect a leak and raise an alarm to a network management system,

wherein the coldplate includes fluid connectors that are configured to blind mate and quickly connect and disconnect.

2. The network element of claim 1 , wherein the fluid connectors are configured as alignment pins for connecting the one or more modules to both electrical and liquid lines.

3. The network element of claim 1 , wherein the one or more modules include Integrated Tunable Laser Assemblies (ITLA).

4. The network element of claim 1 , wherein the plurality of pluggable modules are each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and the respective housing that has dimensions of any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

5. The network element of claim 1 , wherein the first manifold and the second manifold are in a stacked configuration.

6. The network element of claim 1 , wherein the one or more modules support the plurality of pluggable modules in a plurality of rows, and the network element includes the first manifold and the second manifold separately for each of the plurality of rows.

7. The network element of claim 1 , wherein the cooling fluid includes an electrically inert fluid that is either a single or two-phase flow.

8. The network element of claim 1 , wherein each of the plurality of pluggable modules includes: fluid connectors configured to connect to the first manifold and the second manifold, and electrical connectors.

9. The network element of claim 8 , wherein the fluid connectors are configured to align the electrical connectors.

10. The network element of claim 1 , wherein the conduit includes one or more bends or turns to form at least one of a bending, winding, tortuous, serpentine, or otherwise circuitous path.

11. The network element of claim 1 , further comprising a sensor configured to detect leakage of the cooling fluid in the network element.

12. The network element of claim 1 , wherein the sleeve includes an absorbent material that collects discharged liquid.

13. The network element of claim 1 , wherein the leak mitigation system guides leaks away from electrical connections.

14. The network element of claim 1 , wherein the leak mitigation system includes closing valves configured to prevent flow to any leak.

15. The network element of claim 1 , wherein the leak mitigation system includes a pressure sensor to detect a leak.

16. The network element of claim 1 , wherein the leak mitigation system includes the sleeve and one or more additional types of leak mitigation.

17. The network element of claim 1 , wherein the one or more modules further include a circuit that is cooled by the coldplate.

18. The network element of claim 17 , wherein the one or more modules further include a second circuit that is cooled by air cooling.

19. The network element of claim 1 , further comprising

a Cooling Distribution Unit (CDU) located at a rear of the network element and configured to connect to the first manifold and the second manifold.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2022
From: MOHAJER, BEHZAD; GRAHAM, TERENCE; AJERSCH, PETER; MACK, BONNIE L.; NICOLICI, MARKO; BISHOP, MICHAEL; RAHMANI, KAMRAN; SHEARMAN, SIMON J.; RIVAUD, DANIEL
To: CIENA CORPORATION
Reel/Frame 061297/0224 →
Continuity (4)
Continuation In Part 17071073 · Oct 15, 2020
Provisional Application 63039936 · Jun 16, 2020
Provisional Application 62915187 · Oct 15, 2019
Related Publication 20230039781A1 · Feb 9, 2023
Cited By (1)
US 12,419,010